• 한국정보과학회논문지:시스템및이론
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• 제34권11호
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• pp.599-609
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• 2007

플래시 메모리는 덮어 쓰기 제약이나, 쓰기와 삭제 연산의 단위가 다르다는 등의 특징을 가지고 있다. 따라서 플래시 메모리를 저장장치로 사용하는 파일 시스템은 블록 클리닝을 필요로 하며 이는 파일 시스템의 주된 병목으로 작용한다. 이에 따라 본 논문에서는 플래시 메모리 기반 파일 시스템의 병목 요소인 블록 클리닝에 따른 성능향상에 대해 연구한다. 우선 블록 클리닝에 영향을 끼치는 성능 인자로서 이용률, 무효율, 순수도를 정의하였다. 이 세 가지 인자를 통해 블록 클리닝 비용을 분석한 결과, 파일 시스템 수준에서 제어 가능한 인자인 순수도가 블록 클리닝 비용에 많은 영향을 끼침을 확인할 수 있었다. 따라서 순수도를 높게 유지하여 블록 클리닝 비용을 최소화함으로서 파일시스템의 성능을 향상 시킬 수 있는 MODA 할당 정책(modification-aware)을 설계하였고, 이를 내장형 보드와 YAFFS(Yet Another Flash File System)상에 구현하였다. 실험 결과 MODA는 YAFFS의 순차 할당 기법에 비해 블록 클리닝 시간을 평균 123% 단축 시켰다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.339-342
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• 1998

Plasma etching of photoresist needs high etch rate, good uniformity and rae, good uniformity and low damage in low cost. ICP asher is expected to satisfy these requriement for next eneration semiconductor devices. ICPsimulator has been used to design the ashing chamber to redcue the development time and cost, and its results have been verified by QMS, OES and langmuir probe measurments. Plasma characteristics are monitored in terms of RF power and chamber pressure.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2010년도 학술발표회
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• pp.798-802
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• 2010

The integration of GIS and fuzzy MCDA(Multi-Criteria Decision Analysis) allows the engineer to determine the preferred alternative for each spatial location in the study area. The next step is to recommend to the final decision makers a single flood management alternative for the entire region. Note that if the study area is large, it might be possible to use the kind of information to recommend different alternatives for different portions of the region. However, for this study it is assumed that only a single alternative will be used. In this study, a "cost of uniformity" metric is proposed that allows decision makers to compute the impact of selecting a single alternative for the entire floodplain. This metric represents the increase in the average distance metric value as compared to the spatially diverse solution from the MCDA and GIS analysis. The results could be applied to any region of the floodplain as desired. Whether the decision makers decide to apply these calculations to the entire floodplain or to specific important regions within the floodplain, an analysis of the increases in the cost of uniformity provides an integrated way for the decision maker to rank the alternatives. This should provide an improvement in their engineering analysis.

• 반도체디스플레이기술학회지
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• 제7권1호
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.378-381
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• 2003

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.728-731
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• 2002

For the evaporation process, thickness uniformity is of great practical importance. And, it is commercially significant to improve the efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. To achieve the better thickness uniformity and the higher evaporating efficiency, Samsung SDI has introduced the new concept of the asymmetric evaporation technology for depositing evener and cheaper organic layers. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled. Furthermore, the very high efficiency may allow the OLED displays be manufactured with the lower cost.

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.19-23
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• 2010

Nanoimprint lithography (NIL) is one of the most versatile and promising technology for micro/nano-patterning due to its simplicity, high throughput and low cost. Recently, one of the major trends of NIL is large-area patterning. Especially, the research of the application of NIL to TFT-LCD field has been increasing. Technical difficulties to keep the uniformity of the residual layer, however, become severer as the imprinting area increases. In this paper we performed a numerical study for a large area NIL (the $2^nd$ generation TFT-LCD glass substrate ($370{\times}470$ mm)) by using finite element method. First, a simple model considering the surrounding wall was established in order to simulate effectively and reduce the computing time. Then, the volume of fluid (VOF) and grid deformation method were utilized to calculate the free surfaces of the resist flow based on an Eulerian grid system. From the simulation, the velocity fields and the imprinting pressure during the filling process in the NIL were analyzed, and the effect of the surrounding wall and the uniformity of residual layer were investigated.

• 한국전기전자재료학회논문지
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• 제37권2호
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• pp.148-153
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• 2024

As complementary metal-oxide semiconductor (CMOS) is scaled down to achieve higher chip density, thin-film layers have been deposited iteratively. The poor film uniformity resulting from deposition or chemical mechanical planarization (CMP) significantly affects chip yield. Therefore, the development of novel fabrication processes to enhance film uniformity is required. In this context, high-pressure deuterium annealing (HPDA) is proposed to reduce the surface roughness resulting from the CMP. The HPDA is carried out in a diluted deuterium atmosphere to achieve cost-effectiveness while maintaining high pressure. To confirm the effectiveness of HPDA, time-of-flight secondary-ion mass spectrometry (ToF-SIMS) and atomic force microscopy (AFM) are employed. It is confirmed that the absorbed deuterium gas facilitates the diffusion of silicon atoms, thereby reducing surface roughness.