A Characteristics of Zn-Al-Cu System Pb-free Solder Alloys for Ultra High Temperature Applications |
Kim Seong-Jun
(Dept. of Material Science and Engineering, Pusan national University)
Na Hye-Seong (Dept. of Material Science and Engineering, Pusan national University) Han Tae-Kyo (Dept. of Material Science and Engineering, Pusan national University) Lee Bong-Keun (Dept. of Material Science and Engineering, Pusan national University) Kang Cung-Yun (Dept. of Material Science and Engineering, Pusan national University) |
1 | C. M. Carlin et al., 2nd Int. High-ternperature electronics conf., Charlotte, NC, June 1994, 19-26 |
2 | O. Vermesan. et al., SINTEF Report, STF72F02617, Oslo, Norway, 2002 |
3 | T. Veneruso, International High Temperature Electronics Conference, Albuquerque, NM, June 1991 |
4 | P. G. Neudeck, et al., IEEE 2002, Proceedings of IEEE, 90-6, 1065-1076 |
5 | P. T. Vianco, Solder Technology for Ultra High Temperatures, AWS, Welding Journal, 81-10, 51-55 |
6 | P. L. Dreike, et al., IEEE Trans. Comp., Packag., Manufact. Technol. A, Vol. 17, 594-609 DOI ScienceOn |
7 | H. Schumann, Metallographie, Deutscher Verlag fur Grundstoffindustrie(1991), 505-511 |
8 | W. Wondrak, Microelectronics Reliability(1999), Vol. 39, 1113-1120 DOI ScienceOn |
9 | R. K. Kirschman, IEEE Press, NY, 1999 |
10 | O. Vermesan, et al., SINTEF Report, STF72F02619, Oslo, Norway, 2002 |
11 | G. Petzow, et al., Ternary Alloys, A Comprehensive compendium of Evaluated Constitutional Data and Phase diagrams, Vol. 4(1988), 92-110 |