• Bulletin of the Korean Chemical Society
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• v.30 no.6
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• pp.1293-1296
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• 2009

A new series of N-substituted 2-n-butyl-3-fluoropyrroles were prepared by a simple one-pot reaction designed of retrosynthesis. $\alpha,\alpha-Difluoro-\gamma-iodo-\gamma$-(trimethylsilyl)propyl n-butyl ketone, a component precursor molecule to 2-n-butyl-3-fluoropyrroles, was prepared with Cu(0) catalyst. It reacted with various primary amines to yield N-substituted 2-n-butyl-3-fluoropyrroles. The products were synthesized via a one-pot reaction scheme between $\alpha,\alpha-Difluoro-\gamma-iodo-\gamma$-(trimethylsilyl) propyl n-butyl ketone and primary amines in excess ( $\geq$ 5 molar equivalence), which eliminate the need of KF required in obtaining n-butyl-1H-3-fluoropyrrole. The yield of products depended reversely on spatial bulkness around N-binding carbon.

• Polymer(Korea)
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• v.33 no.1
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• pp.67-71
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• 2009

The stitching method for the synthesis of $Fr\acute{e}chet$-type dendrimers was elaborated using click chemistry between an alkyne and an azide. The core building block, 4,4'-(3,5-bis(azidopropyloxy)benzyloxy)bisphenyl, was designed to serve as the azide functionalities for dendrimer growth via click reactions with the alkyne-dendrons. The synthetic strategy involved an 1,3-dipolar cycloaddition reaction between an azide and an alkyne-functionalized $Fr\acute{e}chet$-type dendrons in the presence of Cu(I) species which is known as the best example of click chemistry.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.90-100
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• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Journal of Electrochemical Science and Technology
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• v.10 no.2
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• pp.131-138
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• 2019

To improve the performance of Si anodes in advanced Li-ion batteries, the design of the electrode plays a critical role, especially due to the large volumetric expansion in the Si anode during Li insertion. In our study, we used a simple fabrication method to prepare Si-based electrodes by grafting polyacrylic acid (PAA) to a carboxymethyl cellulose (CMC) binder (CMC-g-PAA). The procedure consists of first mixing nano-sized Si and the binders (CMC and PAA), and then coating the slurry on a Cu foil. The carbon network was formed via carbonization of the binders i.e., by a simple heat treatment of the electrode. The carbon network in the electrode is mechanically and electrically robust, which leads to higher electrical conductivity and better mechanical property. This explains its long cycle performance without the addition of a conducting agent (for example, carbon). Therefore, the partially carbonized CMC-g-PAA binder presented in this study represents a new feasible approach to produce Si anodes for use in advanced Li-ion batteries.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.11a
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• pp.27-28
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• 2021

The search for new corrosion inhibitors for different corrosive mediums is a never-ending task. In the present work, the corrosion inhibition behavior and adsorption mechanism of two novel synthetic thiazolidinedione derivatives noted MTZD and ATZD in 3.5 wt.% NaCl solution on copper were investigated. Electrochemical, scanning electron microscope (SEM), atomic force microscopy (AFM) techniques were used along with first-principles DFT calculations. At maximum inhibitor concentration i.e., 300 ppm corrosion inhibition efficiency reached maximum up to 90% and 96% for MTZD and ATZD, respectively, and thereby followed the order of ATZD > MTZD. The inhibition efficiency increased up to 24 h of immersion, and then decreased after 48h immersion. The potentiodynamic curves suggested that the inhibition action of tested compounds is a mixed type of inhibitor. The first-principles DFT calculations suggested that compounds under investigation formed covalent bonds with Cu(111) surface via reactive sites. SEM and AFM results confirmed the formation of protective barrier that prevent corrosion attack.

• Ocean Systems Engineering
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• v.12 no.3
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• pp.359-384
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• 2022

We develop in this work a new well-balanced preserving-positivity path-conservative central-upwind scheme for Saint-Venant-Exner (SVE) model. The SVE system (SVEs) under some considerations, is a nonconservative hyperbolic system of nonlinear partial differential equations. This model is widely used in coastal engineering to simulate the interaction of fluid flow with sediment beds. It is well known that SVEs requires a robust treatment of nonconservative terms. Some efficient numerical schemes have been proposed to overcome the difficulties related to these terms. However, the main drawbacks of these schemes are what follows: (i) Lack of robustness, (ii) Generation of non-physical diffusions, (iii) Presence of instabilities within numerical solutions. This collection of drawbacks weakens the efficiency of most numerical methods proposed in the literature. To overcome these drawbacks a reformulation of the central-upwind scheme for SVEs (CU-SVEs for short) in a path-conservative version is presented in this work. We first develop a finite-volume method of the first order and then extend it to the second order via the averaging essentially non oscillatory (AENO) framework. Our numerical approach is shown to be well-balanced positivity-preserving and shock-capturing. The resulting scheme could be seen as a predictor-corrector method. The accuracy and robustness of the proposed scheme are assessed through a carefully selected suite of tests.

• Journal of Applied Biological Chemistry
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• v.58 no.1
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• pp.39-50
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• 2015

Stabilization of heavy metals such as Pb, Cd, Zn, and Cu was evaluated in contaminated soil treated with poultry manure (PM) as well as its biochars pyrolyzed at $300^{\circ}C$ (PBC300) and $700^{\circ}C$ (PBC700) at the application rates of 2.5, 5.0, and 10.0 wt% along with the control, prior to 21-days incubation. After incubation, soil pH was increased from 6.94 (control) to 7.51, 7.24, and 7.88 in soils treated with PM 10 wt%, PBC300 10 wt%, and PBC700 10 wt% treatments, respectively, mainly due to alkalinity of treatments. In the soil treated with PM, the concentrations of the toxicity characteristic leaching procedure (TCLP)-extractable Pb, Cd, Zn, and Cu were increased by up to 408, 77, 24, and 955%, respectively, compared to the control. These increases may possibly be associated with an increased dissolved organic carbon concentration by the PM addition. However, in the soil treated with PBC700, TCLP-extractable Pb, Cd, Zn, and Cu concentrations were reduced by up to 23, 38, 52, and 36%, respectively, compared to the control. Thermodynamic modelling using the visual MINTEQ was done to predict the precipitations of $Pb(OH)_2$, $Cu(OH)_2$ and P-containing minerals, such as chloropyromorphite [$Pb_5(PO_4)_3Cl$] and hydroxypyromorphite [$Pb_5(PO_4)_3OH$], in the PBC700 10 wt% treated soil. The SEM-elemental dot mapping analysis further confirmed the presence of Pb-phosphate species via dot mapping of PBC700 treated soil. These results indicate that the reduction of Pb concentration in the PBC700 treated soil is related to the formations of chloropyromorphite and hydroxypyromorphite which have very low solubility.

• Clean Technology
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• v.26 no.2
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• pp.137-144
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• 2020

Metal-impregnated activated carbons were prepared via ultrasonic-assisted impregnation method for regeneration and low ammonia concentration. Magnesium and copper were selected as metals, while chloride (Cl^-) and nitrate (NO₃^-) precursors were used to impregnate the surface of activated carbon. The physical and chemical properties of the prepared adsorbents were characterized by TGA, BET, and NH₃-TPD. The ammonia breakthrough test was carried out using a fixed bed and flowing ammonia gas (1000 mg L^-1 NH₃, balanced N₂) at 100 mL min^-1, under conditions of temperature swing adsorption (TSA) and pressure swing adsorption (PSA, 0.3, 0.5, 0.7, 0.9 Mpa). The adsorption and desorption performance of ammonia were in the order of AC-Mg(Cl) > AC-Cu(Cl) > AC-Mg(N) > AC-Cu(N) > AC through NH₃-TPD and TSA and PSA processes. AC-Mg(Cl) using MgCl₂ showed the average adsorption amount of 2.138 mmol/g at TSA process. Also, AC-Mg(Cl) showed the highest initial adsorption amount of 3.848 mmol/g at PSA 0.9 Mpa. When metal impregnated the surface of the activated carbon, it was confirmed that not only physical adsorption, but also chemical adsorption increased, making enhancement in adsorption and desorption performances possible. Also, the prepared adsorbents showed stable adsorption and desorption performances despite repeated processes, confirming their applicability in the TSA and PSA processes.