• Title/Summary/Keyword: DC sputtering

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비정질 탄소막 (a-C:H) 내에 존재하는 수소에 관한 연구

  • 박노길;박형국;손영호;정재인
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.133-133
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    • 1999
  • 비정질 탄소막 제조에 있어서 수소가 포함된 반응성 가스를 사용할 경우 제작된 탄소막 내부에는 수소가 포함되게 되며, 이러한 수소원자들은 막의 특성에 중요한 영향을 주는 것으로 알려져 있다. 따라서, 본 연구에서는 비정질 탄소막(a-C:H) 내부에 존재하는 수소가 탄소막의 특성에 미치는 영향을 알아보고, 막 내부에 포함된 수소의 함량과 공정조건 사이의 함수계를 조사함으로써 수소의 함량을 인위적으로 통제할 수 있는 가능성을 제시하고자 한다. 수소가 포함된 비정질 탄소막은 2.45 GHz의 전자기파를 사용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) 방법과 DC magnetron sputtering 법을 사용하여 제작하였다. 기판으로는 Si(001) wafer를 사용하였으며, 아세톤과 에탄올을 사용하여 표면의 유기성분을 제거하고, 진공챔버속에서 Ar 플라즈마를 발생시켜 sputter etching 방법으로 표면을 세척하였다. ECR-PECVD 방법에서는 반응가스로 메탄(CH4)과 수소(H2)의 혼합가스를 사용하였으며, 혼합가스의 비는 5~50% 범위내에서 변화를 주었다. 수소가스의 유량은 100SCCM으로 고정하였으며, 마이크로웨이브의 power는 360~900W였고, 기판에 가해준 negative DC bias 전압은 0~-500V이었다. DC magnetron sputtering 방법에서는 반응가스로 아세틸린(C2H2) 가스를 사용하였으며, 플라즈마 발생을 용이하게 하기 위해서 Ar 가스와 혼합하여 사용하였다. Ar 가스의 유량은 10SCCM으로 고정하였으며, 아세틸렌 가스의 유량은 5~20SCCM 범위내에서 주입하였다. 이때, 기판에 가해준 negative DC bias 전압은 0~-100V이었다. 제작된 탄소막의 수소 함량을 조사하기 위하여 Fourier Transform Infrared (FTIR) 분광법과 Elastic Recoil Detection Analysis (EFDA) 법을 사용하였으며, 증착율은 SEM 단면촬영과 a-step을 이용하여 측정하였고, 막의 경도는 Micro-Hardness Testing 법을 사용하여 측정하였다.

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A Comparative Study of CrN Coatings Deposited by DC and Inductively Coupled Plasma Magnetron Sputtering (DC 스퍼터법과 유도결합 플라즈마 마그네트론 스퍼터법으로 증착된 CrN 코팅막의 물성 비교연구)

  • Seo, Dae-Han;Chun, Sung-Yong
    • Journal of the Korean institute of surface engineering
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    • v.45 no.3
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    • pp.123-129
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    • 2012
  • Nanocrystalline CrN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 500 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has an significant influence on coating microstructure and mechanical properties of CrN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain size of CrN coatings were decreased from 11.7 nm to 6.6 nm with increase of ICP power. The maximum nanohardness of 23.0 GPa was obtained for the coatings deposited at ICP power of 500 W. Preferred orientation in CrN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

Physical and Structural Properties of Amorphous Carbon Films Synthesized by Magnetron Sputtering Method (마그네트론 스퍼터링법에 의해 합성되어진 비정질 탄소박막들의 구조적, 물리적 특성)

  • Park, Yong-Seob;Cho, Hyung-Jun;Hong, Byung-You
    • Journal of the Korean Vacuum Society
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    • v.16 no.2
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    • pp.122-127
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    • 2007
  • In this research, amophous carbon films (a-C, a-C:H, a-C:N) were synthesized by closed-field unbalanced magnetron (CFUBM) sputtering using graphite target. We also fabricated amorphous carbon films with applying negative DC bias voltage of 200 V in during the deposition in working pressure. Also, a-C:H and a-C:N films was synthesized by adding acethylene($C_{2}H_{2}$) and nitrogen(N) gases of 4 and 3 sccm into Ar pressure. The a-C:H film synthesized at -200 V exhibited the maxumum hardness of 26.3 GPa, the smooth surface of 0.1 nm and the good adhesion of 30.5 N. And a-C:N film synthesized at -200 V exhibited at -200 V exhibited the best adhesion of 32 N. This paper examined the effect of $C_{2}H_{2}$ gas, $N_{2}$ gas and negative DC bias voltage as the parameter for improving the physical properties and the relation between structral and physical properties of carbon films.

A study on the high transparent and antistatic thin films on sodalime glass by reactive pulsed DC magnetron sputtering (Pulsed DC 마그네트론 스퍼터링으로 제조한 소다라임 유리의 고투과 및 대전방지 박막특성 연구)

  • Jung, Jong-Gook;Lim, Sil-Mook
    • Journal of the Korean institute of surface engineering
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    • v.55 no.6
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    • pp.353-362
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    • 2022
  • Recently, transmittance of photomasks for ultra-violet (UV) region is getting more important, as the light source wavelength of an exposure process is shortened due to the demand for technologies about high integration and miniaturization of devices. Meanwhile, such problems can occur as damages or the reduction of yield of photomask as electrostatic damage (ESD) occurs in the weak parts due to the accumulation of static electricity and the electric charge on chromium metal layers which are light shielding layers, caused by the repeated contacts and the peeling off between the photomask and the substrate during the exposure process. Accordingly, there have been studies to improve transmittance and antistatic performance through various functional coatings on the photomask surface. In the present study, we manufactured antireflection films of Nb2O5, | SiO2 structure and antistatic films of ITO designed on 100 × 100 × 3 mmt sodalime glass by DC magnetron sputtering system so that photomask can maintain high transmittance at I-line (365 nm). ITO thin film deposited using In/Sn (10 wt.%) on sodalime glass was optimized to be 10 nm-thick, 3.0 × 103 𝛺/☐ sheet resistance, and about 80% transmittance, which was relatively low transmittance because of the absorption properties of ITO thin film. High average transmittance of 91.45% was obtained from a double side antireflection and antistatic thin films structure of Nb2O5 64 nm | SiO2 41 nm | sodalime glass | ITO 10 nm | Nb2O5 64 nm | SiO2 41 nm.

Effect of fabrication conditions on microstructure and performance of electrodes for SOFCs (SOFC용 전극 제작 조건에 따른 전극 성능 및 구조 분석)

  • Lah, Se-Yun;Jee, Young-Seok;Lee, Yoon-Ho;Cho, Goo-Young;Cha, Suk-Won
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.307-310
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    • 2009
  • In order to develop SOFC cell performance, many kind of things were investigated. Electrode microstructure is the one of them therefore we focus on electrodes fabrication easily and efficiently. We can fabricate electrodes easily with Pt using DC magnetron sputtering and sintering. However sputtering is difficult to handle and to grow porous electrodes what we require. On the other hand sintering is much easier than sputtering to make porous and adhesive electrodes. So in this paper we deal with sintering and optimize to deposit electrodes conditions by analyzing electrode microstructure with sacnning electron microscopy(SEM) micrograph. Also, we compare electrochemical performance of cells fabricated by sputtering and sintering.

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Electrical and structural properties of Ti thin films by sputtering (스퍼터링법으로 제조한 타이타늄 박막의 전기적 및 구조적 특성)

  • Kim, Young-Jun;Park, Jung-Yun;Jeong, Woon-Jo;Park, Gye-Choon;Lee, Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.694-698
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    • 2002
  • Ti films were deposited onto $100{\times}100$ mm alumina substrates using dc magnetron sputtering under the following conditions; substrate temperature of R.T. ${\sim}400^{\circ}C$, annealing temperature of $100{\sim}400^{\circ}C$ and sputtering gas pressure of $1.3{\sim}3.0{\times}10^{-2}$ Torr. And the films were examined by X-ray diffraction analysis (XRD), scanning electron microscopy(SEM) and 4-point measurement system. The best electrical and structural properties obtained by substrate temperature of ${\sim}200^{\circ}C$, target-substrate distance of ~14 cm and sputtering pressure of $1.3{\sim}1.7{\times}10^{-2}$ Torr. Also at that condition the most excellent adhesion was observed.

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Two-Dimensional DC Magnetron Sputtering Simulator for Cylindrical Rotating Target

  • Kim, Jin-Seok;Lee, Jeong-Yeol;Kim, Min-Gyeong;Lee, Hae-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.454-454
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    • 2012
  • Magnetron sputtering에서, 영구자석의 자속은 target 표면 가까이에 전자를 구속한다. 구속된 전자는 Ar중성기체와 충돌하여 Ar이온을 발생시킬 수 있으므로, target 근처에서의 플라즈마 밀도를 높여, 자석이 없을 때보다 낮은 압력 또는 낮은 전압에서 방전할 수 있다. 구속 전자가 밀집된 공간에서 sputtering 현상이 주로 발생하기 때문에, planar target을 사용할 경우에는 target이 불균일하게 식각되어 target의 사용효율이 좋지 못하다. 이에 대한 한 가지 대안은 target을 원통형으로 만들어 회전시키는 것이다. Cylindrical target 의 내부에 위치한 영구자석은 고정시키고, target만을 회전시키면 비교적 균일하게 식각되므로 target의 사용효율을 높일 수 있다. 본 연구에서는 기존의 planar target에 대한 Particle-In-Cell Simulation을 Cylindrical target 에 적용시키기 위한 방법을 알아본다. 또한, 개발된 Simulator를 이용하여, Sputtering 조건의 변화에 대한 I-V curve의 변화를 살펴본다.

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Electrical and optical properties of ZnO:Al thin films prepared by reactive sputtering method (반응성 sputtering법으로 제막된 ZnO : Al 박막의 전기.광학적 특성)

  • 유병석;유세웅;이정훈
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.4
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    • pp.480-492
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    • 1996
  • AZO (Aluminum doped Zinc Oxide) transparent conducting thin films were fabricated by reactive DC mangnetron sputtering method using zinc target containing 2 wt% of Al. Transition range with optimum transmittance and conductivity was obtained by contrlling partial pressure of reactive oxygen gas. Sputtering condition for this transition range could be kept stable by regulating the target voltage. According to XRD analysis, there was only one peak for (002) plane in AZO films and the films deposited in transition range.

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Preparation of TiO2 Nanotube Arrays from Thin Film Grown by RF Sputtering

  • Kim, Chang Woo
    • Applied Science and Convergence Technology
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    • v.27 no.5
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    • pp.105-108
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    • 2018
  • Transparent $TiO_2$ nanotube arrays are successfully prepared by a two-step approach involving electrochemical anodization and RF magnetron sputtering. First, a Ti film is deposited on an FTO substrate by RF magnetron sputtering at room temperature. The morphologies of the Ti film are controlled by the working distance, Ar flow, and DC power. Second, an anodization treatment is electrochemically performed for the formation of nanotube arrays from the deposited Ti film, followed by post-annealing treatment in air for the formation of $TiO_2$ crystallization. The back side of the crystallized $TiO_2$ nanotube arrays is illuminated with solar light to characterize the photoelectrochemical reaction, and their photoelectrochemical properties are investigated. This work provides information on application of a thin film deposited by RF sputtering in the field of photoelectrochemical water splitting.