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A Characteristics of Zn-Al-Cu System Pb-free Solder Alloys for Ultra High Temperature Applications  

Kim Seong-Jun (Dept. of Material Science and Engineering, Pusan national University)
Na Hye-Seong (Dept. of Material Science and Engineering, Pusan national University)
Han Tae-Kyo (Dept. of Material Science and Engineering, Pusan national University)
Lee Bong-Keun (Dept. of Material Science and Engineering, Pusan national University)
Kang Cung-Yun (Dept. of Material Science and Engineering, Pusan national University)
Publication Information
Journal of Welding and Joining / v.23, no.6, 2005 , pp. 93-98 More about this Journal
Abstract
The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.
Keywords
Pb-free solder; Ultra high temperature; Zn-Al-Cu system solder; Alloy design; melting range; spreadabiligy; Microstructures; Hardness; Tensile propert;
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