• Restorative Dentistry and Endodontics
• /
• 제17권2호
• /
• pp.287-306
• /
• 1992

The amounts of copper, mercury, silver, tin, and zinc released from conventional, dispersed phase and spherical high copper content amalgam immersed in artificial saliva soln. for periods of 2 hours, 1 day, 7 days, 30 days has been measured using Neutron Activation analysis and Atomic Absorption Spectrophotometry. The second electron image and EDX of the surface of samples immersed in artificial saliva were observed using SEM. The following results were obtained. 1. The dispersed non-$\gamma_2$ amalgam released more Hg, Ag than the $\gamma_2$-amalgams. Later a decrease of the release rate could be observed. 2. The dispersed high copper amalgam released more copper than low-copper amalgam and the release rate was decreased with time. But the amounts of copper released from Tytin increased with time. 3. Zinc was released all the experiment time. 4. EDAX showed that surface was composed of Ca,P, Sn, Ag, Zn, and Cu, but C1 was not detected. 5. The discontinued destructed surface was observed from the polished amalgam surface. High copper amalgam was destructed more than low copper amalgam.

• 한국표면공학회지
• /
• 제49권3호
• /
• pp.265-273
• /
• 2016

The effects of surface modification by nitric acid on the pre-treatment of electroless copper plating were investigated. Copper was electroless-plated on the nitric acid treated graphite activated by a two-step pre-treatment process (sensitization + activation). The chemical state and relative quantities of the various surface species were determined by X-ray photoelectron spectroscopy (XPS) after nitric acid modification or pre-treatment. The acid treatment increased the surface roughness of the graphite due to deep and fine pores and introduced the oxygen-containing functional groups (-COOH and O-C=O) on the surface of graphite. In the pre-treatment step, the high roughness and many functional groups on the nitric acid treated graphite promoted the adsorption of Sn and Pd ions, leading to the uniform adsorption of catalyst ($Pd^0$) for Cu deposition. In the early stage of electroless plating, a lot of tiny copper particles were formed on the whole surface of acid treated graphite and then homogeneous copper film with low variation in thickness was formed after 30 min.

• 한국표면공학회지
• /
• 제45권1호
• /
• pp.37-42
• /
• 2012

$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.

• 한국자동차공학회논문집
• /
• 제19권6호
• /
• pp.90-96
• /
• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.183-188
• /
• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• Bulletin of the Korean Chemical Society
• /
• 제25권1호
• /
• pp.79-84
• /
• 2004

The existing technological schemes for processing rhenium-containing raw materials involve the recovery of Re from solutions, which can be effectively achieved by anion exchange method. The application of anion exchange also allows to study rhenium state in aqueous solutions and to develop analytical control methods. The present work is focused on investigation of ion exchange equilibrium in the analytical system Re(VII)-HCl-$SnCl_2$-KSCN-anion exchanger by means of sorption-desorption method as well as by electron, IR- and diffuse reflection spectroscopy. It was shown that rhenium can be quantitatively recovered from this system. It is proposed to use the sorption-spectroscopic method for Re(VII) determination in aqueous solutions. The calibration curve is linear in the concentration range of 0.5-20.0 mg/L (sample volume is 25.0 mL) and the detection limit is 0.05 mg/L. The presence of Mo(VI), Cu(II), Fe(II, III), Ni(II), Zn(II) as well as $K^+,\;Na^+$ do not hinder the solid-phase determination of rhenium. Rhenium (VII) determination by diffuse reflection spectroscopy was carried out in model solutions as well as in samples of river-derived water and in solutions obtained after the dissolution of spent catalysts.

• 무역학회지
• /
• 제47권4호
• /
• pp.177-195
• /
• 2022

This study analyzed the volatility spillover effect between international non-ferrous metal futures markets using the BEKK-GARCH model. Statistical data are futures price data of copper (CU), aluminum (AL), nickel (NI), tin (SN) from Shanghai Futures Exchange (SHFE) and London Metal Exchange (LME) from April 1, 2015 to December 31, 2021. Combining the research results, first, in the case of copper, aluminum, and nickel, it was found that there was a two-way volatility spillover effect between the Shanghai and London markets, and the international influence of the London market was greater. Second, in the case of the tin, it was found that the Shanghai market has a volatility spillover effect on the London market from stage I, and it is strengthened in stage II. Third, in the case of nickel, it was found that there was a two-way volatility spillover effect in the first stage, but in the second stage, the London market had a unidirectional volatility spillover effect with respect to the Shanghai market. This study confirmed that China's influence in the international non-ferrous metal futures market is gradually increasing. In addition, it suggested that international investors can engage in arbitrage and hedging using China's non-ferrous metal futures market.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
• /
• pp.77-77
• /
• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Journal of Welding and Joining
• /
• 제27권1호
• /
• pp.85-89
• /
• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• 박물관보존과학
• /
• 제7권
• /
• pp.3-10
• /
• 2006

경주 은령총에서 출토된 청동제 합은 과거 접합되었다가 파손된 상태로 본체의 경우 전체의 절반 정도만이 남아있어 보존 및 전시를 위해서 보존처리 하였다. 이물질 및 열화된 접착제의 제거 후 재접합 하였는데, 비교적 많은 부분이 남아있는 뚜껑은 복원부위를 쉽게 분리할 수 있는 가역적인 방법으로 처리하였다. 본체의 경우 복원부위가 많기 때문에 유물의 하중을 잘 견딜 수 있도록 에폭시수지를 사용하여 접합하였다. 합을 비파괴 조사한 결과 주조품 이었으며 재질은 Cu-Sn-Pb의 3원계 합금으로 나타났다.