• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.54.2-54.2
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• 2010

최근까지는 주로 비정질 실리콘이 디스플레이의 채널층으로 상용화 되어왔다. 비정질 실리콘 기반의 박막 트랜지스터는 제작의 경제성 및 균일성을 가지고 있어서 널리 상용화되고 있다. 하지만 비정질 실리콘의 구조적인 문제인 낮은 전자 이동도(< $1\;cm^2/Vs$)로 인하여 디스플레이의 대면적화에 부적합하며, 광학적으로 불투명한 특성을 갖기 때문에 차세대 디스플레이의 응용에 불리한 점이 있다. 이런 문제점의 대안으로 현재 국내외 여러 연구 그룹에서 산화물 기반의 반도체를 박막 트랜지스터의 채널층으로 사용하려는 연구가 진행중이다. 산화물 기반의 반도체는 밴드갭이 넓어서 광학적으로 투명하고, 상온에서 증착이 가능하며, 비정질 실리콘에 비해 월등히 우수한 이동도를 가짐으로 디스플레이의 대면적화에 유리하다. 특히 Zinc Oxide의 경우, band gap이 3.4eV로써, transparent conductors, varistors, surface acoustic waves, gas sensors, piezoelectric transducers 그리고 UV detectors 등의 많은 응용에 쓰이고 있다. 또한, a-Si TFTs에 비해 ZnO-based TFTs의 경우 우수한 소자 성능과 신뢰성을 나타내며, 대면적 제조시 우수한 균일성 및 낮은 생산비용이 장점이다. 그러나 ZnO-baesd TFTs의 경우 일정한 bias 아래에서 threshold voltage가 이동하는 문제점이 displays의 소자로 적용하는데 매우 중요하고 문제점으로 여겨진다. 특히 gate insulator와 channel layer사이의 interface에서의 defect에 의한 charge trapping이 이러한 문제점들을 야기한다고 보고되어진다. 본 연구에서는 Zinc Oxide 기반의 박막 트랜지스터를 DC magnetron sputtering을 이용하여 상온에서 제작을 하였다. 또한, $Si_3N_4$ 기판 위에 electron cyclotron resonance (ECR) $O_2$ plasma 처리와 plasma-enhanced chemical vapor deposition (PECVD)를 통하여 $SiO_2$ 를 10nm 증착을 하여 interface의 개선을 시도하였다. 그리고 TFTs 소자의 출력 특성 및 전이 특성을 평가를 하였고, 소자의 field effect mobility의 값이 향상을 하였다. 또한 Temperature, Bias Temperature stability의 조건에서 안정성을 평가를 하였다. 이러한 interface treatment는 안정성의 향상을 시킴으로써 대면적 디스플레의 적용에 비정질 실리콘을 대체할 유력한 물질이라고 생각된다.

• 한국재료학회지
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• 제23권4호
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• pp.215-218
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• 2013

Vanadium dioxide ($VO_2$) is an attractive material for smart window applications where the transmittance of light can be automatically modulated from a transparent state to an opaque state at the critical temperature of ${\sim}68^{\circ}C$. Meanwhile, F : $SnO_2$ (F-doped $SnO_2$, FTO) glass is a transparent conductive oxide material that is widely used in solar-energy-related applications because of its excellent optical and electrical properties. Relatively high transmittance and low emissivity have been obtained for FTO-coated glasses. Tunable transmittance corresponding to ambient temperature and low emissivity can be expected from $VO_2$ films deposited onto FTO glasses. In this study, FTO glasses were applied for the deposition of $VO_2$ thin films by pulsed DC magnetron sputtering. $VO_2$ thin films were also deposited on a Pyrex substrate for comparison. To decrease the phase transition temperature of $VO_2$, tungsten-doped $VO_2$ films were also deposited onto FTO glasses. The visible transmittance of $VO_2$/FTO was higher than that of $VO_2$/pyrex due to the increased crystallinity of the $VO_2$ thin film deposited on FTO and decreased interface reflection. Although the solar transmittance modulation of $VO_2$/FTO was lower than that of $VO_2$/pyrex, room temperature solar transmittance of $VO_2$/FTO was lower than that of $VO_2$/pyrex, which is advantageous for reflecting solar heat energy in summer.

• 한국재료학회지
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• 제9권5호
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• pp.509-514
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• 1999

Interest in the integrated capacitors, which make it possible to reduce the size of and to obtain improved electrical performance of an electronic system, is expanding. In this study, $Ta_2$O\ulcorner thin film capacitors for MCM integrated capacitors were fabricated on a Upilex-S polymer film by DC magnetron reactive sputtering and the effects of low temperature annealing at various atmospheres and substrate surface morphology on the capacitor characteristics were discussed. The low temperature($150^{\circ}C$) annealing produced improved capacitor yield irrespective of the annealing at mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably due to the change of the $Ta_2$O\ulcorner film surface by oxygen, which was explained by conduction mechanism study. Leakage current and breakdown field strength of the capacitors fabricated on the Upilex-S film were 7.27$\times$10\ulcornerA/$\textrm{cm}^2$ and 1.0 MV/cm respectively. These capacitor characteristics were inferior to those of the capacitors fabricated on the Si substrate but enough to be used for decoupling capacitors in multilayer package. Roughness Analysis of each layer by AFM demonstrated that the properties of the capacitors fabricated on the polymer film were affected by the surface morphology of the substrate. This substrate effect could be classified into two factors. One is the surface morphology of the polymer film and the other is the surface morphology of the metal bottom electrode determined by the deposition process. Therefore, the control of the two factors is important to obtain improved electrical of capacitors deposited on a polymer film.

• 한국표면공학회지
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• 제29권6호
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• pp.683-690
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• 1996

In this study, the diffusion barrier properties of $1000 \AA$ thick molybdenum compounds (Mo, Mo-N, $MoSi_2$, Mo-Si-N) were investigated using sheet resistance measurements, X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), Scanning electron microscopy (SEM), and Rutherford backscattering spectrometry (RBS). Each barrier material was deposited by the dc magnetron sputtering, and annealed at 300-$800^{\circ}C$ for 30min in vacuum. Mo and $MoSi_2$ barrier were failed at low temperature due to Cu diffusion through grain bound-aries and defects of Mo thin film and the reaction of Cu with Si within $MoSi_2$ respectively. A failure temperature could be raised to $650^{\circ}C$-30min in the Mo barrier system and to $700^{\circ}C$-30min in the Mo-silicide system by replacing Mo and $MoSi_2$ with Mo-N and Mo-Si-N, respectively. The crystallization temperature in the Mo-silicide film was raised by the addition of $N_2$. It is considered that not only the N, stuffing effect but also the variation of crystallization temperature affects the reaction of Cu with Si within Mo-silicide. It was found that Mo-Si-N is more effective barrier than Mo, $MoSi_2$, or Mo-N to copper penetration preventing Cu reaction with the substrate for 30min at a temperature higher than $650^{\circ}C$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.69-69
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• 2017

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. There effluents are mainly treated by conventional technologies such are aerobic, anaerobic treatment and chemical coagulation. But, there processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These techniques include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that show higher purification results and low toxic sludge. There are many kinds of electrode materials for electrochemical process, among them, boron doped diamond (BDD) attracts attention due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD, among them, researches are focused BDD on Si substrate. But, Si substrate is hard to apply electrode application due to the brittleness and low life time. And other substrates are also not suitable for wastewater treatment electrode due to high cost. To solve these problems, Ti has been candidate as substrate in consideration of cost and properties. But there are critical issues about adhesion that must be overcome to apply Ti as substrate. In this study, to overcome this problem, TiN interlayer is introduced between BDD and Ti substrate. TiN has higher electrical and thermal conductivity, melting point, and similar crystalline structure with diamond. The TiN interlayer was deposited by reactive DC magnetron sputtering (DCMS) with thickness of 50 nm, $1{\mu}m$. The microstructure of BDD films with TiN interlayer were estimated by FE-SEM and XRD. There are no significant differences in surface grain size despite of various interlayer. In wastewater treatment results, the BDD electrode with TiN (50nm) showed the highest electrolysis speed at livestock wastewater treatment experiments. It is thought to be that TiN with thickness of 50 nm successfully suppressed formation of TiC that harmful to adhesion. And TiN with thickness of $1{\mu}m$ cannot suppress TiC formation.

• 한국재료학회지
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• 제13권6호
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• pp.369-373
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• 2003

Magneto-optic Kerr Effect(MOKE), AFM and magnetoresistance measurements have been carried out on as-deposited and annealed Magnetic Tunnel Junctions(MTJs) with junction sizes 180, 250, 320 and 380 $\mu\textrm{m}$ in order to investigate the correlation among interlayer exchange coupling, surface roughness and junction size. Relatively irregular variations of coercivity $H_{c}$ (∼17.5 Oe) and interlayer exchange coupling $H_{E}$ (∼17.5 Oe) are observed over the junction in as-deposited sample prepared by DC magnetron sputtering. After annealing at $200^{\circ}C$, $H_{c}$ decreases to 15 Oe, while $H_{ E}$ increases to 20 Oe with smooth local variation. $H_{E}$ shows very good correlation with surface roughness across the junction in agreement with Neel's orange peel coupling. The increasing slope per $\mu\textrm{m}$ of normalized $H_{c}$ and $H_{E}$ are same near junction edge along free-layer direction irrespective of junction size, giving relatively uniform $H_{c}$ and $H_{ E}$ for wider junction size. Thickness profiles of the junctions measured with $\alpha$-step show increasingly flat top surface for larger junctions, indicating better uniformity for large. junctions in agreement with the normalized$ H_{c}$ and H$/_{E}$ curves. TMR ratios also increase with increasing junction size, indicating improvement for larger uniform junctions.

• 한국표면공학회지
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• 제43권5호
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• pp.238-242
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• 2010

In the present work, the influence of oxide on the Cr-Si-N coatings was investigated for the Cr-Si-O-N coatings on AISI 304 and Si wafer deposited by hybrid system, which combines the DC magnetron sputtering technique and arc ion plating (AIP) using Cr and Si target in an $Ar/N_2/O_2$ gaseous mixture. As the O content in the Cr-Si-N coatings increased, the diffraction patterns of the Cr-Si-O-N coatings showed CrN and $Cr_2O_3$ phases. However, as the O content increased to 28.8 at.%, diffraction peak of $Cr_2O_3$ was disappeared in the Cr-Si-O-N coating. The $d_{200}$ value was decreased with increasing of O content. The average grain size increased from about 40 nm to 65 nm as the O content increased. The maximum micro-hardness of the Cr-Si-O-N coating was obtained 4507 Hk at the O content of 24.8 at.%. The average friction coefficient of the Cr-Si-O-N coatings was gradually decreased by increasing the O content and the average friction coefficient decreased from 0.37 to 0.25 by increasing the O content. These results indicated that amorphous phase was increased in the Cr-Si-O-N coatings by increasing of O content.

• 한국표면공학회지
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• 제53권3호
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• pp.104-108
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• 2020

ZnO single layer films (100 nm thick) and Au intermediated ZnO films (ZnO/Au/ZnO; ZAZ) were deposited on the glass substrate by RF and DC magnetron sputtering at room temperature and then the influence of the Au interlayer on the electrical and optical properties of the films were investigated. ZnO thin films show the visible transmittance of 90.3 % and sheet resistance of 63.2×10⁸ Ω/□. In ZAZ films, as Au interlayer thickness increased from 6 to 10 nm, the sheet resistance decreased from 58.3×10⁸ to 48.6 Ω/□, and the visible transmittance decreased from 84.2 to 73.9 %. From the observed results, it can be concluded that the intermediate Au thin film enhances the opto-electrical performance of ZnO films without intentional substrate heating.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.394-394
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• 2011

급속한 산업의 발달은 심각한 환경오염 및 에너지 문제를 가져왔다. 이를 해결하기 위하여 무한한 에너지원인 태양에너지를 원천으로 하는 친환경 정화소재로서의 광촉매(photocatalyst)를 통하여 인류의 에너지를 확보하는 것에 대한 관심이 급격하게 증가하고 있는 추세이다. 현재 광촉매로 가장 많이 사용되는 $TiO_2$의 경우 뛰어난 광활성과 저렴한 가격, 광 안정성, 화학적 안정성을 가짐에도 불구하고, 3.2 eV라는 상대적으로 넓은 band gap을 가지기 때문에 약 386 nm보다 짧은 파장을 갖는 자외선만 흡수할 수 있다. 이로 인한 가시광 응답성의 부재를 해결하기 위해 수십년간 많은 연구가 진행되어 왔다. 따라서 본 연구에서는 ICP assisted pulsed DC reactive magnetron sputtering을 이용하여 $TiO_2$를 기반으로 하면서 가시광영역의 빛을 흡수하여 높은 효율을 얻을 수 있도록 Nitrogen doping, Low band gap semi-conductor sensitization 등의 방법을 사용하여 광촉매를 제작하였다. 시료의 chemical state와 crystallinity를 확인하기 위하여 X-ray photoelectron spectroscopy와 X-ray diffraction method를 이용하여 분석을 수행하였으며, 이러한 공정을 통해 제작된 $TiO_2$기반 광촉매의 가시광 응답성을 확인하기 위하여 UV/Vis 스펙트럼을 측정하였다. 또한 물 분해 장치(water splitting device)를 제작하여 수소와 산소 생성시 흐르는 전류를 측정하여 광특성을 평가하였다.

• 한국재료학회지
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• 제8권12호
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• pp.1152-1157
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• 1998

금속 타겟들을 이용한 반응성 스퍼터링법으로 $460~540^{\circ}C$범위에서 $Pt/Ti/SiO_2$/Si 기판위에 PZT 박막을 증착하였다. Perovskite상의 핵형성을 위해 Pb 휘발이 적은 저온($480^{\circ}C$)에서 짧은 시간 동안 PZT 박막을 증착한 후 Pb가 PBT 박막내에 과잉으로 함유되는 것을 억제하기 위하여 증착 온도를 증가시켜 박막을 증착하는 2단계 증착법을 사용한 결과 54$0^{\circ}C$의 고온에서도 perovskite 단일상과 화학양론비에 가까운 조성을 얻을 수 있었다. 2단계 증착법으로 제조된 PZT 박막은 우수한 전기적 특성을 나타내었으며 후속 RTA 처리로 더욱 특성을 향상시킬 수 있었는데 $17\mu$C/$\textrm{cm}^2$의 잔류분극, 45kv/cm의 coercive field, 그러고 -500kv/cm의 높은 전기장에서도 $10^{-4}$ A/$\textrm{cm}^2$의 양호한 누설전류 특성을 나타내었다.