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K. H. Shin, H. T. Kim, and D. Y. Jang : An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages, Journal of the KSMTE (2007), 16-5, 134-139 (in Korean)
과학기술학회마을
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J. W. Nah, J. H. Kim, H. M. Lee and K. W. Paik : Electromigraion in flip chip solder bump of 97PB- 3Sn/37Pb-63Sn combination structure, Acta Materialia (2004), 52, 129-136
DOI
ScienceOn
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X. Li and Z. Wang : Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies, Journal of Materials Processing Technology (2007), 183-1, 6-12
DOI
ScienceOn
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ASTM E 8M-04, Standard Test Methods for Tension Testing of Metallic Materials [Metric] (2004)
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A. Shed : Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joint, Proceedings of 54th ECTC (2004), Las Vegas, Nevada, USA, 737-746
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J. S. Jeong, Y. S. Lee, K. H. Shin, S. K. Cheong, J. H. Kim and D. Y. Jang : An Experimental Study on the Failure Characteristics of Sn-xAg-Cu Lead Free Solder, Journal of the KSMTE (2009), 18-5, 449- 454 (in Korean)
과학기술학회마을
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Y. S. Lee, J. S. Jeong, H. S. Kim and K. H. Shin, : An Experimental Study on the Failure Characteristics of Flip Chips in Cylic Bending Test, Journal of the KSMTE (2009), 18-4, 362-368 (in Korean)
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F. X. Che, E. C. Poh. W.H. Zhu, B. S. Xiong : Ag Content Effect on Mechanical Properties of Sn-xAg- 0.5Cu Solders, Proceedings of 9th ECTC (2007), 713-718
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