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Optical and Thermal Influence Analysis of High-power LED by MCPCB temperature  

Lee, Seung-Min (원광대 전자재료공학과)
Yang, Jong-Kyung (원광대 전자재료공학과)
Jo, Ju-Ung (원광대 전자재료공학과)
Lee, Jong-Chan (금호전기(주) 부설연구소)
Park, Dae-Hee (원광대학교 전기전자및정보공학부)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.57, no.12, 2008 , pp. 2276-2280 More about this Journal
Abstract
In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.
Keywords
High power LED; Thermal resistance; Junction temperature; Efficiency; LED lamp;
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Times Cited By SCOPUS : 2
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