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Study of Laser Trimming and Cutting of Printed Circuit Board by using UV Laser with Nanosecond Pulse Width  

Ryu, Kwang-Hyun (R&D center of Jettech, LTD.)
Shin, Suk-Hoon (R&D center of Jettech, LTD.)
Park, Hyeong-Chan (R&D center of Jettech, LTD.)
Nam, Gi-Jung (R&D center of Jettech, LTD.)
Kwon, Nam-Ic (Physics, Hankuk University of Foreign Studies)
Publication Information
Journal of the Korean Society for Precision Engineering / v.27, no.10, 2010 , pp. 23-28 More about this Journal
Abstract
Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.
Keywords
Laser Trimming; Printed Circuit Board; UV DPSS Nanosecond Pulsed Laser; Laser Cutting;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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