Thermal Compression of Copper-to-Copper Direct Bonding by Copper films Electrodeposited at Low Temperature and High Current Density (저온 및 고전류밀도 조건에서 전기도금된 구리 박막 간의 열-압착 직접 접합)
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- Proceedings of the Korean Institute of Surface Engineering Conference
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- 2018.06a
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- pp.102-102
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- 2018