• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.79-83
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• 2006

The first quantitative structure determination has been obtained for Cu(100)/glycine $(NH_2CH_3COOH)$. The molecule is adsorbed on the surface via two functional groups: the nitrogen of the amino group and one or both two oxygen atoms of the carboxylate group are bonded in near atop site. The Cu-N is tilted $5^{\circ}\pm4^{\circ}C$, away from the surface normal whilst the Cu-O is tilted by $9^{\circ}\pm2^{\circ}C$. The chemical bonding lengths are determined with $2.05\pm0.02\;{\AA}$ for both Cu-N and Cu-O. This bonding geometry is similar to that of glycine on Cu(110). A reanalysis of O Is from the Cu(110)$(2\times3)$pg-glycine show two oxygen atoms are inequivalent, with one being offset $0.29\;{\AA}$ more than the other.

• Journal of the Korean institute of surface engineering
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• v.46 no.5
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• pp.208-215
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• 2013

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

• Journal of Welding and Joining
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• v.15 no.4
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• pp.90-98
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• 1997

A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of friction pressure on bonding strength and a charicteristic of fracture. The tensile strength of the friction welded joint was increased up to 90% of the Cu base metal under the condition of friction time 1.2 sec, friction pressure 4.5kgf/$\textrm{mm}^2$ and upset pressure 10kgf/$\textrm{mm}^2$. From the results of fracture surface analysis, the increase of friction pressure could remarkably decrease the force and the time to be normally acted on weld interface. The W particles which were included in the plastic zone of Cu side could induce fracture adjacent to the weld interface because their existance in Cu induces a decrease in available section area and an increase in notch effect. Therefore, the tensile strength was decreased at high friction pressure (6kgf/$\textrm{mm}^2$) because the destruction of W was increased by an increase in mechanical force and crack was formed at weld interface.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Korean Journal of Materials Research
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• v.6 no.2
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• pp.158-165
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• 1996

열증착기(thermal evaporator)로 증착시킨 Cu를 상온에서 3.5M CuCl2+0.5M HCI+0.5MKCI 용액을 사용하여 습식각하고 2일간 대기중 노출시킨 후 X-선 광전자 분광기를 이용하여 표면의 결합상태를 관찰하였다. 그 결과 습식식각된 Cu 표면에서는 C, O, Ci 및 Cu가 존재함을 알 수 있었다. 표면원소에 대한 오제이 전자 스펙트라(Auger electron spectra)와 광전자 스펙트라(photoelectron spectra)의 정량적인 비교를 통하여 표면의 모든 결합상태를 확인할 수 있었고 그 상대적인 양까지도 얻어낼 수 있었다. 식각된 Cu의 표면에는 Cu-Cu, 2Cu-O, Cu-Ci, Cu-2(OH), 및 Cu-2Cl의 결합상태가 존재함을 알 수 있었고, CuLMMAuger line spectrum의 관찰을 통하여 계산된 각 결합의 정량적인 비교를 검증할 수 있었다. 따라서 chemical shift가 거의 관찰되지 않아 결합상태 분리가 불가능한 식각된 구리표면의 정량적 결합상태는 각 결합상태의 상대적 비교를 통하여 얻어질 수 있음을 알 수 있었다.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.26-39
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• 1992

Diffusion bonding of Mo was performed by using the metallic coating of Cu and Cr on the surface to be bonded. Joint characteristics of Mo with or without coating layer were compared in metallurgical and fractograpical aspects. The results showed that the diffusion bonding with coating layer, especially with Cu coating, increased the bending strength of joint. Variation of heating cycle(elevation of temperature for a moment) did not affect significantly the mechanical properties of joint. Fractographical analysis showed that the fracture of joint bonded with Cr coating occurred at the coating layer, while that with Cu coating occurred at the base metal.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.432-436
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• 2009

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.