• 한국방사선학회논문지
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• 제11권3호
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• pp.101-108
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• 2017

DC/DC 컨버터는 임의의 직류전원을 부하가 요구하는 형태의 직류전원으로 변환시키는 효율이 높은 전력변환기이다. 고급형 DC/DC 컨버터는 MOSFET(산화물-반도체 전계 효과 트랜지스터)를 제어하기 위해 OP-Amp.(연산 증폭기)를 실장한 PWM-IC(펄스폭 변조 집적회로)를 사용한다. OP-Amp.는 증폭기 기능을 수행하는데 방사선 영향으로 전기적 특성이 변화하는데 본 논문에서는 코발트 60 (60Co) 저준위 감마발생기를 이용한 TID실험과 5종류의 중이온 입자를 이용하여 SEL 실험을 수행하는데 바이어스(bias) 전류가 순간적으로 과전류가 흘러 SEL이 발생된다. OP-Amp.의 TID 실험은 조사율은 5 rad/sec.로 전체 조사량을 30 krad 까지 수행하였으며, SEL 실험은 제어보드를 구현한 후 LET($MeV/mg/cm^2$)별 cross section($cm^2$)을 이용하여 성능평가를 하는데 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.74-74
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• 2009

Titanium nitride has been used as hardmask for semiconductor process, capacitor of MIM type and diffusion barrier of DRAM, due to it's low resistivity, thermodynamic stability and diffusion coefficient. Characteristics of the TiN film are high intensity and chemical stability. The TiN film also has compatibility with high-k material. This study is an experimental test for better condition of TiN film etching process. The etch rate of TiN film was investigated about etching in $BCl_3/Ar/O_2$ plasma using the inductively coupled plasma (ICP) etching system. The base condition were 4 sccm $BCl_3$ /16 sccm Ar mixed gas and 500 W the RF power, -50 V the DC bias voltage, 10 mTorr the chamber pressure and $40\;^{\circ}C$ the substrate temperature. We added $O_2$ gas to give affect etch rate because $O_2$ reacts with photoresist easily. We had changed $O_2$ gas flow rate from 2 sccm to 8 sccm, the RF power from 500 W to 800 W, the DC bias voltage from -50 V to -200 V, the chamber pressure from 5 mTorr to 20 mTorr and the substrate temperature from $20\;^{\circ}C$ to $80\;^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제23권12호
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• pp.924-928
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• 2010

In this study, $HfAlO_3$ thin films using gate insulator of MOSFET were etched in inductively coupled plasma. The etch characteristics of the $HfAlO_3$ thin films has been investigated by varying $O_2/BCl_3$/Ar gas mixing ratio, a RF power, a DC bias voltage and a process pressure. As the $O_2$ concentration increases further, $HfAlO_3$ was redeposited. As increasing RF power and DC bias voltage, etch rates of the $HfAlO_3$ thin films increased. Whereas, as decreasing of the process pressure, etch rates of the $HfAlO_3$ thin films increased. The chemical reaction on the surface of the etched the $HfAlO_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS). These peaks moved a binding energy. This chemical shift indicates that there are chemical reactions between the $HfAlO_3$ thin films and radicals and the resulting etch by-products remain on the surface.

• 한국표면공학회지
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• 제41권3호
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• pp.83-87
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• 2008

This study described the effects of RF power, DC bias voltage, chamber pressure and gas mixing ratio on the etch rates of TiN thin film and selectivity of TiN thin film to $SiO_2$ with $BCl_3$/Ar gas mixture. When the gas mixing ratio was $BCl_3$(20%)/Ar(80%) with other conditions were fixed, the maximum etch rate of TiN thin film was 170.6 nm/min. When the DC bias voltage increased from -50 V to -200 V, the etch rate of TiN thin film increased from 15 nm/min to 452 nm/min. As the RF power increased and chamber pressure decreased, the etch rate of TiN thin film showed an increasing tendency. When the gas mixing ratio was $BCl_3$(20%)/Ar(80%) under others conditions were fixed, the intensity of optical emission spectra from radical or ion such as Ar(750.4 nm), $Cl^+$(481.9 nm) and $Cl^{2+}$(460.8 nm) was highest. The TiN thin film was effectively removed by the chemically assisted physical etching in $BCl_3$/Ar ICP plasma.

• Corrosion Science and Technology
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• 제18권5호
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• pp.206-211
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• 2019

Silicon carbide (SiC) thin films become superhard when they have microstructures of nanocolumnar crystalline grains (NCCG) with an intergranular amorphous SiC matrix. We investigated the role of ion bombardment and deposition temperature in forming the NCCG in SiC thin films. A direct-current (DC) unbalanced magnetron sputtering method was used with pure Ar as sputtering gas to deposit the SiC thin films at fixed target power of 200 W and chamber pressure of 0.4 Pa. The Ar ion bombardment of the deposited films was conducted by applying a negative DC bias voltage 0-100 V to the substrate during deposition. The deposition temperature was varied between room temperature and $450^{\circ}C$. Above a critical bias voltage of -80 V, the NCCG formed, whereas, below it, the SiC films were amorphous. Additionally, a minimum thermal energy (corresponding to a deposition temperature of $450^{\circ}C$ in this study) was required for the NCCG formation. Transmission electron microscopy, Raman spectroscopy, and glancing angle X-ray diffraction analysis (GAXRD) were conducted to probe the samples' structural characteristics. Of those methods, Raman spectroscopy was a particularly efficient non-destructive tool to analyze the formation of the SiC NCCG in the film, whereas GAXRD was insufficiently sensitive.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.127-130
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• 2003

An RSFQ (Rapid Single Flux Quantum) counter can be used as a frequency divider that was an essential part of a programmable voltage standard chip. The voltage standard chip is composed of two circuit parts, a counter and an antenna Analog signal of tens to hundreds ㎓ may be applied to a finline antenna part. This analog signal can be converted to the stream of SFQ voltage pulses by a DC/SFQ circuit. The number of voltage pulses can be reduced by 2n times when they pass through a counter that is composed of n T Flip-Flops (Toggle Flip-Flop). Such a counter can be used not only as a frequency divider, but also to build a programmable voltage standard chip. So, its application range can be telecommunication, high speed RAM, microprocessor, etc. In this work, we have used Xic, WRspice, and L-meter to design an RSFQ counter. After circuit optimization, we could obtain the bias current margins of the T Flip-Flop circuit to be above 31％ Our RSFQ counter circuit designs were based on the 1 ㎄/$\textrm{cm}^2$ niobium trilayer technology.

• 한국전자파학회논문지
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• 제16권2호
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• pp.144-148
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• 2005

본 논문은 $CMOS\;0.18\;{\mu}m$ 고정을 이용한 MB-OFDM UWB용 VGA를 설계하였다. 제 안된 VGA는 $-6\~45dB$의 가변이득 조정이 가능하고 3 dB Bandwidth는 필요 성능인 264 MHz를 만족하였다. 2단 연속 구조인 증폭부와 DC 성분을 제거하는 DC offset canceller로 구성되어 있고 1.8 V 바이어스에 4 mA 소비 전류를 만족하였다.

• 한국정보통신학회논문지
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• 제7권4호
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• pp.743-749
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• 2003

본 논문에서는, cold-HEMT의 게이트에 핀치오프 전압보다 약간 낮은 전압을 가함으로써 게이트 손상문제로부터 자유로우며 부가적인 DC 측정을 필요로 하지 않는 새로운 HEMT 소신호 모델링 방법을 제시한다. 제시된 방법에 의해서 모델링된 회로의 S-파라미터 이론치는 49개의 동작 바이어스점에서 측정치와 62GHz까지 뛰어난 일치를 보였다.

• 전자공학회논문지A
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• 제31A권1호
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• pp.93-102
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• 1994

This paper, presents SECRET(SEC REliability Tool), which predicts reliability problems related to the hot-carrier and electromigration effects on the submicron MOSFETs and interconnections. To simulate DC and AC lifetime for hot-carrier damaged devices, we have developed an accurate substrate current model with the geometric sensitivity, which has been verified over the wide ranges of transistor geometries. A guideline can be provided to design hot-carrier resistant circuits by the analysis of HOREL(HOT-carrier RFsistant Logic) effect, and circuit degradation with respect to physical parameter degradation such as the threshold voltage and the mobility can also be expected. In SECRET, DC and AC MTTF values of metal lines are calculated based on lossy transmission line analysis, and parasitic resistances, inductances and capacitances of metal lines are accurately considered when they operate in the condition of high speed. Also, circuit-level reliability simulation can be applied to the determination of metal line width and-that of optimal capacitor size in substrate bias generation circuit. Experimental results obtained from the several real circuits show that SECERT is very useful to estimate and analyze reliability problems.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2002년도 추계종합학술대회
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• pp.817-820
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• 2002

본 논문에서는 전계 흡수형 변조기를 사용한 400Gb/s 광송신기를 구성하고, 이에 대한 특성을 측정해 보았다. 그 결과 전계 흡수형 변조기에 가해지는 DC 바이어스 전압 및 온도를 변화시켰을 때 소광비, 출력 파워 및 파장이 변화하였다. 이러한 특성의 변화를 토대로 400Gb/s 광송신기의 최적화 설계가 가능하다.