• Journal of the Korean Chemical Society
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• v.55 no.4
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• pp.620-625
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• 2011

A simple, rapid potentiometric back titration of Isoniazid (INH) in the presence of Rifampicin (RIF) in tablets and syrups is described. The method is based on the oxidation of INH by a known excess of copper (II) ion and the back titration of unreacted copper (II) ion potentiometrically with ascorbic acid using a lab-made Copper Based Mercury Film Electrode (CBMFE). The titration conditions have been optimized for the determination of 1.0-10.0 mg of INH in pure and dosage forms. The precision and accuracy of the method have been assessed by the application of lack-of-fit test and other statistical methods. Interference was not caused by RIF and other excipients present in dosage forms. Application of the method for INH assay in tablets and syrups was validated by comparison of the results of proposed method with that of the British Pharmacopoeia (BP) method using F- and t- statistical tests of significance.

• Corrosion Science and Technology
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• v.18 no.2
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• pp.39-48
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• 2019

The feasibility of using benzotriazole (BTAH) to inhibit pitting corrosion in the sprinkler copper tubes was investigated by filling the tubes with BTAH-water solution in 829 households at an eight-year-old apartment complex. The water leakage rate was reduced by approximately 90% following BTAH treatment during 161 days from the previous year. The leakage of one of the two sprinkler copper tubes was investigated with optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and X-ray diffraction analysis to determine the formation of Cu-BTA film inside the corrosion pits. All the inner components of the corrosion pits were coated with Cu-BTA films suggesting that BTAH molecules penetrated the corrosion products. The Cu-BTA film was about 2 nm in thickness at the bottom of a corrosion pit. A layer of CuCl and $Cu_2O$ phases lies under the Cu-BTA film. This complex structure effectively prevented the propagation of corrosion pits in the sprinkler copper tubes and reduced the water leakage.

• Corrosion Science and Technology
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• v.10 no.4
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.134-134
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• 2016

The effect of different thermal treatments on the sub-50 nm copper nanoparticles is examined in the aspects of chemical, electrical and surface morphology. The copper nanoparticles are chemically synthesized and fabricated for paste-type solution. Simple bar coating method is practiced as a deposition process to form copper thin film on a typical slide glass. Deposited copper thin films are annealed by two different routes: general tube furnace with 99.99 % Ar atmosphere and selective laser sintering process. The thermal behavior of the different thermal-treated copper thin films is compared by SEM, XRD, FT-IR and XPS analysis. In this study, the laser sintering process ensures low annealing temperature, fast working speed and ambient-accessible route. Moreover, the laser-sintered copper thin film shows good electrical property and enhanced chemical stability than conventional thermal annealing process. Consequently, the proposed laser sintering process can be compatible with plastic substrate for flexible applications.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.51-57
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• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• BMB Reports
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• v.42 no.11
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• pp.752-757
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• 2009

Copper is essential but toxic in excess for aerobic organisms. Yeast transcription factor ACE1 functions as a sensor for copper and an inducer for the transcription of CUP1. In addition, ACE1 can activate the transcription of superoxide dismutase gene (sod1) in response to copper. In this study, we introduced the yeast ACE1 into Arabidopsis and analyzed its function in plant. Under high copper stress, the transgenic plants over-expressing ACE1 showed higher survival rate than the wild-type. We also found that over-expression of ACE1 in Arabidopsis increased the activities of SOD and POD, which were beneficial to the cell in copper buffering. Excess copper would suppress the expression of chlorophyll biosynthetic genes in Arabidopsis, RT-PCR analysis revealed that over-expression of ACE1 decrease the suppression. Together, our results indicate that ACE1 may play an important role in response to copper stress in Arabidopsis.

• Journal of Preventive Medicine and Public Health
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• v.31 no.2 s.61
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• pp.265-274
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• 1998

To investigate the change of nitric oxide(NO), copper, and zinc in serum on smoking and alcohol ingestion in young adults, this study was performed in a cross-sectional study in 127 healthy men in Korea who had HBsAg(-), HCVAb(-), and no symptomatic liver, heart, gastrointestinal, chronic diseases, and inflammatory sign(lower than 10,000 white blood cell count in CBC). At the men's entry into the study, blood samples were drawn from each subject and immediately centrifuged for analysis of NO, copper, and zinc. Each man completed a questionnaire that provided information on smoking, alcohol intake and present and past medical history NO was analyzed by HPLC(Green et al., 1982), copper and zinc by atomic absorption spectrophotometer with air-acetylene flame and total cholesterol(TC) by Spectrum EPX. Smoking(number of cigarettes per day and pack-year) and alcohol intake was grouped fertile. Copper was adjusted for age and zinc and for age and TC. NO, copper, and zinc on smoking and alcohol ingestion were analyzed in general linear models, respectively. NO, copper and zinc in serum did not show statistical differences between non-smoking and high-smoking group and no-alcohol intake and high-alcohol intake group. This study suggested that copper, zinc, and NO was not. good biological marker for early effect by smoking and alcohol intake in young adults. However, selection bias should be considered in evaluation of this result. A large prospective study will be needed in advance on usefulness of copper, zinc, and NO as a marker for risk factors and early change of atherosclerosis.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09a
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• pp.1370-1376
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• 2010

In this study, usability and stability in the caisson filling material were reviewed that copper salg(one million tons per one-year) were produced by smelter. In order to complete these studies, chemical and physical comparing analyses were performed by sea-sand materials as to the materials suitability, After construction, the structural displacement of caisson was measured by the instrument and was examined for stability. As a result of analysis, it was determined that copper slag is eco-friendly, and can be used as recycled alternative to aggregates materials.

• KSTLE International Journal
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• v.2 no.1
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• pp.22-28
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• 2001

A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.