A Study of Joining Method of BSCCO(2223) Tape

BSCCO(2223) 초전도 선재의 접합공정 연구

  • Published : 1999.10.01

Abstract

we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.

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References

  1. High Tc Information Service v.6 no.6
  2. 1994 International Superconductivity Industry Summit
  3. IEEE Trans. Apply. Supercond. v.3 Otto A;Masur L. J;Gannon J;Podtburg E;Daly D;Yurek G. J;Malozemoff A. P
  4. 1993 Proc. ISS'93 Ohkura K;Muka H;Hikata T;Ueyama M;Kato T; Fujikami J;Sato K
  5. IEEE Trans. Mag. v.28 J. E. Tkaczyk;R. H. Arendt;P. J. Bendnarczjk
  6. Physica C v.242 Hee Gyoun Lee;Gye Won Hong;Jong Jin Kim;Myung Youp Song
  7. Physica C v.267 Jaimoo Yoo;Hyungsik Chung;Jaewoong Ko;Haidoo Kim;Jian Sha
  8. Journal of Electronic Materials v.24 no.12 J. Y. Huang;R. Jammy;A. N. lyer;U. Balanchandran
  9. Physica C v.297 J. Sha;X. J. Chen;Z. B. Wang;X. S. Ye;Z. K. Jiao
  10. Supercond. Sci. Technol v.11 M. R. Koblischka;T. H. Johansen;H. Bratsberg;P. Vase
  11. J. Appl. Phys. v.26 no.L865 Y. Yamada;N. Fukushima;S. Nakayama;H. Yoshino;S. Murase
  12. MRS Bull v.45 Hellstrom E. E
  13. Supercond. Sci. Technol. v.6 J. Joo;J. P. Singh;R. B. Poeppel
  14. 전기전자재료학회논문지 v.12 no.4 김정호;김중석;주진호;윤대호;나완수;김원주;홍계원