Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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A Characteristics of Zn-Al-Cu System Pb-free Solder Alloys for Ultra High Temperature Applications

초고온용 Zn-Al-Cu계 Pb-free 솔더 합금의 특성

  • Kim Seong-Jun (Dept. of Material Science and Engineering, Pusan national University) ;
  • Na Hye-Seong (Dept. of Material Science and Engineering, Pusan national University) ;
  • Han Tae-Kyo (Dept. of Material Science and Engineering, Pusan national University) ;
  • Lee Bong-Keun (Dept. of Material Science and Engineering, Pusan national University) ;
  • Kang Cung-Yun (Dept. of Material Science and Engineering, Pusan national University)
  • 김성준 (부산대학교 공과대학 재료공학과) ;
  • 나혜성 (부산대학교 공과대학 재료공학과) ;
  • 한태교 (부산대학교 공과대학 재료공학과) ;
  • 이봉근 (부산대학교 공과대학 재료공학과) ;
  • 강정윤 (부산대학교 공과대학 재료공학과)
  • Published : 2005.12.01
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Abstract

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.

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References

  1. C. M. Carlin et al., 2nd Int. High-ternperature electronics conf., Charlotte, NC, June 1994, 19-26
  2. R. K. Kirschman, IEEE Press, NY, 1999
  3. O. Vermesan. et al., SINTEF Report, STF72F02617, Oslo, Norway, 2002
  4. O. Vermesan, et al., SINTEF Report, STF72F02619, Oslo, Norway, 2002
  5. T. Veneruso, International High Temperature Electronics Conference, Albuquerque, NM, June 1991
  6. P. G. Neudeck, et al., IEEE 2002, Proceedings of IEEE, 90-6, 1065-1076
  7. P. L. Dreike, et al., IEEE Trans. Comp., Packag., Manufact. Technol. A, Vol. 17, 594-609 https://doi.org/10.1109/95.335047
  8. W. Wondrak, Microelectronics Reliability(1999), Vol. 39, 1113-1120 https://doi.org/10.1016/S0026-2714(99)00158-4
  9. P. T. Vianco, Solder Technology for Ultra High Temperatures, AWS, Welding Journal, 81-10, 51-55
  10. H. Schumann, Metallographie, Deutscher Verlag fur Grundstoffindustrie(1991), 505-511
  11. G. Petzow, et al., Ternary Alloys, A Comprehensive compendium of Evaluated Constitutional Data and Phase diagrams, Vol. 4(1988), 92-110