• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• 열처리공학회지
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• 제34권2호
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• pp.66-74
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• 2021

Cladding material, which can selectively obtain excellent properties of different metals, is a composite material that combines two or more types of dissimilar metals into one plate. The titanium-copper cladding material between titanium which has excellent corrosion resistance and copper which has high thermal and electrical conductivity, are highly valuable composite materials. It can be used as heat exchangers with high conductivity under severe corrosion conditions. In order to apply the clad plate to the heat exchanger, it must be manufactured in the form of a tube and additional welding is required. It is important to select the cladding material manufacturing process and the welding process. The process of manufacturing the cladding material includes extrusion, rolling, and explosive bonding. Among them, the explosive bonding process is suitable for additional welding because no heat-affected zone is formed. In this study TIG welding of the explosive-bonded dissimilar clad plates was successfully performed by butt welding. The microstructures and bonding interface of the welded part were observed, and the effect of the bonding layer at the welding interface and the intermetallic compounds on the mechanical properties and tensile plastic deformation behaviors were analyzed. And also the integrity of TIG-welded dissimilar part was evaluated.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.41-48
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• 2018

Fan-out wafer level packaging (FOWLP) 적용을 위한 최적의 Cu 재배선 계면접착에너지 측정방법을 도출하기 위해, 전기도금 Cu 박막과 WPR 절연층 계면의 정량적 계면접착에너지를 $90^{\circ}$ 필 테스트, 4점 굽힘 시험법, double cantilever beam (DCB) 측정법을 통해 비교 평가 하였다. 측정 결과, 세 가지 측정법 모두 배선 및 패키징 공정 후 박리가 일어나지 않는 산업체 통용 기준인 $5J/m^2$보다 높게 측정되었다. 또한, DCB, 4점 굽힘 시험법, $90^{\circ}$ 필 테스트 순으로 계면접착에너지가 증가하는 거동을 보였는데, 이는 계면파괴역학 이론에 의해 위상각 증가에 따라 이종재료 계면균열 선단의 전단응력성분 증가에 따른 소성변형에너지 및 계면 거칠기 증가 효과에 의한 것으로 설명이 가능하다. FOWLP 재배선에 대한 최적의 계면접착에너지 도출을 위해서는 시편제작 공정, 위상각 차이, 정량적 측정 정확도 및 결합력 크기 등을 고려하여 4점 굽힘 시험법 또는 DCB 측정법을 적절히 혼용 사용하는 것이 타당한 것으로 판단된다.

• 대한화학회지
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• 제29권3호
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• pp.239-246
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• 1985

[Cu(dl-trans-[14]-diene)]$^{2+}$ 착이온과 음이온(L$^{n-}$ = S$_2$O$_3^{2-}$, SCN$^-$, I$^-$, NO$_2^-$)사이의 화학평형 관계를 온도 15 ~ 35$^{\circ}C$, 압력 1 ~ 1500bar 범위에서 분광광도법으로 연구하였다. S$_2$O$_3^{2-}$, SCN$^-$, I$^-$ 및 NO$_2^-$일때 평형상수 K는 25$^{\circ}C$, 1500bar에서 각각 3.0, 1.9, 0.6 및 0.5이었다. K값은 온도와 압력이 증가함에 따라 감소하였다. K에 대한 온도 영향으로 부터 열역학적 파라메터(${\Delta}G^{\circ}$, ${\Delta}H^{\circ}$, ${\Delta}S^{\circ}$)를 계산하였으며, 이 결과 NO$_2^-$이온을 제외한 다른 이온(S$_2$O$_3^{2-}$, SCN$^-$, I$^-$)에서는 모두 발열반응으로 나타났다. K에 대한 압력 영향에서 얻은 반응체적변화(${\Delta}$V)는 각 음이온에서 모두 양의 값이었다. S$_2$O$_3^{2-}$ 이온일 때 1,500, 1,000 및 1,500bar에서의 ${\Delta}$V(cm$^3$/mole)는 각각 26,22,19 및 16이었고, 상압에서 S$_2$O$_3^{2-}$, SCN$^-$, I$^-$ 및 NO$_2^-$이온일 때 ${\Delta}$V(cm$^3$/mole)는 각각 26, 30, 64 및 45이었다. S$_2$O$_3^{2-}$이온인 경우 Fuoss식에 의하여 계산한 평형상수와 실험치를 비교하여 Cu(Ⅱ) 착이온과 L$^{n-}$간의 결합성을 고찰하였다.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.63-67
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• 2011

본 연구에서는 interlayer로 Sn을 사용하여 경성 인쇄 회로 기판(Rigid printed circuit board, RPCB)과 연성 인쇄 회로 기판(Flexible printed circuit board, FPCB) 간의 열압착 접합(Thermo-compression bonding) 조건을 최적화하는 연구를 진행하였다. 접합에 앞서 FPCB를 다양한 온도와 시간조건 하에서 Sn이 용융된 솔더 배스 안에서 침지(Dipping) 공정을 수행하였고, 열압착법을 이용하여 FPCB와 RPCB의 접합을 수행하였다. FPCB/RPCB 접합부의 접합 강도를 $90^{\circ}$ 필 테스트(Peel test)를 이용하여 측정하였다. 그 결과 $270^{\circ}C$, 1s의 침지 조건에서 FPCB의 polyimide(PI)와 Cu 전극 계면에서 파단되고, 이때, 최대 박리 강도를 얻었다. FPCB와 RPCB의 열압착 접합시 주요 변수로는 압력, 온도, 시간이 있으며, 특히 온도의 증가에 따라 접합 강도가 크게 증가하였다. 접합부 계면 관찰 결과, 접합 온도와 시간이 증가함에 따라 접합 면적이 증가하였으며, 이로 인해 접합 강도가 증가하는 것으로 사료된다. 필 테스트 과정에서 나타나는 F-x(Forcedisplacement) 곡선을 토대로 산출한 파괴 에너지와 접합 강도는 $280^{\circ}C$, 10s의 접합 조건에서 가장 높게 나타났으며, 이 조건이 최적 접합 조건으로 도출되었다.

• 한국초전도ㆍ저온공학회논문지
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• 제1권2호
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• pp.1-7
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• 1999

we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.

• Biotechnology and Bioprocess Engineering:BBE
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• 제10권3호
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• pp.205-211
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• 2005

Water-soluble polyethyleneimine (PE) derivatives containing nucleic acid bases and hydrophilic amino acids such as homoserine (Hse) and serine were prepared by the activated ester method as nucleic acid models. From spectroscopic measurements, the polymers were found to interact with DNA accompanied by an induction of conformational change. Hypochromicity in UV spectra indicated that a stable polymer complex was formed between poly (A) with PEI­Hse-Ura by complementary hydrogen bonding with equimolar nucleic base units (adenine:uracil=1:1). The induced conformation of DNA by the interaction with the polymer containing uracil and homoserine (PEI-Hse-Ura) was concluded to be a super triple helical structure. The formation of the polymer complex, DNA: PEI-Hse-Ura, was found to be affected by the presence of metal ions such as $Ca^{2+}\;and\;Cu^{2+}$.

• 대한기계학회논문집B
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• 제30권12호
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• pp.1196-1202
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• 2006

A MEMS methanol reformer was fabricated and its performance was evaluated in the present study. Catalytic steam reforming of methanol was selected because the process had been widely applied in macro scale reformers. Conventional Cu/ZnO catalyst that was prepared by co-precipitation method to give the highest coating quality was used. The reactor structure was made by bonding three layers of glass wafers. The internal structure of the wafer was fabricated by the wet-etching process that resulted in a high aspect ratio. The internal surface of the reactor was coated by catalyst and individual wafers were fusion-bonded to form the reactor structure. The internal volume of the microfabricated reactor was $0.3cm^3$ and the reactor produced exhaust gas with hydrogen concentration at 73%. The production rate of hydrogen was 4.16 ml/hr that could generate power of 350 mW in a typical PEM fuel cell.

• Journal of Welding and Joining
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• 제32권3호
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• 한국주조공학회지
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• 제14권5호
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• pp.429-437
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• 1994

Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.