• Title/Summary/Keyword: DC bias voltage

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Low Temperature Growth of MCN(M=Ti, Hf) Coating Layers by Plasma Enhanced MOCVD and Study on Their Characteristics (플라즈마 보조 유기금속 화학기상 증착법에 의한 MCN(M=Ti, Hf) 코팅막의 저온성장과 그들의 특성연구)

  • Boo, Jin-Hyo;Heo, Cheol-Ho;Cho, Yong-Ki;Yoon, Joo-Sun;Han, Jeon-G.
    • Journal of the Korean Vacuum Society
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    • v.15 no.6
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    • pp.563-575
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    • 2006
  • Ti(C,N) films are synthesized by pulsed DC plasma enhanced chemical vapor deposition (PEMOCVD) using metal-organic compounds of tetrakis diethylamide titanium at $200-300^{\circ}C$. To compare plasma parameter, in this study, $H_2$ and $He/H_2$ gases are used as carrier gas. The effect of $N_2\;and\;NH_3$ gases as reactive gas is also evaluated in reduction of C content of the films. Radical formation and ionization behaviors in plasma are analyzed in-situ by optical emission spectroscopy (OES) at various pulsed bias voltages and gas species. He and $H_2$ mixture is very effective in enhancing ionization of radicals, especially for the $N_2$. Ammonia $(NH_3)$ gas also highly reduces the formation of CN radical, thereby decreasing C content of Ti(C, N) films in a great deal. The microhardness of film is obtained to be $1,250\;Hk_{0.01}\;to\;1,760\;Hk_{0.01}$ depending on gas species and bias voltage. Higher hardness can be obtained under the conditions of $H_2\;and\;N_2$ gases as well as bias voltage of 600 V. Hf(C, N) films were also obtained by pulsed DC PEMOCYB from tetrakis diethyl-amide hafnium and $N_2/He-H_2$ mixture. The depositions were carried out at temperature of below $300^{\circ}C$, total chamber pressure of 1 Torr and varying the deposition parameters. Influences of the nitrogen contents in the plasma decreased the growth rate and attributed to amorphous components, to the high carbon content of the film. In XRD analysis the domain lattice plain was (111) direction and the maximum microhardness was observed to be $2,460\;Hk_{0.025}$ for a Hf(C,N) film grown under -600 V and 0.1 flow rate of nitrogen. The optical emission spectra measured during PEMOCVD processes of Hf(C, N) film growth were also discussed. $N_2,\;N_2^+$, H, He, CH, CN radicals and metal species(Hf) were detected and CH, CN radicals that make an important role of total PEMOCVD process increased carbon content.

Highly Efficient 13.56 MHz, 300 Watt Class E Power Transmitter (13.56 MHz, 300 Watt 고효율 Class E 전력 송신기 설계)

  • Jeon, Jeong-Bae;Seo, Min-Cheol;Kim, Hyung-Chul;Kim, Min-Su;Jung, In-Oh;Choi, Jin-Sung;Yang, Youn-Goo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.8
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    • pp.805-808
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    • 2011
  • This paper presents a design of high-efficiency and high-power class E power transmitter. The transmitter is composed of 300 Watt class E power amplifier and AC-DC converter. The AC-DC converter converts 220 V and 60 Hz AC to a 290 V DC. The generated DC voltage is directly applied to a bias of the class E power amplifier. Because the converter does not have DC-DC converter unit, it has very high conversion efficiency of about 98.03 %. To minimize the loss at the output of the power amplifier, high-Q inductor was implemented and deployed to the output resonant circuit. As a result, the 13.56 MHz class E power amplifier has a high power-added efficiency of 84.2 % at the peak output power of 323.6 W. The overall efficiency of class E power transmitter, including the AC-DC converter, is as high as 82.87 %.

Fully Differential 5-GHz LC-Tank VCOs with Improved Phase Noise and Wide Tuning Range

  • Lee, Ja-Yol;Park, Chan-Woo;Lee, Sang-Heung;Kang, Jin-Young;Oh, Seung-Hyeub
    • ETRI Journal
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    • v.27 no.5
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    • pp.473-483
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    • 2005
  • In this paper, we propose two LC voltage-controlled oscillators (VCOs) that improve both phase noise and tuning range. With both 1/f induced low-frequency noise and low-frequency thermal noise around DC or around harmonics suppressed significantly by the employment of a current-current negative feedback (CCNF) loop, the phase noise in the CCNF LC VCO has been improved by about 10 dB at 6 MHz offset compared to the conventional LC VCO. The phase noise of the CCNF VCO was measured as -112 dBc/Hz at 6 MHz offset from 5.5 GHz carrier frequency. Also, we present a bandwidth-enhanced LC VCO whose tuning range has been increased about 250 % by connecting the varactor to the bases of the cross-coupled pair. The phase noise of the bandwidth-enhanced LC-tank VCO has been improved by about 6 dB at 6 MHz offset compared to the conventional LC VCO. The phase noise reduction has been achieved because the DC-decoupling capacitor Cc prevents the output common-mode level from modulating the varactor bias point, and the signal power increases in the LC-tank resonator. The bandwidth-enhanced LC VCO represents a 12 % bandwidth and phase noise of -108 dBc/Hz at 6 MHz offset.

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Design of 3V CMOS Continuous-Time Filter Using Fully-Balanced Current Integrator (완전평형 전류 적분기를 이용한 3V CMOS 연속시간 필터 설계)

  • An, Jeong-Cheol;Yu, Yeong-Gyu;Choe, Seok-U;Kim, Dong-Yong;Yun, Chang-Hun
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.37 no.4
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    • pp.28-34
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    • 2000
  • In this paper, a continuous-time filter for low voltage and high frequency applications using fully-balanced current integrators is presented. As the balanced structure of integrator circuits, the designed filter has improved noise characteristics and wide dynamic range since even-order harmonics are cancelled and the input signal range is doubled. Using complementary current mirrors, bias circuits are simplified and the cutoff frequency of filters can be controlled easily by a single DC bias current. As a design example, the 3rd-order lowpass Butterworth filter with a leapfrog realization is designed. The designed fully-balanced current-mode filter is simulated and examined by SPICE using 0.65${\mu}{\textrm}{m}$ CMOS n-well process parameters. The simulation results show 50MHz cutoff frequency, 69㏈ dynamic range with 1% total harmonic distortion(THD), and 4㎽ power dissipation with a 3V supply voltage.

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A High Tunable Capacitor Embedding Its Electrodes in Tunable Thin Film Dielectrics (가변형 박막 유전체에 전극을 임베디드 시킨 고가 변형 커패시터)

  • Lee Young-Chul;Hong Young-Pyo;Ko Kyung-Hyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.9 s.112
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    • pp.860-865
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    • 2006
  • In this paper, a novel tunable inter-digital capacitor using dielectric tunable $Bi_2O_3-ZnO-Nb_2O_5(BZN)$ pyrochlore thin films is proposed. In order to improve the tunability and reduce DC bias voltage using the fringing electric field, the electrodes of the inter-digital capacitor are embedded in the thin film. Designed results using a 2.5 D simulator show that the tunability of the proposed inter-digital capacitor improves by 10 %, compared to the conventional inter-digital capacitor. The proposed IDC, which is based on the simulation results, was fabricated, using the BZN thin film deposited by a reactive RF magnetron sputtering on the on the silicon substrate. The fabricated inter-digital capacitor shows the maximum tunability of 50 % at 5.8 GHz and 18 V DC applied.

Chemical Reaction on Etched TaNO Thin Film as O2 Content Varies in CF4/Ar Gas Mixing Plasma

  • Woo, Jong Chang;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.2
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    • pp.74-77
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    • 2017
  • In this work, we investigated the etching characteristics of TaNO thin films and the selectivity of TaNO to $SiO_2$ in an $O_2$/CF4/Ar inductively coupled plasma (ICP) system. The maximum etch rate of TaNO thin film was 297.1 nm/min at a gas mixing ratio of O2/CF4/Ar (6:16:4 sccm). At the same time, the etch rate was measured as a function of the etching parameters, such as the RF power, DC-bias voltage, and process pressure. X-ray photoelectron spectroscopy analysis showed the efficient destruction of the oxide bonds by the ion bombardment, as well as the accumulation of low volatile reaction products on the etched surface. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the $CF_4$-containing plasmas.

A Study on the Etching Mechanism of (Ba,Sr)$TiO_3$ Thin Films using MEICP (MEICP에 의한 (Ba,Sr)$TiO_3$ 박막의 식각 메커니즘에 관한 연구)

  • Min, Byung-Jun;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04b
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    • pp.52-55
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    • 2000
  • In this study, (Ba,Sr)$TiO_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP) as a function Ar/$CF_4$ gas mixing ratio. Experiment was done by varying the etching parameters such as rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 ${\AA}/min$ under $CF_4/(CF_4+Ar)$ of 0.1, 600 W/350 V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X -ray photoelectron spectroscopy(XPS) studies shows that there are surface reaction between Ba, Sr, Ti and C, F radicals during the etching. To analyze the composition of surface residue remaining after the etching, films etched with different $CF_4$/Ar gas mixing ratio were investigated using XPS.

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Etching Characteristics BST Thin Film in $CF_4$/Ar Plasma ($CF_4$/Ar 플라즈마에 의한 BST 박막 식각 특성)

  • 김동표;김창일;서용진;이병기;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.866-869
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    • 2001
  • In this study, (Ba,Sr)TiO$_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP). Etching characteristics of BST thin films including etch rate and selectivity were evaluated as a function of the etching parameters such as gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 $\AA$/min at Ar(90)/CF$_4$(10), 600 W/350 V and 5 mTorr. The selectivity of BST to PR was 0.6, 0.7, respectively. To analyze the composition of surface residue remaining after the etching, samples etched with different CF$_4$/Ar gas mixing ratio were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). From the results of XPS and SIMS, there are chemical reaction between Ba, Sr, Ti and C, F radicals during the etching and remained on the surface.

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Circuit Design of DRAM for Mobile Generation

  • Sim, Jae-Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.7 no.1
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    • pp.1-10
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    • 2007
  • In recent few years, low-power electronics has been a leading drive for technology developments nourished by rapidly growing market share. Mobile DRAM, as a fundamental block of hand-held devices, is now becoming a product developed by limitless competition. To support application specific mobile features, various new power-reduction schemes have been proposed and adopted by standardization. Tightened power budget in battery-operated systems makes conventional schemes not acceptable and increases difficulty of the circuit design. The mobile DRAM has successfully moved down to 1.5V era, and now it is about to move to 1.2V. Further voltage scaling, however, presents critical problems which must be overcome. This paper reviews critical issues in mobile DRAM design and various circuit schemes to solve the problems. Focused on analog circuits, bitline sensing, IO line sensing, refresh-related schemes, DC bias generation, and schemes for higher data rate are covered.

The Mechanical and Optical Properties of Diamond-like Carbon Films on Buffer-Layered Zinc Sulfide Substrates

  • Song, Young-Silk;Song, Jerng-Sik;Park, Yoon
    • The Korean Journal of Ceramics
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    • v.4 no.1
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    • pp.9-14
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    • 1998
  • Diamond-like carbon(DLC) films were deposited on buffer-layered ZnS substrates by radio frequency plasma enhanced chemical vapor deposition(RF-PECVD) method. Ge and GeC buffer layera were used between DLC and ZnS substrates to promote the adhesion of DLC on ZnS substrates. Ge buffer layers were sputter deposited by RF magnetron sputtering and $GeC^1$ buffer layers were deposited by same method except using acetylene reactive gas. The relatinship between film properties and deposition conditions was investigated using gas pressure, RF power and dc bias voltage as PECVD parameters. The hardness of DLC films were measured by micro Vickers hardness test and the adhesion of DLC films on buffer-layered ZnS substrates were studied by Sebastian V stud pull tester. The optical properties of DLC films on butter-layered ZnS substrates were characterized by ellipsometer and FTIR spectroscopy.

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