• Journal of the Korean Magnetics Society
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• v.20 no.1
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• pp.8-12
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• 2010

The magnetostriction and stress of multilayer $NiFeCr/(Cu/Co_{90}Fe_{10}){\times}N/NiFeCr$ films were investigated. As the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers was increased, the saturation magnetostriction decreased from $-5.6\times10^{-6}$ at 2 bilayers to $-8.5\times10^{-6}$ at 20 bilayers. A change of CoFe thickness from 10 to $20{\AA}$ caused a decrease in the magnitude of tensile stress from 980MPa to 590MPa as the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers increased from 2 to 20. The maximum magnetostrictive anisotropy field that could be developed due to nonzero magnetostriction and stress is calculated to be 135.7 Oe when the number of Cu $15{\AA}$/CoFe $15{\AA}$ bilayers is 10.

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.385-391
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• 2013

The influence of Cu and Ni on the ductile-brittle transition behavior of metastable austenitic Fe-18Cr-10Mn-N alloys with N contents below 0.5 wt.% was investigated in terms of austenite stability and microstructure. All the metastable austenitic Fe-18Cr-10Mn-N alloys exhibited a ductile-brittle transition behavior by unusual low-temperature brittle fracture, irrespective of Cu and/or Ni addition, and deformation-induced martensitic transformation occasionally occurred during Charpy impact testing at lower temperatures due to reduced austenite stability resulting from insufficient N content. The formation of deformation-induced martensite substantially increased the ductile-brittle transition temperature(DBTT) by deteriorating low-temperature toughness because the martensite was more brittle than the parent austenite phase beyond the energy absorbed during transformation, and its volume fraction was too small. On the other hand, the Cu addition to the metastable austenitic Fe-18Cr-10Mn-N alloy increased DBTT because the presence of ${\delta}$-ferrite had a negative effect on low-temperature toughness. However, the combined addition of Cu and Ni to the metastable austenitic Fe-18Cr-10Mn-N alloy decreased DBTT, compared to the sole addtion of Ni or Cu. This could be explained by the fact that the combined addition of Cu and Ni largely enhanced austenite stability, and suppressed the formation of deformation-induced martensite and ${\delta}$-ferrite in conjunction with the beneficial effect of Cu which may increase stacking fault energy, so that it allows cross-slip to occur and thus reduces the planarity of the deformation mechanism.

• Journal of the Korean Ceramic Society
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• v.33 no.12
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• Analytical Science and Technology
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• v.8 no.3
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• pp.299-304
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• 1995

The adsorption behaviors of Ba(II), Cr(II), Fe(II) and Cu(II) on the N, N'-bispalmtoyl 1, 12-diaza-3, 4:9, 10-dibenzo-5, 8-cyclopentadecane (hexadecyl $NtnOenH_4$)-octadecylsilanized silicas(ODS) were investigated with water as the mobile phase. Binding constants for metal ions were measured in aqueous solution. The order of binding constants(K) and the degree of sorption(E) were Ba(II)$NtnOenH_4$-octadecyisiianized silicas(ODS) increased with concentration of metal ions, and the degree of adsorption was found to be affected by the cation-chelation mechanism. The experimental results showed good efficiency for separation of Cu(II) from mixtures of Ba(II), Cr(II), Fe(II) and Cu(II) in aqueous solution.

• Journal of the Korean institute of surface engineering
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• v.26 no.3
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• pp.149-157
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• 1993

In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like form due to the surface Cr oxides on the Cu-Cr film. By means of activating the Cu-Cr film with the oxalic acid and phosphoric acid, the Cu film with the improved adhesion could be coated on the Cu-Cr sputtered film in CuSO4 solution. The etching rate was compared with increasing the Cr content of the sputtered Cu-Cr film, and anodic polarization curve in FeCl3 solution was investigated. With increasing the Cr content, the etching rate was reduced. The clean etching cross section could be obtained with increasing the concentration of FeCl3 solution. But above the 13 w/o Cr content, Cu-Cr sputtered film could not bed etched cleanly only with FeCl3 solution and additives were needed.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.273-284
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• 1994

Thermal behavior of Cu-Cr thin alloy films has been investigated by SEM, AES, and TEM. Cu-Cr alloy films containing 3wt% Cr, 8wt% Cr have been sputter-deposited onto polyimide substrates and heat treated at $400^{\circ}C$ for 2hrs in the various atmosphere. Before heat treatment, Cu and Cr content in the film are uniform through the thickness and oxygen content in the film is negligible. Redistribution of Cr, Cu, and O in the film due to heat treatment depends on the Cr content and heat treatment atmoshpere. There kinds of thermal behavior are ascribed to the formation of surface and interface oxides as well as internal oxidation. Hillocks are observed on the surface of Cu-Cr alloy films which have been heat treated in N2. The hillocks are composed of large grainss of Cu.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.5
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• pp.305-311
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• 2005

Effect of Cr contents(Cr: 0.27, 0.45 and 0.65wt.%) on precipitation process has been studied by electrical resistivity measurements, hardness and scanning electron microscope. The first stage of the process consists of the formation of Cr-rich particles, the second stage consists of the competitive growth of these particles. The kinetics of precipitation could be described by Johnson-Mehl-Avrami equation, $f(t)=1-\exp(-kt^n)$. The values of n were found to be in the range from 0.17 to 0.39 at the first stage and from 1.0 to 1.5 at the second stage. The activation energies of Cu-Cr alloys were determined by Cross-Cut method and were 90~136 kJ/mol. The maximum hardness value of $H_RB$ 84 was obtained in Cu-0.65wt.%Cr alloy.

• International Journal of Highway Engineering
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• v.9 no.3
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• pp.75-82
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• 2007

Washed wastewater generated from the intermittent cleaning process of the three tunnel sites located in the Seoul area showed high concentrations of SS, $COD_{Cr}$, T-N, $NH_3-N$, $NO_3-N$, Zn, Cu, Cr(+6), Mn, Mg, Phenol, $CN^-$ and E-Coli based on the water quality analysis. These characteristics of the deteriorative wastewater depend on the sampling method, cleaning frequency, released amount of washing water, inner material of tunnel wall, traffic volume, and type of drainage systems. Gravitational separation experiment of SS with collected tunnel wastewater showed considerable removal of pollutants such as 80% of $COD_{Cr}$, 30% of T-N and 90% of T-P simultaneously. GAC isotherm test was conducted to remove dissolved portion of the pollutants, and resulted in high removal efficiencies above 80% of $COD_{Cr}$, T-N, Zn, Cu, Mn, Phenol, CN in the experimental condition of GAC dosage of $50g/1/{\ell}$.

• Proceedings of the KAIS Fall Conference
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• 2000.10a
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• pp.34-35
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• 2000

용접기의 전극에 사용되는 크롬동합금은 일반적으로 높은 전기전도도와 고온강도가 요구되어진다. 크롬동합금은 대표적인 시효경화합금으로 용체화처리와 시효처리를 통하여 최적의 성질들이 얻어진다. 본 연구에서는 Cu-0.6wt%Cr, Cu-1.2wt%Cr 합금을 이용하여 용체화처리온도, 시효처리온도 및 시간 등을 변화시켜 실험하였다. 각 열처리에 따른 전기전도도와 경도를 측정하고 미세구조를 조사하여 최적의 공정조건을 구하였다. Cr이 적은 Cu-0.6wt%Cr 합금이 경도의 큰 감소없이 더 높은 전기전도도를 나타내었다.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.85-101
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• 1994

Effect of Cr, Cu and Ni metal powders addition on the alloyed layer of aluminum alloy (AC2B) has been investigated with the plasma transferred arc (PTA) overlaying process. The overlaying conditions were 125-200A in plasma arc current, 150mm/min in process speed and 5-20g/min in powder feeding rate. Main results obtained are summarized as follows: 1) It was made clear that formation of thick surface alloyed layer on aluminum alloy is possible by PTA overlaying process. 2) The range of optimum alloying conditions were much wider in case of Cu and Ni powder additions than the case of Cr powder addition judging from the surface appearance and the bead macrostructure. 3) Alloyed layer with Cu showed almost the homogeneous microstructure through the whole layer by eutectic reaction. alloyed layers with Cr and Ni showed needle-like and agglomerated microstructures, the structure of which has compound layer in upper zone of bead by peritectic and eutectic-peritectic reactions, respectively. 4) Microconstituents of the alloyed layer were analyzed as A1+CrA $l_{7}$ eutectics, C $r_{2}$al sub 11/, CrA $l_{4}$, C $r_{4}$A $l_{9}$ and C $r_{5}$A $l_{*}$ 8/ for Cr addition, Al+CuA $l_{2}$(.theta.) eutectics and .theta. for Cu addition, and Al+NiA $l_{3}$ eutectics. NiA $l_{3}$, N $i_{2}$A $l_{3}$ and NiAl for Ni addition. 5) Concerning defect of the alloyed layer, many blow holes were seen in Cr and Ni additions although there was lesser in Cu addition. Residual gas contents in blow hole for Cu and Ni alloyed layer were confirmed as mainly $H_{2}$ and a littie of $N_{2}$ Cracking was observed in compound zone of the alloyed layer in case of Cr and Ni addition but not in Cu alloyed layer.r.r.