• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.92-92
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• 2008

PDP의 저가화, 친환경화, 고화질화는 타 디스플레이와 경쟁을 위해 필수적이고 그로 인한 소재의 개발이 필요하다. 저가화는 부품, 공정에서도 가능하지만 소재에서의 원가가 상당부분을 차지하고 있기 때문에 소재 개발이 중요하며, 친환경화는 현재 유전체에서 많이 사용되고 있는 유해소재를 친환경 소재로 대체함으로써 개발이 이루어지고 있다. 그래서 우리는 현재 PDP에서 전극물질로 사용되어지는 고가의 Ag를 Gu입자에 Ag 박막으로 코팅한 Ag/Cu 전극 powder를 사용하여 저가의 전극 paste를 만들고 스크린 프린터와 노광장비를 사용하여 전극을 형성하였다. 그 후 친환경적인 Pb free 투명유전체를 입히고 전극과의 상호 매칭성을 연구 하였다. 결과적으로 기존 PDP 공정에서 볼 수 없었던 황변현상, 전극착색현상, 전극입자의 터짐성 등 많은 현상이 일어났지만, 기존 공정 온도보다 낮은 온도로 공정한 결과, 이러한 문제들이 줄어드는 것을 확인하였다. 이로써 공정단가의 저가화와 제품의 친환경을 가면서도 기존과 차이가 제품을 실현할 수 있을 것이다.

• Journal of the Korean Ceramic Society
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• v.44 no.5 s.300
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• pp.173-178
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• 2007

The microstructure and microwave dielectric properties of dolomite type borates, $CaZr(BO_3)_2$ ceramics prepared by conventional mixed oxide method were explored. The sintering temperature of $CaZr(BO_3)_2$ ceramics could be reduced from $1150^{\circ}C\;to\;925^{\circ}C$ with little amount of sintering additives. Microwave dielectric properties of 3 wt% $Bi_2O_3-CuO$ added $CaZr(BO_3)_2$ ceramics sintered at $925^{\circ}C$ were $K{\approx}10.4,\;Q{\times}f{\approx}80,000GHz\;and\;TCF{\approx}+2ppm/^{\circ}C$. Thus obtained LTCC tape was co-fired with Ag paste for compatibility test and revealed no sign of Ag reaction with the ceramics. Therefore, $CaZr(BO_3)_2$ ceramics is considered as a possible candidate material for low temperature co-fired multilayer devices.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.215-218
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• 1994

Dielectric properties of $(Sr_{l-x}{\cdot}Ca_x)_mTiO_3+0.006Nb_2O_5$($0.05{\leq}x{\leq}0.2$, 0.996$N_2$) were painted on the surface with CuO paste, and then annealed at $1100^{\circ}C$ for 2hr. Grain size increased with increasing substitutional contents of Ca up to 15[mol%], but decreased with further substitution. In the specimens with $10{\sim}15[mol%]$ of Ca and m=1, excellent dielectric properties were obtained as follows; dielectric constant <25000, dielectric loss($tan{\delta}[%]$) <0.3[%] and capacitance change rate with temperature <${\pm}10[%]$, respectively. All the specimens in this study exhibited dielectric relaxation with frequency as a function of the temperature. The dispersive frequency was over $10^6[Hz]$.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.12 no.3
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• pp.191-200
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• 1979

For the use of antarctic krill as a fond protein source its compositional characteristics were investigated as the first part of the work includes other subjects such as processing of drill paste, concentrates, and fermented or seasoned product. In general composition of fresh frozen and preboiled frozen krill on board, the contents of crude fat and free amino nitrogen were higher in the former than in the latter which contained a high amount of ash. VBN was rather high as much as 37.6 and $26.4\;mg\%$ in both fresh frozen and preboiled krill. The pH of drill homogenates was 7.1 to 7.2 in both cases. Such a low pH might be attributed to a long term storage and temperature fluctuations during frequent transshipping. The amino acid competition of fresh frozen krill meat showed relatively high amount of glutamic acid, aspartic acid, lysine, proline, and leucine while methionine, histidine, serine, tyrosine, and phenylalanine were lower. Among the essential amino acids lysine and leucine were higher and methionine was lower. In tile composition of free amino acid proline, lysing, arginine, and alanine were higher comparatively to the contents of histidine, aspartic acid, serine, and threonine. It is noteworthy for nutritional qualification that tile essential amino acids particularly as lysine were abundant similarly to that of fishes. Heavy metal contents of krill meat 0.039 to 0.048 ppm as Hg, 0.06 to 0.11 ppm as Pb, less than 0.32 ppm as Zn, 0.008 to 0.012 ppm as Cd, 0.61 to 0.68 ppm as Fe, 0.87 to 1.37 ppm as Cu, and nondetective as Cr. A high Cu content seems to be resulted by tile blood pigment of crustacea. The ratio,1 of edible portion to non-edible portion were 37:63 in fresh frozen and 42:58 in preboiled frozen krill respectively. Release of drip after thawing was more in fresh frozen than in preboiled frozen drill marking $36\%$ and $24\%$ of both respectively.

• Electrical & Electronic Materials
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• v.12 no.7
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• pp.7-11
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• 1999

Fully sealed field emission display in size of 4.5 inch has been fabricated using single-wall carbon nanotubes-organic vehicle com-posite. The fabricated display were fully scalable at low temperature below 415$^{\circ}C$ and CNTs were vertically aligned using paste squeeze and surface rubbing techniques. The turn-on fields of 1V/${\mu}{\textrm}{m}$ and field emis-sion current of 1.5mA at 3V/${\mu}{\textrm}{m}$ (J=90${\mu}{\textrm}{m}$/$\textrm{cm}^2$)were observed. Brightness of 1800cd/$m^2$ at 3.7V/${\mu}{\textrm}{m}$ was observed on the entire area of 4.5-inch panel from the green phosphor-ITO glass. The fluctuation of the current was found to be about 7% over a 4.5-inch cath-ode area. This reliable result enables us to produce large area full-color flat panel dis-play in the near future. Carbon nanotubes (CNTs) have attracted much attention because of their unique elec-trical properties and their potential applica-tions [1, 2]. Large aspect ratio of CNTs together with high chemical stability. ther-mal conductivity, and high mechanical strength are advantageous for applications to the field emitter [3]. Several results have been reported on the field emissions from multi-walled nanotubes (MWNTs) and single-walled nanotubes (SWNTs) grown from arc discharge [4, 5]. De Heer et al. have reported the field emission from nan-otubes aligned by the suspension-filtering method. This approach is too difficult to be fully adopted in integration process. Recently, there have been efforts to make applications to field emission devices using nanotubes. Saito et al. demonstrated a car-bon nanotube-based lamp, which was oper-ated at high voltage (10KV) [8]. Aproto-type diode structure was tested by the size of 100mm $\times$ 10mm in vacuum chamber [9]. the difficulties arise from the arrangement of vertically aligned nanotubes after the growth. Recently vertically aligned carbon nanotubes have been synthesized using plasma-enhanced chemical vapor deposition(CVD) [6, 7]. Yet, control of a large area synthesis is still not easily accessible with such approaches. Here we report integra-tion processes of fully sealed 4.5-inch CNT-field emission displays (FEDs). Low turn-on voltage with high brightness, and stabili-ty clearly demonstrate the potential applica-bility of carbon nanotubes to full color dis-plays in near future. For flat panel display in a large area, car-bon nanotubes-based field emitters were fabricated by using nanotubes-organic vehi-cles. The purified SWNTs, which were syn-thesized by dc arc discharge, were dispersed in iso propyl alcohol, and then mixed with on organic binder. The paste of well-dis-persed carbon nanotubes was squeezed onto the metal-patterned sodalime glass throuhg the metal mesh of 20${\mu}{\textrm}{m}$ in size and subse-quently heat-treated in order to remove the organic binder. The insulating spacers in thickness of 200${\mu}{\textrm}{m}$ are inserted between the lower and upper glasses. The Y\ulcornerO\ulcornerS:Eu, ZnS:Cu, Al, and ZnS:Ag, Cl, phosphors are electrically deposited on the upper glass for red, green, and blue colors, respectively. The typical sizes of each phosphor are 2~3 micron. The assembled structure was sealed in an atmosphere of highly purified Ar gas by means of a glass frit. The display plate was evacuated down to the pressure level of 1$\times$10\ulcorner Torr. Three non-evaporable getters of Ti-Zr-V-Fe were activated during the final heat-exhausting procedure. Finally, the active area of 4.5-inch panel with fully sealed carbon nanotubes was pro-duced. Emission currents were character-ized by the DC-mode and pulse-modulating mode at the voltage up to 800 volts. The brightness of field emission was measured by the Luminance calorimeter (BM-7, Topcon).