• Journal of the Korean institute of surface engineering
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• v.50 no.2
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• pp.108-113
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• 2017

We investigated the effect of graphite electrode geometry and combination on nanocarbon material synthesis using underwater discharge plasma(UDP). The UDP system consists of two graphite electrodes and beaker filled with de-ionized water. A high voltage of 15 kV with a frequency of 25 kHz is applied to produce UDP using an alternating-current power source. The UDP system with conical electrodes produced the largest amount of products due to the concentration of electrical fields between electrodes. In addition, hollow-shaped stationary electrode and conical-shaped moving electrode stores discharge-induced bubbles and maintains longer reaction time. We found from Raman spectroscopy and electron microscopy that high quality carbon nanomaterials including carbon nanotubes are synthesized by the UDP system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.146-149
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• 2004

Porous silicon(PS) as an excellent light diffuser can be used as an antireflection layer without other antireflection coating(ARC) materials. PS layers were obtained by electrochemical etching(ECE) anodization of silicon wafers in hydrofluoric acid/ethanol/de-ionized(DI) water solution($HF/EtOH/H_2O$). This technique is based on the selective removal of Si atoms from the sample surface forming a layer of PS with adjustable optical, electrical, and mechanical properties. A PS layer with optimal ARC characteristics was obtained in charge density (Q) of 5.2 $C/cm^2$. The weighted reflectance is reduced from 33 % to 4 % in the wavelength between 400 and 1000 nm. The weighted reflectance with optimized PS layers is much less than that obtained with a commercial SiNx ARC on a potassium hydroxide(KOH) pre-textured multi-crystalline silicon(mc-Si) surface.

• Korean Journal of Materials Research
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• v.6 no.4
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• pp.379-387
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• 1996

본 연구에서는 GaAs 소자제작 및 epi-layer 성장 공정에 있어 이용되어지는 HCI, H3PO4, 탈이온수(de-ionized water:DIW)를 통한 습식제정후 공기중 노출에 따른 오염을 최소화하여 표면상태 변화를 진성적(intrinsic)으로 관찰하고자 모든 세정처리를 아르곤 가스(argon gas)로 분위기가 유지되는 glove box에서 수행하였으며, 표면조성 및 결합상태 변화에 대한 관찰은 X-선 광전자 분광기(X-ray photoelectron spectroscopy)를 통해 이루어졌다. 고진공하에서 GaAs를 벽개하여 관찰함으로써 Ga이 대기중 산소이온과 우선적으로 결합함을 알 수 있었고, 이런 GaAs 표면의 반응성에 대한 고찰을 바탕으로 습식세정에 따른 화학반응 기구가 제시 되어졌다. HCI 및 H3PO4/DIW/HCI처리후 CI-이온의 Ga 이온과의 반응에 의한 Ga-CI결합의 형성과 As 산화물의 높은 용해도에 따른 As 산화물의 완전한 제거 및 식각전 초기(bare)GaAsvyaus에 존재하는 원소(elemental)As 상태의 식각후 잔류가 관찰되어졌다. 또 HCI, H3PO4/DIW/HCI 처리하고 DIW로 세척후 표면상태 변화를 관찰한 결과, DIW처리에 의해 elemental As 상태가 증가함을 알 수 있었다.

• Journal of the Korean institute of surface engineering
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• v.52 no.2
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• pp.78-83
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• 2019

Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2 \; (PN_2)$ gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and $PN_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.5
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• pp.191-195
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• 2002

Chemical mechanical Polishing (CMP) process is widely used for the global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2$ ($PN_2$) gas, point of use (POU) slurry filler and high spray bar (HSB) were installed. Our experimental results show that DW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.5
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• pp.445-450
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• 2011

We studied the adhesion characteristics of polymer films (PC, PET, EVA) treated by atmospheric pressure plasma. The process parameters were the frequency, gas flow, and treatment time; we studied the effects of these parameters on the adhesion characteristics of the polymer materials. We used de-ionized water and diiodomethane as the polar and nonpolar solvents, respectively, for measuring the contact angles, and subsequently calculated the surface free energy of each polymer film. The adhesion characteristics were studied by carrying out a $180^{\circ}$ peel-off test. The polymer films treated with plasma developed a hydrophilic surface, which led to increased surface free energy and improved adhesion properties. From the results for contact angle, surface free energy, and adhesion strength, we obtained the optimal plasma-treatment conditions.

• Journal of Ceramic Processing Research
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• v.20 no.2
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• pp.158-163
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• 2019

Er3+/Yb3+-codoped NaLa(MoO4)2 colloidal nanocrystals were synthesized by pulsed laser ablations in de-ionized water and sodium dodecyl sulfate (NaC12H25SO4, SDS) aqueous solution for up-conversion (UC) luminescence bio-labeling applications. The influences of the SDS molecules on the crystallinities, crystal morphologies, crystallite sizes, and UC luminescence properties of the prepared Er3+/Yb3+-codoped NaLa(MoO4)2 colloidal nanocrystals were investigated in detail. Under a 980-nm excitation, the Er3+/Yb3+-codoped nanocolloidal NaLa(MoO4)2 suspension exhibited a weak red emission near 670 nm and strong green UC emissions at 530 and 550 nm, corresponding to the intra 4f transitions of Er3+ (4F9/2, 2H11/2, 4S3/2) → Er3+ (4I15/2). When the SDS solution was used, a smaller average crystallite size, narrower size distribution, and enhanced UC luminescence were observed. These characteristics were attributed to the amphoteric SDS molecules attached to the positively charged Er3+/Yb3+-codoped NaLa(MoO4)2 colloidal nanocrystals, effectively occupying the oxygen defect on their surfaces. The Er3+/Yb3+-codoped nanocrystalline NaLa(MoO4)2 suspension prepared in the SDS solution exhibited a remarkably strong green emission visible to the naked eyes.

• Journal of the Korean Society of Visualization
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• v.19 no.3
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• pp.15-21
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• 2021

In this study, we investigated the dynamics of a droplet impacting rough hydrophobic surfaces through high-speed imaging. Micrometer-sized structures with grooves and pillars were fabricated on smooth Polydimethylsiloxane (PDMS) surfaces by laser ablation. We used Newtonian and non-Newtonian liquid droplets to study the drop impact dynamics. De-ionized water and aqueous glycerin solutions were used for the Newtonian liquid droplet. The solutions of xanthan gum in water were prepared to provide elastic property to the Newtonian droplet. We found that the orientation of the surface structures affected the maximal spreading diameter of the droplet due to the degree of slippage. During the droplet retraction, the dynamic receding contact angles were measured to be around 90° or less. It resulted in the formation of the micro-capillary bridges between the receding droplet and the surface structures. Then, the rupture of the capillary bridge led to the formation of micrometer-sized droplets on top of the surface structures. The size of the microdroplets was found to increase with increasing the impacting velocity and viscosity of the Newtonian liquid droplets. However, the size of the isolated microdroplets decreased with enhancing the elasticity of the droplets, and the size of the non-Newtonian microdroplets was not affected by the impacting velocity.