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Temperature Uniformity Control of Wafer During Vacuum Soldering Process  

Kang, Min Sig (Dept. of Mechanical and Automotive Engineering, Gachon University)
Jee, Won Ho (Nano Solution Tech.)
Yoon, Wo Hyun (Dept. of Civil Engineering, Gachon University)
Publication Information
Journal of the Semiconductor & Display Technology / v.11, no.2, 2012 , pp. 63-69 More about this Journal
As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.
Vacuum Soldering; Wafer Bonding; Temperature Uniformity; Stepwise Iterative Control; Heating Profile;
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