• Journal of the Korea Society of Computer and Information
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• v.22 no.6
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• pp.79-86
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• 2017

In this paper, we implement a common module that can integrate multiple biometric information for integrated patient monitoring system. Conventional biomedical instruments have many devices attached to each patient, making it difficult to monitor abnormality signs of many patients in real time. In this paper, we propose a module for an integrated monitoring system that can perform centralized monitoring using a common module that integrates multiple measurement devices. A protocol for sending and receiving packets between the measuring device and the common module is designed, and the packets transmitted through the network are stored and managed through the integrated monitoring system and provide information to various users such as medical staff. The results of this study are expected to contribute to the management of patients and efficient medical services in hospitals.

• Journal of Internet Computing and Services
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• v.22 no.6
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• pp.59-69
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• 2021

Malfunctions and failures linked to medical devices may result in significant damage for human being. Thus, in order to ensure that safety of medical device is achieved, it should be established and applied the international standard. It is required to integrate and customize activities at standards, owing to reference relationship between standards, especially, activities based safety analysis is too expensive. This paper proposes a integration process that integrate activities of development lifecycle and safety process. Additionally, we derived a guidance based on STPA for integration process. As a result, we can be performed systematically from early stage of the development and increased effectiveness of integration process by the guidance.

• Journal of Fashion Business
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• v.18 no.4
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• pp.1-14
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• 2014

Currently smart textile market is rapidly expanding and the demand is increasing integration of an electronic fiber circuit. The garments are an attractive platform for wearable device. This is one of the integration techniques, which consists of is the selective introduction of conductive yarns into the fabric through knitting, weaving or embroidering. The aim of this work is to develop a golf bend driven prototype design for an attachable Arduino that can be used to assess elbow motion. The process begins with the development of a wearable device technique that uses conductive yarn and flex sensor for measurement of elbow bending movements. Also this paper describes and discusses resistance value of zigzag embroidery of the conductive yarns on the tensile properties of the fabrics. Furthermore, by forming a circuit using an Arduino and flex sensor the prototype was created with an assistance band for golf posture training. This study provides valuable information to those interested in the future directions of the smart fashion industry.

• Korean Journal of Remote Sensing
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• v.18 no.2
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• pp.91-96
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• 2002

The performance characteristics of a satellite imager using a Time Delay and Integration(TDI) Charge Coupled Device (CCD) with fixed integration time is investigated for the variation of satellite altitude and tilt angle. In consequence of the investigation TDI synchronization using tilt imaging is proposed as a solution to compensate geometric performance degradation due to altitude decrease. The tilt angle optimized for the TDI synchronization at decreased altitude is presented. This result can be used for a TDI CCD imager with variable integration time in a certain range as well.

• Journal of Biomedical Engineering Research
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• v.43 no.4
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• pp.219-229
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• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.216-223
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• 2016

Purpose: This paper suggests the procedure to enhance the reliability of the software of the medical device that is to cure, treat, diagnose, and prevent a disease or an abnormal health conditions. Methods: After test requirements are classified by the software requirements specification for safety and backgrounds, reliability assessment methods are suggested. Results: Verification and validation for function and safety can be performed whether the medical device software are implemented as intended. Conclusion: Procedure on the static analysis, unit test, integration test, and system test are provided for the medical device software.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.05a
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• pp.311-316
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• 2001

The technology for characteristic analysis of device for high integration is changing rapidly. Therefore to understand characteristics of high-integrated device by computer simulation and fabricate the device having such characteristics became one of very important subjects. At devices become smaller from submicron to nanometer, we have investigated MOSFET built on an epitaxial layer(EPI) of a heavily-doped ground plane, and also newEPI MOSFET for improved structure to weak point of LDD structure by TCAD(Technology Computer Aided Design) to develop optimum device structure. We analyzed and compared the EPI device characteristics such as impart ionization, electric field and I-V curve with those of lightly-doped drain(LDD) MOSFET. Also, we presented that TCAD simulator is suitable for device simulation and the scaling theory is suitable at nano structure device.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.3
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• pp.573-579
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• 2001

The technology for characteristic analysis of device for high integration is changing rapidly. Therefore to understand characteristics of high -integrated device by computer simulation and fabricate the device having such characteristics became one of very important subjects. As devices become smaller from submicron to nanometer, we have investigated MOSFET built on an epitaxial layer(EPI) of a heavily-doped ground plane by TCAD(Technology Computer Aided Design) to develop optimum device structure. We analyzed and compared the EPI device characteristics such as impact ionization, electric field and I-V curve with those of lightly doped drain(LDD) MOSFET. Also, we presented that TCAD simulator is suitable for device simulation and the scaling theory is suitable at nano structure device.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.13-21
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• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• Journal of Korea Society of Digital Industry and Information Management
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• v.9 no.4
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• pp.155-165
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• 2013

For the service and creation of new space, the next generation smart device for interactive space using tailor-made contents process serve as an opportunity for the growth of new special display due to the integration of the latest digital technology. The application of next generation technology is in the field that most people expect. So, this thesis serving as the beginning, it is hoped that the smart mirror and wall industry in Korea will play a practical and academic momentum. An interactive environment which is the smart device can be realized when space displays based on smart device built on the experience of the user can provide various tailor-made processes such as academics, performances, meetings, virtual experience, exhibits and promotion, and through this a strategic direction was suggested for the development of each field.