• 제목/요약/키워드: Die Compensation

검색결과 47건 처리시간 0.024초

마이크로 금형 부품을 위한 마이크로 절삭가공 기술 (Micro cutting process technology for micro molds parts)

  • 하석재;박정연;김건희;윤길상
    • Design & Manufacturing
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    • 제13권1호
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    • pp.5-12
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    • 2019
  • In this paper, we studied the micro tool deflection, micro cutting with low temperature, and deformation of micro ribs caused by cutting forces. First, we performed an integrated machining error compensation method based on captured images of tool deflection shapes in micro cutting process. In micro cutting process, micro tool deflection generates very serious problems in contrast to macro tool deflection. To get the real images of micro tool deflection, it is possible to estimate tool deflection in cutting conditions modeled and to compensate for machining errors using an iterative algorithm correcting tool path. Second, in macro cutting fields, the cryogenic cutting process has been applied to cut the refractory metal but, the serious problem may be generated in micro cutting fields by the cryogenic environment. However, if the proper low temperature is applied to micro cutting area, the cooling effect of cutting heat is expected. Such effect can make the reduction of tool wear and burr formation. For verifying this passibility, the micro cutting experiment at low temperature was performed and SEM images were analyzed. Third, the micro pattern was deformed by the cutting forces and the shape error occurred in the sidewall multi-step cutting process were minimized. As the results, the relationship between the cutting conditions and the deformation of micro-structure during micro cutting process was investigated.

다점 프레스를 이용한 곡면 성형의 가공 정보 산출을 위한 IDA방법 (Application of IDA Method for Hull Plate Forming by Multi-Point Press Forming)

  • 윤종성;이장현;유철호;황세윤;이황범
    • 한국해양공학회지
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    • 제22권6호
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    • pp.75-82
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    • 2008
  • Flame bending has been extensively used in the shipbuilding industry for hull plate forming In flame bending it is difficult to obtain the desired shape because the residual deformation dependson the complex temperature distribution and the thermal plastic strain. Mechanical bending such as reconfigurable press forming multi-point press forming or die-less forming has been found to improve the automation of hull plateforming because it can more accurately control the desired shape than line heating. Multi-point forming is a process in which external forces are used to form metal work-pieces. Therefore it can be a flexible and efficient forming technique. This paper presents an optimal approach to determining the press-stroke for multi-point press forming of curved shapes. An integrated configuration of Finite element analysis (FEA) and spring-back compensation algorithm is developed to calculate the strokes of the multi-point press. Not only spring-back is modeled by elastic plastic shell elements but also an iterative algorithm to compensate the spring-back is applied to adjust the amount of pressing stroke. An iterative displacement adjustment (IDA) method is applied by integration of the FEA procedure and the spring-back compensation work. Shape deviation between the desired surface and deform£d plate is minimized by the IDA algorithm.

A Digital Readout IC with Digital Offset Canceller for Capacitive Sensors

  • Lim, Dong-Hyuk;Lee, Sang-Yoon;Choi, Woo-Seok;Park, Jun-Eun;Jeong, Deog-Kyoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권3호
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    • pp.278-285
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    • 2012
  • A digital readout IC for capacitive sensors is presented. Digital capacitance readout circuits suffer from static capacitance of sensors, especially single-ended sensors, and require large passive elements to cancel such DC offset signal. For this reason, to maximize a dynamic range with a small die area, the proposed circuit features digital filters having a coarse and fine compensation steps. Moreover, by employing switched-capacitor circuit for the front-end, correlated double sampling (CDS) technique can be adopted to minimize low-frequency device noise. The proposed circuit targeted 8-kHz signal bandwidth and oversampling ratio (OSR) of 64, thus a $3^{rd}$-order ${\Delta}{\Sigma}$ modulator operating at 1 MH was used for pulse-density-modulated (PDM) output. The proposed IC was designed in a 0.18-${\mu}m$ CMOS mixed-mode process, and occupied $0.86{\times}1.33mm^2$. The measurement results shows suppressed DC power under about -30 dBFS with minimized device flicker noise.

빠른 스위칭 시간과 저 위상잡음 특성을 가지는 PHS용 주파수 합성기의 설계 (A design of fast switching time, low phase noise PHS frequency synthesizer)

  • 정성규;정지훈;부영건;김진경;장석환;이강윤
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.499-500
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    • 2006
  • This paper presents a fast switching CMOS frequency synthesizer with a new coarse tuning method for PHS applications. To achieve the fast lock-time and the low phase noise performance, an efficient bandwidth control scheme is proposed. Charge pump up/down current mismatches are compensated with the current mismatch compensation block. Also, the proposed coarse tuning method selects the optimal tuning capacitances of the LC-VCO to optimize the phase noise and the lock-time. The measured lock-time is about $20{\mu}s$. This chip is fabricated with $0.25{\mu}m$ CMOS technology, and the die area is $0.7mm{\times}2.1mm$. The power consumption is 54mW at 2.7V supply voltage.

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Accurate Sub-1 V CMOS Bandgap Voltage Reference with PSRR of -118 dB

  • Abbasizadeh, Hamed;Cho, Sung-Hun;Yoo, Sang-Sun;Lee, Kang-Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권4호
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    • pp.528-533
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    • 2016
  • A low voltage high PSRR CMOS Bandgap circuit capable of generating a stable voltage of less than 1 V (0.8 V and 0.5 V) robust to Process, Voltage and Temperature (PVT) variations is proposed. The high PSRR of the circuit is guaranteed by a low-voltage current mode regulator at the central aspect of the bandgap circuitry, which isolates the bandgap voltage from power supply variations and noise. The isolating current mirrors create an internal regulated voltage $V_{reg}$ for the BG core and Op-Amp rather than the VDD. These current mirrors reduce the impact of supply voltage variations. The proposed circuit is implemented in a $0.35{\mu}m$ CMOS technology. The BGR circuit occupies $0.024mm^2$ of the die area and consumes $200{\mu}W$ from a 5 V supply voltage at room temperature. Experimental results demonstrate that the PSRR of the voltage reference achieved -118 dB at frequencies up to 1 kHz and -55 dB at 1 MHz without additional circuits for the curvature compensation. A temperature coefficient of $60 ppm/^{\circ}C$ is obtained in the range of -40 to $120^{\circ}C$.

MCPCB의 온도에 따른 고출력 LED의 광학적, 열적 영향력 분석 (Optical and Thermal Influence Analysis of High-power LED by MCPCB temperature)

  • 이승민;양종경;조주웅;이종찬;박대희
    • 전기학회논문지
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    • 제57권12호
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    • pp.2276-2280
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    • 2008
  • In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

주파수 전압 변환을 이용한 듀얼 모드 벅 변환기 모드 제어 설계 (Mode Control Design of Dual Buck Converter Using Variable Frequency to Voltage Converter)

  • 이태헌;김종구;소진우;윤광섭
    • 한국통신학회논문지
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    • 제42권4호
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    • pp.864-870
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    • 2017
  • 본 논문은 넓은 부하 전류를 요구하는 휴대 기기에서 사용될 목적으로 주파수 전압 변환을 이용하여 모드 제어 가능한 듀얼 모드 벅 변환기를 설명한다. 기존의 히스테스테릭 벅 변환기의 문제인 저 부하에서의 PLL 보상 및 효율 저하를 제안하는 듀얼 벅 변환기의 개선된 PFM 모드를 통해 해결한다. 또한 기존의 듀얼 모드 벅 변환기의 주요 회로인 모드 제어기에서의 부하 변화 감지의 어려움과 느린 모드 전환 속도를 제안하는 모드 제어기로 개선 시킨다. 제안하는 모드 제어기는 최소 1.5us의 모드 전환 시간을 가진다. 제안하는 DC-DC 벅 변환기는 $0.18{\mu}m$ CMOS 공정에서 설계하였으며 칩 면적은 $1.38mm{\times}1.37mm$이다. 기생 소자를 포함한 인덕터와 커패시터를 고려한 후 모의실험 결과는 1~500mA의 부하 전류 범위에서 입력 전압을 2.7~3.3V를 가지며 PFM 모드는 65mV이내, 히스테리틱 모드에서는 고정된 스위칭 주파수 상태에서 16mV의 출력 리플 전압을 가지는 1.2V의 출력 전압을 생성한다. 제안하는 듀얼 모드 벅 변환기의 최대 효율은 80mA에서 95%를 나타내며 해당 전체 부하 범위에서 85% 이상의 효율을 지닌다.

무금형 다점 펀치를 사용한 선체외판의 분할 성형 가공 정보 계산 시스템 개발 (Mechanical Bending Process and Application for a Large Curved Shell Plate by Multiple Point Press Machine)

  • 황세윤;이장현;류철호;한명수;김광호;김광식
    • 대한조선학회논문집
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    • 제48권6호
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    • pp.528-538
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    • 2011
  • As a forming method for curved hull plates more efficient than the flame bending, mechanical bending using multi point press forming and die-less forming is discussed in this paper. the mechanical forming is a flexible manufacturing system for automatically forming of hull parts. It is especially suited to varied curved parts. This paper discusses a multiple point pressing machine composed of a pair of reconfigurable punches in order to achieve the rapid forming of curved hull plates using division forming and presents how forming information is obtained from the given design surface. Although the mechanical forming can be efficient in the metal forming, spring back after pressing is a phenomenon which must be carefully considered when quantifying the process variables. If the spring back is not accurately controlled, the fabricated shell plate cannot meet assembly tolerance. This paper describes the principles to calculate the proper stroke of each punch at the divided areas. the strokes are determined by an iterative process of sequential pressing and spring back compensation from an unfolded flat shape to its given design surface. FEA(finite element analysis) is used to simulate the spring back of the plate and the IDA(iterative displacement adjustment) method adjusts the offset of pressing punches from the deformation results and the design surface. The shape deviations of two surfaces due to spring back are compensated by integrated system using FEA and IDA method. For the practical application, It is aimed to develop an integrated system that can automatically perform the compensation process and calculate strokes of punches of the double sides' reconfigurable multiple-press machine and some experimental results obtained with mechanical bending are presented.

학령전 아동을 위한 호흡기전염병 예방 프로그램의 개발 및 효과에 관한 연구 (A Study on Health Education Program Development of Respiratory Communicable Disease Prevention for Preschool Children and the Measurement of It's Effects)

  • 김일옥
    • Child Health Nursing Research
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    • 제10권1호
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    • pp.66-79
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    • 2004
  • Purpose: The purpose of this study were to develop a respiratory communicable disease prevention program for preschoolers and measure it's effects. Method: The respiratory communicable disease prevention program for preschoolers consisted of texts, cartoons, photographs, discussions, demonstrations, puzzle games, die games, compensation/reinforcement, and token economy which were directed under the systematic design of instruction by Dick %amp; Carey. This study was a quasi experimental study under the nonequivalent control group with pretest-posttest design. The subjects of this study were 45 preschool children who are attending 3 different district nursery schools and they were matched by the age, pretest knowledge, and pretest behavior. The instrument used in this study was criterion referenced test items that were developed by a researcher for evaluating the subject's knowledge, attitude, and behavior about respiratory communicable disease prevention. A pretest was administered a week before treatment. Experimental group Ⅰ was administered by the treatment of respiratory communicable disease prevention program. Experimental group Ⅱ was administered by above program with token economy program. The posttest was conducted on the eighth day. The third test for behavior was completed 15th day. To determine the effect of the program, the data were analyzed by the SAS 6.12 program with Kruskal Wallis test, ANCOVA, ANOVA, Duncan's test and paired t-test. Result: 1) There was a significant difference in knowledge between the experimental groups and control group(F=5.89, P=0.0197). 2) There was a significant difference in attitude between the experimental groups and control group(F=3.29, P=0.0469). 3) There was a non-significant difference in behavior between the experimental groups and control group(F=0.00, P=0.9512). 4) In the experimental groupⅡ, there was highly significant increase in behavior after token economy(t=4.5252, P=0.0005). Conclusion: It was found that the respiratory communicable disease prevention program for preschool children was effective in changing the preschoolers' knowledge and attitude on the respiratory communicable disease prevention, but not enough for changing the preschoolers' behavior. Token economy was improved as an effective and strong method for inducing desirable changes of preschoolers' behavior.

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경로 손실 변화의 보상이 가능한 77 GHz 차량용 레이더 시스템을 위한 65 nm CMOS 베이스밴드 필터 (65 nm CMOS Base Band Filter for 77 GHz Automotive Radar Compensating Path Loss Difference)

  • 김영식;이승준;어윤성
    • 한국전자파학회논문지
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    • 제23권10호
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    • pp.1151-1156
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    • 2012
  • 본 논문에서는 77 GHz 자동차 레이더 시스템에서 거리가 달라도 일정한 감도를 유지할 수 있도록 하는 베이스밴드 필터를 제안하였다. 기존의 DCOC(DC Offset Cancellation) loop 회로를 이용하여 DC offset을 제거함과 동시에 거리에 따른 수신 전력의 크기 차이를 이득으로 상쇄시킬 수 있도록 하였다. 측정 결과, 이득은 최대 51 dB의 크기를 가지며, 고역 통과 차단 주파수는 5 kHz에서 15 kHz까지 가변 가능하게 하였다. 거리에 따른 손실을 보상하기 위한 고역 통과 필터의 기울기는 거리 보상 범위를 위해 -10~-40 dB/decade로 가변이 가능하게 설계되었다. 1 V의 전압에서 전류 소모는 4.3 mA이며, 측정된 NF는 26 dB이고, IIP3는 +4.5 dBm을 가진다. 칩은 65 nm CMOS 공정을 사용하였으며, 입출력 패드를 제외한 크기는 $500{\mu}m{\times}1,050{\mu}m$이다.