• 새물리
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• 제68권11호
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• pp.1167-1172
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• 2018

탄소 나노 튜브는 탄소 원자들이 육각형의 벌집모양으로 서로 연결된 고분자 탄소동소체로 다중벽일 경우 $3000W{\cdot}m^{-1}{\cdot}K^{-1}$, 단일벽일 경우 $6000W{\cdot}m^{-1}{\cdot}K^{-1}$ 정도로 매우 높은 열전도도를 보인다. 본 연구에서는 단일 빔과 이중 빔 방법으로 열렌즈 효과를 이용하여, 1.5 M 다중벽 탄소 나노튜브 분산액의 투과율과 열확산도를 측정하였다. 단일 레이저 빔의 진행방향으로 시료를 움직이는 z-scan 방법을 통해 비선형 광학계수들을 구하고, 이중 레이저 빔을 이용하여 열확산도를 측정하였다. 펌프 빔으로는 파장 532 nm이고 세기가 100 mW인 DPSS (Diode-pumped solid state, DPSS) 레이저를 사용하였고, 프로브빔으로는 파장이 633 nm이며 세기가 5 mW인 He-Ne 레이저를 사용하였다. 실험 결과 농도가 9.99, 11.10, 16.65, 19.98 mM일 때 비선형 흡수계수는 각각 0.046, 0.051, 0.136, 0.169 m/W였다. 또한 비선형 굴절률은 0.20, 0.51, 1.25, $1.32{\times}10^{-11}m^2/W$였고, 열확산도 평균치는 $1.33{\times}10^{-6}m^2/s$이었다.

• 한국레이저가공학회지
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• 제9권3호
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• pp.7-13
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber are 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

• 한국광학회지
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• 제14권3호
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• pp.312-320
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• 2003

본 연구에서는 355 nm의 파장을 갖는 Nd:YVO$_4$ 3고주파 DPSS 레이저를 이용하여 폴리머의 3차원 미세형상 가공기술을 개발하였다. UV레이저와 폴리머의 어블레이션에 관한 메커니즘을 설명하였으며 비교적 UV영역에서 파장이 긴 355 nm파장의 영역에서는 광열분해 반응으로 가공되고 이에 따른 폴리머의 광학적 특성을 살펴보았다. 광 흡수율 특성이 우수한 폴리머가 광가공 특성이 좋은 것으로 나타났으나 벤젠구조가 많이 포함되어 있는 폴리이미드의 경우는 광분해후 다시 새로운 화학적 결합이 이루어져 가공부 면이 좋지 않은 면을 보였다. 레이저의 다중 주사방식으로 가공하기위하여 표면의 오염이 적은 폴리카보네이트를 시편으로 사용하여 3차원 적으로 모델링한 직경 1 mm와 500 $\mu\textrm{m}$의 마이크로 팬을 가공하였다. 레이저 발진 효율이 높고 유지비가 적은 355 nm의 DPSSL을 이용한 3차원 가공기술의 개발로 향후 저비용으로 빠른 시간에 미세부품을 개발하는 기술에 기여할 것으로 예상된다.

• 한국정밀공학회지
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• 제27권3호
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• pp.9-17
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• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

• 한국레이저가공학회지
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• 제17권3호
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• pp.19-23
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• 2014

To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• 한국정밀공학회지
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• 제27권2호
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• pp.20-24
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• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.41-45
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber we 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

• Smart Structures and Systems
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• 제22권2호
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• pp.223-230
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• 2018

This study examines a non-contact laser scanning-based ultrasound system, called an angular scan pulse-echo ultrasonic propagation imager (A-PE-UPI), that uses coincided laser beams for ultrasonic sensing and generation. A laser Doppler vibrometer is used for sensing, while a diode pumped solid state (DPSS) Q-switched laser is used for generation of thermoelastic waves. A high-speed raster scanning of up to 10-kHz is achieved using a galvano-motorized mirror scanner that allows for coincided sensing and for the generation beam to perform two-dimensional scanning without causing any harm to the surface under inspection. This process allows for the visualization of longitudinal wave propagation through-the-thickness. A pulse-echo ultrasonic wave propagation imaging algorithm (PE-UWPI) is used for on-the-fly damage visualization of the structure. The presented system is very effective for high-speed, localized, non-contact, and non-destructive inspection of aerospace structures. The system is tested on an aluminum honeycomb sandwich with disbonds and a carbon fiber-reinforced plastic (CFRP) honeycomb sandwich with a layer overlap. Inspection is performed at a 10-kHz scanning speed that takes 16 seconds to scan a $100{\times}100mm^2$ area with a scan interval of 0.25 mm. Finally, a comparison is presented between angular-scanning and a linear-scanning-based pulse-echo UPI system. The results show that the proposed system can successfully visualize defects in the inspected specimens.

• 한국정밀공학회지
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• 제27권10호
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.