• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.208-212
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• 2013

Dye-sensitized solar cells (DSCs) have taken much attention due to their low cost and easy fabrication method compare to silicon solar cells. But research on cost effective DSC is prerequisite for commercialization. Fluorine doped tin oxide (FTO) which have been commonly used for electrode substrate as electron collector occupied most percentage of manufacturing cost. Therefore we studied FTO-less DSC using sputtered Ti deposited glass as photoelectrode instead of FTO to reduce manufacturing cost. Ti films sputtered on the glass for different time, 5 to 20 minutes with decreasing sheet resistance as deposition time increases. A light source illuminated to counter electrode in order to overcome opaque Ti films. The efficiency of DSC (Ti20) made Ti sputtered glass for 20 min as photoelectrode was 5.87%. There are no significant difference with conventional cell despite lower manufacturing cost.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.251-251
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• 2016

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. Wastewaters are consisting of complex mixture of different inorganic and organic compounds and some of them can be toxic, hazardous and hard to degrade. These effluents are mainly treated by conventional technologies such are aerobic and anaerobic treatment and chemical coagulation. But, these processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that could be show higher purification results. Among them, boron doped diamond (BDD) attract attention as electrochemical electrode due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD on Nb, Ta, W and Si substrates, but, their application in effluents treatment is not suitable due to high cost of metal and low conductivity of Si. To solve these problems, Ti has been candidate as substrate in consideration of cost and property. But there are adhesion issues that must be overcome to apply Ti as BDD substrate. Al, Cu, Ti and Nb thin films were deposited on Ti substrate to improve adhesion between substrate and BDD thin film. In this paper, BDD films were deposited by hot filament chemical vapor deposition (HF-CVD) method. Prior to deposition, cleaning processes were conducted in acetone, ethanol, and isopropyl alcohol (IPA) using sonification machine for 7 min, respectively. And metal layer with the thickness of 200 nm were deposited by DC magnetron sputtering (DCMS). To analyze microstructure X-ray diffraction (XRD, Bruker gads) and field emission scanning electron microscopy (FE-SEM, Hitachi) were used. It is confirmed that metal layer was effective to adhesion property and improved electrode property. Electrochemical measurements were carried out in a three electrode electrochemical cell containing a 0.5 % H2SO4 in deionized water. As a result, it is confirmed that metal inter layer heavily effect on BDD property by improving adhesion property due to suppressing formation of titanium carbide.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.149-149
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• 2010

The double-layer antireflection (DLAR) coatings have significant advantages over single-layer antireflection (SLAR) coatings. This is because they will be able to cover a broad range of the solar spectrum which would enhance the overall performance of solar cells. Moreover films deposited at high frequency are expected to show excellent and UV-stable passivation in the refractive index that we adopted. In this work, we present a novel DLAR coating using SiNx:H thin films with refractive indices 1.9 and 2.3 as the top and bottom layers. This approach is cost effective when compared to earlier DLAR coatings with two different materials. SiNx:H films were deposited by Plasma enhanced chemical vapor deposition (PECVD) technique using $SiH_4$, $NH_3$ and $N_2$ gases with flow rates 20~80sccm, 200sccm and 85 sccm respectively. The RF power, plasma frequency and substrate temperature for the deposition were 300W, 13.56 MHz and $450^{\circ}C$, respectively. The optimum thickness and refractive indices values for DLAR coatings were estimated theoretically using Macleod simulation software as 82.24 nm for 1.9 and 68.58 nm for 2.3 respectively. Solar cells were fabricated with SLAR and DLAR coatings of SiNx:H films and compared the cell efficacy. SiNx:H> films deposited at a substrate temperature of $450^{\circ}C$ and that at 300 W power showed best effective minority carrier lifetime around $50.8\;{\mu}s$. Average reflectance values of SLAR coatings with refractive indices 1.9, 2.05 and 2.3 were 10.1%, 9.66% and 9.33% respectively. In contrast, optimized DLAR coating showed a reflectance value as low as 8.98% in the wavelength range 300nm - 1100nm.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.8 no.7
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• pp.2325-2349
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• 2014

Network virtualization technology plays a key role in cloud computing, which serves as an effective approach for provisioning a flexible and highly adaptable shared substrate network to satisfy the demands of various applications or services. Recently, the problem of mapping a virtual network (VN) onto a substrate network has been addressed by various algorithms. However, these algorithms are typically efficient for unicast service-oriented virtual networks, and generally not applicable to multicast service-oriented virtual networks (MVNs). Furthermore, the survivable MVN mapping (SMVNM) problem that considers the survivability of MVN has not been studied and is also the focus of this work. In this research, we discuss SMVNM problem under regional failures in the substrate network and propose an efficient algorithm for solving this problem. We first propose a framework and formulate the SMVNM problem with the objective of minimizing mapping cost by using mixed integer linear programming. Then we design an efficient heuristic to solve this problem and introduce several optimizations to achieve the better mapping solutions. We validate and evaluate our framework and algorithms by conducting extensive simulations on different realistic networks under various scenarios, and by comparing with existing approaches. Our simulation experiments and results show that our approach outperforms existing solutions.

• Korean Journal of Optics and Photonics
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• v.28 no.1
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• pp.1-8
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• 2017

A method for inspecting defects in display substrates utilizing Fourier optics is proposed in this paper. A cost-effective inspection system can be realized with the proposed method, because it does not require a high-magnification microscope. Also, the proposed method can avoid tight tolerance for variations in displacement between substrate and camera, which is stems from shallow depth of field of the high-magnification microscope. In addition, possible damage caused by collisions between substrate and the inspection equipment can be avoided. The decision algorithm can be simpler than for a conventional inspection system, because spatial shift of periodic substrate patterns does not affect the intensity distribution of the diffracted light, by the Fourier transform property. The proposed method is explained with numerical studies, and experiments are carried out to check its feasibility for color-filter substrates of a liquid-crystal display.

• Journal of Environmental Science International
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• v.16 no.8
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• pp.1001-1009
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• 2007

Passive sampler is a simple and cost-effective measuring equipment for ambient and indoor air pollution. We studied the performance of a short term (1 hour mean concentration) ozone passive sampler which was coated with a colorant (indigo carmine) to a filter substrate. Acetone and sulfamic acid added ozone passive sampler was investigated to measure short term mean ozone concentration. Ozone response and interference of criteria air pollutant($SO_2,\;NO_2$, CO) on a short term ozone passive sampler was tested through experimental chamber. The results show sulfamic acid added passive ozone sampler have good response in ozone exposure. Interference of $NO_2$ gas is larger than other two criteria gases.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.97-99
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• 2003

Novel asymmetric 45$^{\circ}$ Schiffman phase shifter having l-coupling for 2.3GHz applications is presented along with measurement results. The proposed phase shifter with a Teflon substrate is fabricated in a smaller area and cost-effective way as compared to the conventional Schiffman phase shifter. In addition, the characteristics of the fabricated phase shifter is extracted and compared. The proposed phase shifter seems useful particularly for the future 2.3GHz wireless applications.

• Bulletin of the Korean Chemical Society
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• v.35 no.3
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• pp.743-748
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• 2014

In this work, we describe a very simple electroless deposition method to prepare moderate-SERS-active nanostructured Pd films deposited on the glass substrates. To the best of our knowledge, this is the first report on the one-pot electroless method to deposit Pd nanostructures on the glass substrates. This method only requires the incubation of negatively charged glass substrates in ethanol-water mixture solutions of $Pd(NO_3)_2$ and butylamine at elevated temperatures. Pd films are then formed exclusively and evenly on glass substrates. Due to the aggregated structures of Pd, the SERS spectra of benzenethiol and organic isonitrile could be clearly identified using the Pd-coated glass as a SERS substrate. This one-step fabrication method of Pd thin film on glass is cost-effective and suitable for the mass production.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.235-235
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• 2010

The Anti-reflection coating(ARC) properties can be formed on silicon substrate using a simple electrochemical etching technique. This etching step can be improve solar cell efficiency for a solar cell manufacturing process. This paper is based on the removal of silicon atoms from the surface a layer of porous silicon(PSi). Porous silicon is form by anodization and can be obtained in an electrolyte with hydrofluoric. It have demonstrated the feasibility of a very efficient porous Si layer, prepared by a simple, cost effective, electrochemical etching method. We expect our research can results approaching to lower than 10% of reflectance by optimization of process parametaer.