• Title/Summary/Keyword: Cu nanoparticle

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Comparative Toxicity Studies of Ultra-Pure Ag, Au, Co, and Cu Nanoparticles Generated by Laser Ablation in Biocompatible Aqueous Solution

  • Kim, Yea-Seul;Kim, Kuk-Ki;Shin, Seon-Mi;Park, Seung-Min;Hah, Sang-Soo
    • Bulletin of the Korean Chemical Society
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    • v.33 no.10
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    • pp.3265-3268
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    • 2012
  • Nanoparticles (NPs) are increasingly used in consumer products, which have aroused many concerns and debates regarding their fate in biological systems from a point of their safety/toxicity. Although a number of studies on the biological effects of NPs have been published, these are often complicated by the possible toxicity of conventional NPs, caused by contamination with chemical precursors or additives during their synthesis and/or purification procedures. To explicitly understand the toxicity basis of NPs, it is necessary to directly address a main problem related to their intrinsic/inherent toxicity and/or incompatibility with biological objects. The present study is designed to take advantage of a novel laser-assisted method called laser ablation to generate Ag, Au, Co, and Cu NPs in biocompatible aqueous solution, and to evaluate the toxicity of the resulting ultra-pure NPs. Our results show that the ultra-pure NPs with nascent surfaces possess moderate cytotoxicity to human cells in a cell-dependent manner.

Electrical Property Evaluation of Printed Copper Nano-Ink Annealed with Infrared-Lamp Rapid Thermal Process (적외선 램프를 이용하여 소결한 구리 나노잉크의 전기적 특성 평가에 관한 연구)

  • Han, Hyun-Suk;Kim, Changkyu;Yang, Seung-Jin;Kim, Yoon-Hyun
    • Korean Journal of Materials Research
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    • v.26 no.4
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    • pp.216-221
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    • 2016
  • A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

Stability and Thermo-physical Properties of Nanofluids and Its Applications (나노유체의 분산안정성 및 열물성치와 그 응용에 관한 연구)

  • Hwang, Y.;Lee, K.;Kim, K.;Lee, J.
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03b
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    • pp.474-478
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    • 2008
  • It has been shown that a nanofluid consisting of nanoparticles dispersed in base fluid has much higher effective thermal conductivity than pure fluid. In this study, four kinds of nanofluids such as multiwalled carbon nanotube (MWCNT) in water, CuO in water, SiO2in water, and CuO in ethylene glycol, are produced. Their thermal conductivities are measured by a transient hot-wire method. The thermal conductivity of water-based MWCNT nanofluid is shown to be increased by up to 11.3% at a volume fraction of 0.01. The measured thermal conductivities of MWCNT nanofluids are higher than those calculated with Hamilton-Crosser's model due to neglecting solid-liquid interaction at the interface. The results show that the thermal conductivity enhancement of nanofluids depends on the thermal conductivities of both particles and the base fluid. Stability of nanofluids is estimated by UV-vis spectrum analysis. Stability of nanofluid depends on the type of base fluid and the suspended particles. Also it can be improved in addition of a surfactant.

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Characteristics of $YBa_2Cu_3O_{7-x}$ Thin Films on $SrTiO_3$ substrate with surface modification by Au nanoparticles (STO기판에 금 나노입자가 분산된 YBCO 박막의 특성)

  • Oh, Se-Kweon;Jang, Gun-Eik;Tran, Hai Duc;Kang, Byoung-Won;Lee, Cho-Yeon;Hyun, Ok-Bae
    • Progress in Superconductivity and Cryogenics
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    • v.12 no.3
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    • pp.7-11
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    • 2010
  • For many large-scale applications of high-temperature superconducting materials, large critical current density($J_c$) in high applied magnetic fields are required. A number of methods have been reported to introduce artificial pinning centers(APCs) in $YBa_2Cu_3O_{7-\delta}$(YBCO) films for enhancement of their $J_c$. In this work, we investigated electric characteristic of YBCO films on $SrTiO_3$ (100) substrates whose surfaces were modified by the introduction of Au nanoparticles (AuNPs). Au nanoparticles were uniformly dispersed on STO substrates with one of typical solution techniques, self assembled monolayer. After heating the STO substrates with Au nanoparticles, the size of Au nanoparticles was around 29~32 nm in height and 41~49 nm in diameter. XRD diffraction patterns taken on the YBCO film with Au nanoparticles show the c-axis orientation. The measured $T_c$ of YBCO /AuNPs films was around 89K and the $J_c$ was 0.75 MA/$cm^2$ at 65 K and 1 T.

Toxicity Evaluation of Metals and Metal-oxide Nanoparticles based on the Absorbance, Chlorophyll Content, and Cell Count of Chlorella vulgaris (Chlorella vulgaris의 흡광도, 클로로필 및 개체수 통합 영향에 근거한 중금속 및 나노입자 독성 조사)

  • Jang, Hyun Jin;Lee, Mun Hee;Lee, Eun Jin;Yang, Xin;Kong, In Chul
    • Clean Technology
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    • v.23 no.1
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    • pp.27-33
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    • 2017
  • In this study, toxicities of seven metals (Cu, Cd, Cr, As(III), As(V), Zn, Ni) and five metal oxide nanoparticles (NPs: CuO, ZnO, NiO, $TiO_2$, $Fe_2O_3$) were evaluated based on the growth of Chlorella vulgaris. Effect on algae growth was evaluated by integrating the results of absorption, chlorophyll content, and cell count. The toxicity rankings of metals was observed as Cr ($0.7mgL^{-1}$) > Cu ($1.7mgL^{-1}$) > Cd ($3.2mgL^{-1}$) > Zn ($3.9mgL^{-1}$) > Ni ($13.2mgL^{-1}$) > As(III) ($17.8mgL^{-1}$) ${\gg}$ As(V) (> $1000mgL^{-1}$). Slightly different orders and sensitivities of metal toxicity were examined depending on endpoints of algal growth. In case of NPs, regardless of endpoints, similar toxicity rankings of NPs ($TEC_{50}$) were observed, showing ZnO ($2.4mgL^{-1}$) > NiO ($21.1mgL^{-1}$) > CuO ($36.6mgL^{-1}$) > $TiO_2$ ($62.5mgL^{-1}$) > $Fe_2O_3$ ($82.7mgL^{-1}$). These results indicate that an integrating results of endpoints might be an effective strategy for the assessment of contaminants.

Effect of $Y_2O_3$ Nanoparticles on Critical Current Density of $YBa_2Cu_3O_{7-x}$ Thin Films ($Y_2O_3$ 나노입자가 $YBa_2Cu_3O_{7-x}$ 박막의 임계전류밀도에 미치는 영향)

  • Tran, H.D.;Reddy, D.Sreekantha;Wie, C.H.;Kang, B.;Oh, Sang-Jun;Lee, Sung-Ik
    • Progress in Superconductivity
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    • v.11 no.1
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    • pp.62-66
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    • 2009
  • Introduction of proper impurity into $YBa_2Cu_3O_{7-x}$ (YBCO) thin films is an effective way to enhance its flux-pinning properties. We investigate effect of $Y_2O_3$ nanoparticles on the critical current density $J_c$ of the YBCO thin films. The $Y_2O_3$ nanoparticles were created perpendicular to the film surface (parallel with the c-axis) either between YBCO and substrate or on top of YBCO, YBCO/$Y_2O_3$/LAO or $Y_2O_3$/YBCO/STO, by pulsed laser deposition. The deposition temperature of the YBCO films were varied ($780^{\circ}C$ and $800^{\circ}C$) to modify surface morphology of the YBCO films. Surface morphology characterization revealed that the lower deposition temperature of $780^{\circ}C$ created nano-sized holes on the YBCO film surface which may behave as intrinsic pinning centers, while the higher deposition temperature produced much denser and smoother surface. $J_c$ values of the YBCO films with $Y_2O_3$ particles were either remained nearly the same or decreased for the samples in which YBCO is grown at $780^{\circ}C$. On the other hand, $J_c$ values were enhanced for the samples in which YBCO is grown at higher temperature of $800^{\circ}C$. The difference in the effect of $Y_2O_3$ can be explained by the fact that the higher deposition temperature of $800^{\circ}C$ reduces intrinsic pinning centers and $J_c$ is enhanced by introduction of artificial pinning centers in the form of $Y_2O_3$ nanoparticles.

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Nano-sized Effect on the Magnetic Properties of Ag Clusters

  • Jo, Y.;Jung, M.H.;Kyum, M.C.;Park, K.H.;Kim, Y.N.
    • Journal of Magnetics
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    • v.11 no.4
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    • pp.160-163
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    • 2006
  • We have prepared crystalline Ag nanoparticles with an average size of 4 nm in diameter by using an inductively coupled plasma reactor equipped with the liquid nitrogen cooling system. Our magnetic data show that the nano-sized effect of Ag nanoparticles on the magnetic properties is ferromagnetic, instead of a diamagnetic component of the Ag bulk and a superparamagnetic component of magnetic nanoparticles. We have also studied the magnetic properties of Ag-Cu nanocomposites with an opposite concentration profile between surface and core. These comparisons indicate that the ferromagnetic component strongly depends on the surface of Ag nanoparticles, while the paramagnetic component is strongly affected by the outer oxide layer, with the background of a diamagnetic component from the core of Ag.

The Effect of SiC Nanopaticles on Interface of Micro-bump manufactured by electroplating (나노입자가 전해도금으로 형성된 미세범프의 계면에 미치는 영향)

  • Sin, Ui-Seon;Lee, Se-Hyeong;Lee, Chang-U;Jeong, Seung-Bu;Kim, Jeong-Han
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.245-247
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    • 2007
  • Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

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Magnetic Behaviors of Isolated Fe-Co-Ni Nanoparticles in a Random Arrangement

  • Yang, Choong Jin;Kim, Kyung Soo;Wu, Jianmin
    • Journal of Magnetics
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    • v.6 no.3
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    • pp.94-100
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    • 2001
  • Fe-Co-Ni particles with an average size of 45 and 135 nm are characterized in terms of magnetic phase transformation and magnetic properties at room temperature. BCC structure of Fe-Co-Ni spherical particles can be synthesized from Fe-Co-Ni-Al-Cu precursor films by heating at 600-80$0^{\circ}C$ for the phase separation of Fe-Co rich Fe-Co-Ni particles, followed by a post heating at $600^{\circ}C$ for 5 hours. The average size of nanoparticles was directly determined by the thickness of precursor films. Exchange interactive hysteresis was observed for the nano-composite (Fe-Co-Ni)+(Fe-Ni-Al) films resulting from the short exchange interface between ferromagnetic Fe-Co-Ni particles surrounded by almost papramagnetic Ni-Al-Fe matrix. Arraying the isolated Fe-Co-Ni nano-particles in a random arrangement on $Al_2O_3$substrate the particle assembly showed a behavior of dipole interactive ferromagnetic clusters depending on their volume and inter-particle distance.

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