• Applied Science and Convergence Technology
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• v.23 no.6
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• Progress in Superconductivity
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• v.8 no.1
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• pp.22-26
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• 2006

Total Fluorine content in the precursor solution for MOD processing of YBCO coated conductors can be significantly reduced by synthesizing precursor solution with F-free Y & Cu precursor and Barium trifluoroacetate(TFA). It was shown that crack-free and uniform precursor films were formed after calcinations in humidified oxygen atmosphere. Less than 2 hours are required to finish the calcination process, and XRD measurement shows that $BaF_2,\;CuO,\;and\;Y_2O_3$ are major constituent of calcined precursor films. Film thickness after calcination was measured to be ${\sim}2.8$ um by applying slot-die coating method. In particular, addition of Samarium shows critical current of Ic=226 A/cm-w($Jc=3.4\;MA/cm^2$). Also discussed are recent developments in the reel-to-reel processing using F-free Y & Cu precursor solutions. It is shown that uniform and fast processing route to YBCO coated conductor with high Ic can be provided by employing F-free Y & Cu precursor solutions in MOD process.

• Progress in Superconductivity and Cryogenics
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• v.9 no.1
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• pp.1-4
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• 2007

The total Fluorine content in the precursor solution for MOD processing of YBCO coated conductors can be significantly reduced by synthesizing precursor solution with F-free Y & Cu precursor and Barium trifluoroacetate(TFA). It was shown that crack-free and uniform precursor films were formed after calcinations in humidified oxygen atmosphere. Less than 2 hours are required to finish the calcinations process and XRD measurement shows that $BaF_2,\;CuO,\;Y_2O_3$ are major constituent of calcined precursor films. Film thickness after calcinations was improved to be 2.8um by applying slot-die coating method. In particular, addition of Samarium shows critical current of $I_c=273A/cm-w(J_c=3.8MA/cm^2)$. It is shown that uniform and fast processing route to YBCO coated conductor with high Ic can be provided by employing F-free Y & Cu precursor solution in MOD process.

• Korean Journal of Environmental Agriculture
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• v.14 no.3
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• pp.263-271
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• 1995

Chemical assessment of soil pollution with heavy metals was made by analyzing the changes in pH, ionic strength, cationic concentration and chemical species in the soil solution. Saturated pastes of the unpolluted soils were made by adding solutions containing Cu or Cd and the final Cu or Cd concentrations were in the range of 0 to 400 mg/kg. After equilibrating for 24 hours at $25^{\circ}C$, the soil solution was extracted from the saturated pastes by the vacuum extraction method and analyzed for pH, electrical conductivity, Cu, Cd, cations and inorganic ligands. Chemical species in soil solution were calculated by the GEOCHEM-PC program employing the input variables of pH, ionic strength(${\mu}$), molar concentrations of cations and ligands. Increasing Cu or Cd additions lowered pH of the soil solution but increased concentrations of Ca, Mg and K resulting in increases of ${\mu}$ of the soil solution. Effects of Cu on lowering pH and increasing ${\mu}$ were greater than those of Cd. Concentrations of Cu or Cd in soil solution were relatively very low as compared to those of additions, but increased linearly with increasing additions representing that concentrations of Cu were higher than those of Cd. At 400 mg/kg additions, concentrations of Cu were in the range of 0.51 to 11.70 mg/L but those of Cd were 34.4 to 88.5 mg/L. Major species of Ca, Mg and K were free ions and these species were equivalent to greater than 95 molar % of the existing respective molar concentrations. These cationic species were not changed by Cu or Cd additions. Major species of Cu in lower pH soils such as SiCL and SL were free $Cu^{2+}$ (>95 molar %), but those in LS having a higher pH were free $Cu^{2-}$ and Cu-hydroxide complex. At 100 mg Cu/kg treatment, $Cu^{2+}$ and Cu-hydroxide complex were equivalent to 73 and 22.4 molar %, respectively. These respective percentages were decreased and increased correspondingly with increasing Cu treatments. Major species of Cd in soil solution were free $Cd^{2+}$ and Cd-chloride complex, representing 79 to 85 molar % for $Cd^{2+}$ and 13 to 20% for Cd-chloride complex at 10 mg Cd/kg treatment. With increasing Cd additions to 400 mg/kg, $Cd^{2+}$ species decreased to $40{\sim}47%$ but Cd-chloride complexes increased to $53{\sim}60$ molar %. These results demonstrated that soil contamination with heavy metals caused an adverse effect on the plant nutritional aspects of soil solution by lowering pH, increasing cations temporarily, and increasing free metal concentrations and species enough to be phytotoxic.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.58-61
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• 2002

In this paper, we present a new generalized k-Tree-based (CU/PE) allocation model to perform dynamic resource (CU/PE) allocation/deallocation decision for the reconfigurable MSIMD/MIMD multi-dimensional (k-D) mesh-connected architectures. Those reconfigurable multi-SIMD/MIMD systems allow dynamic modes of executing tasks, which are SIMD and MIMD. The MIMD task requires only the free sub-system; however the SIMD task needs not only the free sub-system but also the corresponding free CU. In our new k-Tree-based (CU/PE) allocation model, we introduce two best-fit heuristics for the CU allocation decision: 1) the CU depth first search (CU-DFS) in O(kN$_{f}$ ) time and 2) the CU adjacent search (CU-AS) in O(k2$^{k}$ ) time. By the simulation study, the system performance of these two CU allocation strategies was also investigated. Our simulation results showed that the CU-AS and CU-DFS strategies performed the same system performance when applied for the reconfigurable MSIMD/MIMD 2-D and 3-D mesh-connected architectures.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.41-45
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• 2011

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.

• Progress in Superconductivity and Cryogenics
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• v.1 no.1
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• pp.7-14
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• 1999

Wekk oriented $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ suppercondcting thick films were fabricared on copper tape by LiReac-PreCu (liquid reaction between a Cu-free precousor and Cu tape) method. Cu-free precursor power which is composed of $Bi_{2}Sr_{2}Ca_{5}$ was printed on a copper tape by screen printing and was heat-treated. The speciment were partially in a molten state at the heat treatment temperature (85$0^{\circ}C$~87$0^{\circ}C$). The heat heat treatments for the reaction were performed in air or low oxygen pressure in several stages. XRD analyses of the resulting Bi2Sr2CaCu2O8 superconducting tapes show that the $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ phase is dominant and a small amount of $Bi_{2} Sr_{2} Cu_{2} O_{6}$ phase is detected. Both phases are aligned in the c-axis direction.

• Journal of Dairy Science and Biotechnology
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• v.22 no.2
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• pp.91-97
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• 2004

The antioxidative ability on the basis of reduced glutathione sulphydryl(GSH) level, the inhibition activities of linoleic acid peroxidation of cell free extract of Lactobacillus spp. and Bacillus spp. have been determined; Lactobacillus casei CU4114 contained the highest level of GSH among the probiotic strains with 25.15 ${\mu}$mole/g. Significantly high level of GSH occured in the intracellular cell free extract of Lactobacillus rhamnosus CU4201, Lactobacillus plantarum CU4203. The antioxidant activity and inhibition of linoleic acid peroxidation of cell free extract of Lactobacillus spp. and Bacillus spp. by thiobarbituric acid(TBA) assay have been shown to be significantly differed depending on the strains(P>0.01). Intracellular cell free extracts of L. acidophilus CU4111, L. casei CU4114, and strains of Bacillus coacillus revealed a significantly intensive inhibitory activity in the linoleic acid peroxidation reactions. Spearmans' rank correlation between inhibitory activity on linoleic acid peroxidation and cellular GSH levels of Lactobacillus spp. was analysed and the correlation quotient was 0.65 which means a significant positive correlation.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.93-98
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• 2005

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.