• Environmental Engineering Research
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• 제17권1호
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• pp.17-25
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• 2012

Concern about green water problem has surfaced as a serious issue in Korea. In order to solve this problem, it is necessary to research inhibition of green water and corrosion control of copper pipe in water service. This paper discovered that moderate corrosion inhibitors can solve the green water problem and copper corrosion in water service by adding the optimal concentration of corrosion inhibitors based on regulation. Firstly, in the case of phosphate based corrosion inhibitors, as dosage of the corrosion inhibitor increases from 1 mg/L to 5 mg/L, the relative effect of corrosion inhibitor declines rapidly. Secondly, except for 1 mg/L dosage of silicate based inhibitor, relative effects of the inhibitor displays a positive number depending on inhibitor concentration. The most significant result is that the amount of copper release shows a downward trend, whereas the phosphate based inhibitor accelerates copper ion release as the inhibitor dosage increases. Thirdly, as the dosage of mixed inhibitors increases to 10 mg/L, the copper release change shows a similar trend of phosphate based inhibitor. Lastly, according to the Langelier saturation index (LI), silicate based inhibitors have the most non corrosive value. Larson ratio (LR) indicates that phosphate based inhibitors are the least corrosive. Korea water index (KWI) represents that silicate based inhibitors are most effective in controlling copper pipe corrosion.

• Journal of the Korean Wood Science and Technology
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• 제37권5호
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• pp.421-425
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• 2009

This research investigates the effect of copper retention on copper leaching in wood treated with copper-based preservatives. Radiata pine (Pinus radiata D. Don) sapwood samples were ground in a Wiley mill equipped with a 20-mesh screen. The ground wood was vacuum-treated with various concentrations of alkaline copper quat (ACQ), bis-(N-cyclohexyl-diazeniumdioxy)-copper (CB-HDO), and copper azole (CUAZ). The treated samples were conditioned at $70^{\circ}C$ and 100% RH for 72 hours. The samples were leached by using the distilled water for four weeks, and the copper contents in each sample were measured by X-ray spectroscopy. As expected, the copper leaching was increased with increasing of copper retention. The copper leaching from the ACQ and CB-HDO treated samples were gradually decreased with increasing copper retention: however, the copper losses from the CUAZ treated samples appeared to be proportionally increased with the increase in copper retention in all retention levels tested. The results indicate that at the conditions of the same copper retention ACQ and CB-HDO treated wood have a better leaching resistance compared to CUAZ treated wood.

• 한국분말재료학회지
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• 제17권4호
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• pp.276-280
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• 2010

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of the Korean Wood Science and Technology
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• 제40권3호
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• pp.212-227
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• 2012

본 연구에서는 CCA일몰 후, 내구성 향상을 위한 목재보존제의 최근 국제적 연구 동향에 대해 조사 연구하였다. 가압용 약제로 많이 사용되고 있는 최근의 구리 기반 약제의 형태는 수용성으로 ACQ나 CuAz 등의 구리 정착 개선 및 유효성분의 용탈 방지 등이 이슈화 되어 있으며, 미분화(micronized copper) 또는 나노 크기 입자를 이용한 유제형 약제 출현으로 이들의 목재 내 침투 및 정착 특성 연구 등에 대한 논란이 많은 상황이다. 또한 CCA와 달리 현재의 alkyl ammonium quat. 또는 azol 약제 등의 경우에는 구리 내성균에 대해 항균성 감소가 많아 이에 대비한 co-biocide 개발이 심각하게 요구되고 있다.

• Tribology and Lubricants
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• 제36권4호
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• pp.207-214
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• 2020

In this study, we investigated the effects of copper and copper-alloy on the frictional and wear properties of low-steel friction material. The proportions of copper and copper-alloy in the brake friction materials used in passenger cars are very high (approximately 5-20% weight), and these materials have significant effects on friction and wear characteristics. In this study, the effects of cupric ingredients, such as the copper fiber and brass fiber, are investigated using the friction materials based on commercial formulations. After the copper and brass fibers from the same formulation were removed, the frictional and wear characteristics were evaluated to determine the influence of the copper and copper-alloy. We evaluated the frictional and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The results show that the friction material containing copper and brass fibers have excellent frictional stability and a low wear rate compared to the friction material that does not contain copper and brass fibers. These results are attributed to the excellent ductility, moderate melting point, high strength, and excellent thermal conductivity of copper and copper-alloy. We analyzed the surfaces of the friction materials before and after the performing the friction tests using a scanning electron microscope-energy dispersive X-ray spectroscope, confocal microscope, and roughness tester to verify the frictional behavior of copper and copper-alloy. In future studies, it will be applied to the development of copper-free friction materials based on the results of this study.

• 공업화학
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• 제19권6호
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• pp.629-632
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• 2008

N-Arylation에 대한 경제적이고 실용적인 촉매시스템을 찾기 위하여 indole을 이용한 다양한 반응조건에서 실험이 수행되었으며, 결과적으로 본 연구에서 처음 시도한 copper nitrate와 copper cabonate가 다른 copper계 촉매나 palladium 촉매에 유사하거나 더 우수한 반응성을 보여주었다. Copper nitrate 촉매를 사용하는 경우에는 다양한 리간드 중에서 N,N'-dimethylethylenediamine 리간드가 더 효과적이었으며 copper cabonate 계에서는 ethylenediamine 리간드가 더 적합한 것으로 판명되었다.

• 센서학회지
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• 제32권6호
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• pp.352-356
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• 2023

The integration of bioelectronic devices with the skin is a promising strategy for personalized healthcare monitoring and diagnostics. On-skin bioelectrodes hold great potential for the real-time tracking of physiological parameters. However, persistent challenges of stability and reliability have instigated exploration beyond conventional noble metals. This study focuses on the ionic passivation and oxidation dynamics of copper-based on-skin thin-film bioelectrodes. Through parylene chemical vapor deposition, we harness a controlled thin film of parylene insulation to counter the intrinsic susceptibility of copper to oxidation in the ionic environment. The results represent the relationship among the parylene insulation thickness, copper oxidation, and electrode impedance over temporal intervals. Comparative analyses indicate that the short-term stability of the copper electrode is comparable to that of the gold electrode. Therefore, we propose a cost-effective strategy for fabricating copper-based on-skin bioelectrodes by introducing enhanced ionic stability within a discernible operational timeframe. This study enriches our understanding of on-skin bioelectronics and affordable material choices for practical use in wearable healthcare devices.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.569-570
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• 2006

In this study, the characteristics of Electrical Discharge Machining (EDM) with the electrode materials were investigated. EDM experiments have been carried out on electrodes with eight different copper-based and graphite-based materials. From the results, the copper-based electrodes showed excellent surface roughness than the graphite-based electrodes. But graphite based electrodes have advantages in economic aspects.

• Bulletin of the Korean Chemical Society
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• 제22권4호
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• pp.379-382
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• 2001

A new ligand containing the long aliphatic hydrocarbon chain, dipyridylstearylamine (dps) and its copper(Ⅱ) complex, Cu(dps)(NO3)2 have been prepared. The copper complex was characterized structurally and spectroscopically. The XRD crystal structure of the copper complex reveals that copper is octahedrally coordinated by dps and two nitrato ligands. The nitrato groups ligate asymmetrically to the copper. Crystal data are P1bar, a=8.249(2), b=10.416(3), $c=20.915(4)\AA$, $\alpha=86.54(2)$, $\beta=84.026(2)$, $\gamma=72.32(2)^{\circ}$, V=1702.7(7) $\AA3$ , Z=2, ${\lambda}$(Mo $K\alpha)=0.71073\AA$, $\mu=0.689$ mm-1 , T=293(2) K, R=0.0560 for 3529 reflections. The dps and the copper complex are stable in the air and the copper complex exhibits features of typical of other copper(Ⅱ) complexes containing dipyridylamine-based ligand.