• Title/Summary/Keyword: Core-Chip

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Implementation of GSM Full Rate vocoder for the GSM mobile modem chip (GSM방식 단말기용 모뎀칩을 위한 GSM Full Rate 보코더 구현)

  • Lee Dong-Won
    • Proceedings of the Acoustical Society of Korea Conference
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    • autumn
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    • pp.9-12
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    • 2001
  • 본 논문에서는 유럽 통신 표준화기구인 ETSI 의 SMGll에서 채택된 GSM Full Rate(FR) 보코더 알고리wma[1]을 Teak DSP Core를 이용하여 실시간 구현하였다. GSM FR 보코더는 유럽에서 사용하는 통신 시스템인 GSM 의 full-rate Traffic Channel(TCH)의 표준 코덱[2]으로서 GSM HR, GSM EFR GSM AMR과 더불어 모뎀칩 내에 장착되는 필수적인 음성 서비스이다. 구현된 GSM FR는 13.05kbps의 비트율을 가지고 있으며, 인코더와 디코더 기능 외에 voice activity detection(VAD)[3]블록과 DTX[4]블록 등의 부가 기능도 구현되어 있다. 구현에 사용된 Teak[5]는 DSP Group 의 16bit고정 소수점 DSP core로서 최대 140MIPS 의 성능을 낼 수 있고 400bits ALU 와 두개의 MAC 이 장착되어 있어 음성 및 채널 부호화기의 실시간 처리에 최적화 되어있다. 구현된 GSM FR 은 인코더와 디코더 부분이 각각 약 235 MIPS 및 1.19MIPS 의 복잡도를 나타내며, 사용된 메모리는 프로그램 ROM 3.9K words, 데이터 ROM(table) 396 words 및 RAM 932words이다.

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Highly Luminescent Multi-shell Structured InP Quantum Dot for White LEDs Application

  • Kim, Gyeong-Nam;Jeong, So-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.531-531
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    • 2012
  • So many groups have been researching the green quantum dots such as InP, InP/ZnS for overcoming the semiconductor nanoparticles composed with heavy metals like as Cd and Pb so on. In spite of much effort to keep up CdSe quantum dots, it does not reach the good properties compared with CdSe/ZnS quantum dots. This quantum dot has improved its properties through the generation of core/shell CdSe/ZnS structure or core/multi-shell structures like as CdSe/CdS/ZnS and CdSe/CdS/ CdZnS/ZnS. In this research, we try to synthesize the InP multi-shell structure by the successiveion layer absorption reaction (SILAR) in the one pot. The synthesized multi-shell structure has improved quantum yield and photo-stability. To generate white light, highly luminescent InP multi-shell quantum dots were mixed with yellow phosphor and integrated on the blue LED chip. This InP multi-shell improved red region of the LEDs and generated high CRI.

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An InGaP/GaAs HBT Based Differential Colpitts VCO with Low Phase Noise

  • Shrestha, Bhanu;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.7 no.2
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    • pp.64-68
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    • 2007
  • An InGaP/GaAs HBT based differential Colpitts voltage control oscillator(VCO) is presented in this paper. In the VCO core, two switching transistors are introduced to steer the core bias current to save power. An LC tank with an inductor quality factor(Q) of 11.4 is used to generate oscillation frequency. It has a superior phase noise characteristics of -130.12 dBc/Hz and -105.3 at 1 MHz and 100 kHz frequency offsets respectively from the carrier frequency(1.566 GHz) when supplied with a control voltage of 0 volt. It dissipates output power of -5.3 dBm. Two pairs of on-chip base collector (BC) diodes are used in the tank circuit to increase the VCO tuning range(168 MHz). This VCO occupies the area of $1.070{\times}0.90mm^2$ including buffer and pads.

A Design of Instruction Based Wrapped Core Linking Module for Hierarchical SoC Test Access (계층적 SoC 테스트 접근을 위한 명령어 기반 코아 연결 모듈의 설계)

  • Yi Hyun-Bean;Park Sung-Ju
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.52 no.3
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    • pp.156-162
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    • 2003
  • For a System-on-a-Chip(SoC) comprised of multiple IP cores, various design techniques have been proposed to provide diverse test link configurations. In this paper, we introduce a new instruction based Wrapped Core Linking Module(WCLM) that enables systematic integration of IEEE 1149.1 TAP'd cotes and P1500 wrapped cores with requiring least amount of area overhead compared with other state-of-art techniques. The design preserves compatibility with standards and scalability for hierarchical access.

EISC based BlueTooth Baseband SoC Design and Verification (EISC 기반 블루투스 베이스밴드 SoC 설계 및 검증)

  • 진군선;김현미;임재윤
    • Proceedings of the IEEK Conference
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    • 2003.11c
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    • pp.255-258
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    • 2003
  • To design the Bluetooth core efficiently, I analyzed the entire architecture and basic functions in the baseband and attempted to implement a Bluetooth one-chip solution on the basis of the Bluetooth SIG specification 1.1. We implemented important blocks into the hardware and firmware and found increased efficiency implementation when compared with the results of the implementation that using the criterion of size, Performance, stability, etc. And then to connect the baseband to the SE3208 core of the EISC type, we defined the baseband register and discovered a suitable method by comparing two results with the two connection ways.

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A Design of Flag Based Wrapped Core Linking Module for Hierarchical SoC Test Access (계층적 SoC테스트 접근을 위한 플래그 기반 코아 연결 모듈의 설계)

  • 송재훈;박성주;전창호
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.1
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    • pp.52-60
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    • 2003
  • For a System-on-a-Chip(SoC) comprised of multiple IP cores, various design techniques have been proposed to provide diverse test link configurations. In this paper, we introduce a new flag based Wrapped Core Linking Module (WCLM) that enables systematic integration of IEEE 1149.1 TAP'd cores and P1500 wrapped cores with requiring least amount of area overhead compared with other state-of-art techniques. The design preserves compatibility with standards and scalability for hierarchical access.

Coreless Hall Current Sensor for Automotive Inverters Decoupling Cross-coupled Field

  • Kim, Ho-Gi;Kang, Gu-Bae;Nam, Dong-Jin
    • Journal of Power Electronics
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    • v.9 no.1
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    • pp.68-73
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    • 2009
  • Automotive inverters may require current sensors for motor torque control, especially, in applications of hybrid electric vehicles or fuel cell vehicles. In this paper, to achieve a compact, integrated and low cost current sensor, a hall current sensor without magnetic core is introduced for integrating an automotive inverter. The compactness of the current sensor is possible by using integrated magnetic concentrators based on the Hall effect. Magnetic fields caused by three-phase currents are analyzed and a magnetic shield design is proposed for decoupling the cross-coupled field. It offers galvanic isolation, wide bandwidth (>100kHz), and accuracy(< 1%). Using 2D FEM analysis, its performance is demonstrated with design parameters at a U-shaped magnetic shield. The proposed coreless current sensor is tested with rated current to validate the linearity and accuracy.

Design SoC for DC motor control (DC 모터 제어용 SoC 설계)

  • Yoon, Ki-Don;Oh, Sung-Nam;Kim, Kab-Il;Son, Young-Ik
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.411-413
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    • 2003
  • 본 논문에서는 ARM922T Core와 주변장치를 설계할 수 있는 100만 게이트의 FPGA를 내장한 알데라(Altera)사의 엑스칼리버(Excalibur)를 이용하여 DC모터 제어용 SoC를 설계하였다. SoC란 System on Chip의 약자로 하나의 칩 안에 프로세서와 다양한 목적의 주변장치들을 집적하는 것을 말한다. 모터를 구동하기 위한 PWM신호 생성기를 하드웨어 설계언어(Hardware Description Language)로 구현하고 시뮬레이션을 통해 설계모듈을 검증하였다. 이렇게 검증한 PWM 생성기 모듈과 ARM922T Core를 합성하여 SoC를 설계하였다. PWM 생성기 모들을 구성하는 내부의 각 분분을 VerilogHDL로 코딩하여 심볼로 만들어 통합하는 방식으로 설계를 하였으며 실제 모터를 구동하기 위해서 프로세서가 동작할 수 있도록 C언어로 프로그램하여 함께 칩에 다운로드하여 테스트를 하였다. SoC를 기반으로한 시스템 설계의 장점은 시스템이 간단해지고 고속의 동작이 가능하며 회로의 검증 및 다양한 시뮬레이션이 용이하다는데 있다.

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Physical and Mechanical Properties and Fire-endurance Characteristics of Recycled Particleboards

  • Suh, Jin-Suk;Han, Tae-Hyung;Park, Joo-Saeng;Park, Jong-Young
    • Journal of the Korea Furniture Society
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    • v.19 no.6
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    • pp.475-486
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    • 2008
  • In this study, fire-retardant chemicals were melt with mixed composition ratios of dibasic ammonium phosphate and each half of boric acid and borax in hot water, in which hammer-milled chips were immersed to increase swelling of waste particleboards. Also, fire-retardant treated particles from sawn lumber chip and recycled particleboard chip were composed in ratio of 70:30 in core layer to improve boards' properties. Retention ratio of fire-retardant chemicals for the particles for face layer was high due to high specific surface area, and that of sawn lumber chips was somewhat higher than that of recycled particleboard chips. The mixture of particles from sawn lumber chips and recycled PB of 70:30 in weight ratio exceeded bending strength of 100 $kgf/cm^2$. It seemed that the relatively greater portions of dibasic ammonium phosphate affected adversely to dimensional stability, however fire-retardants treatment resulted in distinct effect lowering formaldehyde emission such as $E_0$ type(0.5mg/$\ell$ or less) in KS F 3104. In fire-retardancy, the recycled boards with a mixed ratio of dibasic ammonium phosphate to boric acid borax(50:50 mixture) of 70% to 30% in weight satisfied fire-retardancy 3rd grade in KS F 2271, and also this composition from cone calorimeter test met same standard grade figuring total heat release of 4.6MJ/$m^2$.

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Variation of Characteristics of Solenoid-Type RF Chip Inductors on Inductor Size (인덕터 크기에 따른 솔레노이드 형 RF 칩 인덕터 특성 변화)

  • Yun, Eui-Jung;Kim, Jae-Wook
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.7
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    • pp.339-343
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    • 2006
  • In this study, the variations of the important characteristics of solenoid-type RF chip inductors utilizing a low-loss A1203 core material on inductor dimensions were investigated systematically. Four dimensions of the chip inductors fabricated in this work were $1.0\times0.5\times0.5mm^3,\;1.5\times1.0\times0.7mm^3,\;2.1\times1.5\times1.0mm^3,\;and\;2.4\times2.0\times1.4mm^3$ and copper (Cu) wire with $40{\mu}m$ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors as a function of inductor dimensions were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 6 have the inductance (L) of 12 to 82 nH and exhibit the self-resonant frequency (SRE) of 3.6 to 1.2 GHz. The SRF of inductors decreases with increasing the inductor size while the L increases with the inductor size. The smallest inductors of $1.0\times0.5\times0.5mm^3$ exhibited the L of 12 nH, SRF of 3.6 GHz, and the quality factor of 67 near the frequency of 1.1 GHz. The calculated data predicted the high-frequency data of the L, and Q of the developed inductors well.