• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.108-112
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• 2023

Precision manufacturing technology is rapidly developing due to the extreme miniaturization of semiconductor processes to comply with Moore's Law. Accurate and precise alignment, which is one of the key elements of the semiconductor pre-process and post-process, is very important in the semiconductor process. The center detection of wafer align marks plays a key role in improving yield by reducing defects and research on accurate detection methods for this is necessary. Methods for accurate alignment using traditional image sensors can cause problems due to changes in image brightness and noise. To solve this problem, engineers must go directly into the line and perform maintenance work. This paper emphasizes that the development of AI technology can provide innovative solutions in the semiconductor process as high-resolution image and image processing technology also develops. This study proposes a new wafer center detection method through variable thresholding. And this study introduces a method for detecting the center that is less sensitive to the brightness of LEDs by utilizing a high-performance object detection model such as YOLOv8 without relying on existing algorithms. Through this, we aim to enable precise wafer focus detection using artificial intelligence.

• Proceedings of the KIEE Conference
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• 1999.07b
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• pp.677-679
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• 1999

This paper introduces a implementation of fault detection for national highway line 3. Fault detection system was installed and operated on national highway line 3, environmental elements caused by abnormal status or faults has often happened. Therefore, the function of fault detection system is to speedy notify fault site, cause as well as scale of fault to manager. Though the fault detection and diagnosis system has been imported in the field of process of water and electric power, it is just beginning step in the field of ITS(Intelligent Transportation Systems). In general, Maintenance system is performed the online/offline process of detection, diagnosis and measure. This paper is studied online detection process, which is realtime remote detection.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.6 no.1
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• pp.395-405
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• 2012

A joint template matching algorithm is proposed in this paper to reduce the high rate of miss-detection and false-alarm caused by the traditional template matching algorithm during the process of multi-object detection. The proposed algorithm can reduce the influence on each object by matching all objects together according to the correlation information among different objects. Moreover, the rate of miss-detection and false-alarm in the process of single-template matching is also reduced based on the algorithm. In this paper, firstly, joint template is created from the information of relative positions among different objects. Then, matching criterion according to normalized cross correlation is generated for multi-object matching. Finally, the proposed algorithm is applied to the detection of watermarks in bill. The experiments show that the proposed algorithm has lower miss-detection and false-alarm rate comparing to the traditional NCC algorithm during the process of multi-object detection.

• Korean Journal of Materials Research
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• v.31 no.12
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• pp.719-726
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• 2021

Through the process of chemical vapor deposition, Tungsten Hexafluoride (WF₆) is widely used by the semiconductor industry to form tungsten films. Tungsten Hexafluoride (WF₆) is produced through manufacturing processes such as pulverization, wet smelting, calcination and reduction of tungsten ores. The manufacturing process of Tungsten Hexafluoride (WF₆) is required thorough quality control to improve productivity. In this paper, a real-time detection system for oxidation defects that occur in the manufacturing process of Tungsten Hexafluoride (WF₆) is proposed. The proposed system is implemented by applying YOLOv5 based on Convolutional Neural Network (CNN); it is expected to enable more stable management than existing management, which relies on skilled workers. The implementation method of the proposed system and the results of performance comparison are presented to prove the feasibility of the method for improving the efficiency of the WF₆ manufacturing process in this paper. The proposed system applying YOLOv5s, which is the most suitable material in the actual production environment, demonstrates high accuracy (mAP@0.5 99.4 %) and real-time detection speed (FPS 46).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.3
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• pp.175-184
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• 2001

In this study, the improved throughput and stability in device fabrication could be obtained by applying CMP process to STi structue in 0.18 um semiconductor device. To employ the CMP process in STI structure, the Reverse Moat Process used to be added after STI Fill, as a result, the process became more complex and the defect were seriously increased than they had been,. Removal rate of each thin film in STI CMP was not uniform, so, the device must have been affected. That is, in case of excessive CMP, the damage on the active area was occurred, and in the case of insufficient CMP nitride remaining was happened on that area. Both of them deteriorated device characteristics. As a solution to these problems, the development of slurry having high removal rate and high oxide to nitride selectivity has been studied. The process using this slurry afford low defect levels, improved yield, and a simplified process flow. In this study, we evaluated the 'High Selectivity Slurry' to do a global planarization without reverse moat step, and also we evaluated EPD(Eend Point Detection) system with which 'in-situ end point detection' is possible.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10a
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• pp.250-255
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• 1993

In this paper, for detection and isolation of instrument and process faults related with steam generator(S/G) in nuclear power plant, two types of observers are designed based on the linearized dynamic model of S/G : a bank of Dedicated Observers (DOS) for instrument faults detection and a bank of Unknown Input Observers(UIO) for process faults detection. And then, they are combined to decide which one between the above two faults occurs. In principle, the failure in ith instrument(process) can be isolated by monitoring the error between the ith output and its estimation obtained from the ith DOS(UIO). It is shown via computer simulations that the present scheme is feasible in finding out the source of a fault.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.186-188
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• 2005

Hand region detection in images is an important process in many computer vision applications. It is a process that usually starts at a pixel-level, and that involves a pre-process of color space transformation followed by a classification process. A color space transformation is assumed to increase separability between skin classes for hands and non-skin classes for other parts, to increase similarity among different skin tones, and to bring a robust performance under varying illumination conditions, without any sound reasonings. In this work, we examine if the color space transformation does bring those benefits to the problem of hand region detection on a dataset of images with different hand postures, backgrounds, people, and illuminations. Results indicate that best of the color space is the normalized RGB.

• International Journal of Aeronautical and Space Sciences
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• v.6 no.1
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• pp.8-16
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• 2005

This paper describes target detection performance of millimeter wave radar that exits on non-stationary target detection schemes in the ground clutter conditions. The comparison of various CFAR process schemes such as CA(Cell-Average)-CFAR, GO(Greatest Of)/SO(Smallest Of)-CFAR, and OS(Order Statistics)-CFAR performance are applied. Using matlab software, we show the performance and loss between target detection probability and signal to noise ratio. This paper concludes the OS-CFAR process performance is better than any others and satisfies the optimal detection probability without loss of detection in the homogeneous clutter, When range bins increase.

• ETRI Journal
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• v.41 no.4
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• pp.437-451
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• 2019

Outlier detection techniques play an important role in enhancing the reliability of data communication in wireless sensor networks (WSNs). Considering the importance of outlier detection in WSNs, many outlier detection techniques have been proposed. Unfortunately, most of these techniques still have some potential limitations, that is, (a) high rate of false positives, (b) high time complexity, and (c) failure to detect outliers online. Moreover, these approaches mainly focus on either temporal outliers or spatial outliers. Therefore, this paper aims to introduce novel algorithms that successfully detect both temporal outliers and spatial outliers. Our contributions are twofold: (i) modifying the Hampel Identifier (HI) algorithm to achieve high accuracy identification rate in temporal outlier detection, (ii) combining the Gaussian process (GP) model and graph-based outlier detection technique to improve the performance of the algorithm in spatial outlier detection. The results demonstrate that our techniques outperform the state-of-the-art methods in terms of accuracy and work well with various data types.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.257-257
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• 2012

Fault detection was carried out in a etcher of capacitive coupled plasma with OES (Optical Emission Spectroscopy) and impedance by VI probe that are widely used for process control and monitoring at semiconductor industry. The experiment was operated at conventional Ar and Fluorocarbon plasma with variable change such as pressure and addition of N2 and O2 to assume atmospheric leak, RF power and pressure that are highly possible to impact wafer yield during wafer process, in order to observe OES and VI Probe signals. The sensitivity change on OES and Impedance by VI probe was analyzed by statistical method including PCA to determine healthy of process. The main goal of this study is to find feasibility and limitation of OES and Impedances for fault detection by shift of plasma characteristics and to enhance capability of fault detection using PCA.