1 |
H. Schift, L. J. Heyderman, M. Auf der Maur, and J. Gobrecht, "Pattern formation in hot embossing of thin polymer films," Institute of Physics Publishing, Nanotechnology, Vol. 12, pp. 173-177, 2001.
DOI
ScienceOn
|
2 |
Heyderman, L. J., Schift, H., David, C., Gorbrecht, J., and Schweizer, T., "Flow behaviour of thin polymer films used for hot embossing lithography," Microelectronic Engieering, Vol. 54, pp. 229-245, 2000.
DOI
ScienceOn
|
3 |
Kim, N. W., Kim, K. W., and Lee, W.-Y., "A Numerical Analysis of Polymer Flow in Thermal Nanoimprint Lithography," Journal of the Semiconductor & Display Technology, Vol. 9, No. 3, pp. 29-34, 2010.
|
4 |
Chou, S. and Krauss, P., "Imprint lithography with sub-10nm feature size and high throughput," Microelectronic Engineering., Vol. 35, pp. 237-240, 1997.
DOI
ScienceOn
|
5 |
Guo, L. J., "Recent progress in nanoimprint technology and its applications," J. Phys. D: Appl. Phys., Vol. 37, pp. R123-R141, 2004.
DOI
ScienceOn
|
6 |
Kim, N. W., Kim, K. W., and Sin, H.-C., "Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model," Microelectronic Engineering., Vol. 85, pp. 1858-1865, 2008.
DOI
ScienceOn
|
7 |
Kim, N. W., Kim, K. W., and Sin, H.-C., "A mathematical model for slip phenomenon in a cavity-filling process of nanoimprint lithography," Microelectronic Engineering., Vol. 86, pp. 2324-2329, 2009.
DOI
ScienceOn
|