• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1529-1534
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• 2012

In this study, tensile tests for 12-${\mu}m$-thick copper thin foils were performed by using the DIC method. The DIC method provided precise stress-strain curves for thin film materials, and a commercial inkjet printer can be simply and effectively used for printing speckle patterns on the specimen of Cu thin films whose surface contrast is too low to apply the DIC method. The mechanical properties of Cu thin foils obtained in this study are as follows: elastic modulus E = 89.2 GPa, 0.2% offset yield stress $S_{0.2%}$= 232.8 MPa, tensile strength $S_u$= 319.2 MPa, elongation at fracture ${\varepsilon}_f$=16.8 %, and Poisson's ratio ${\nu}$= 0.34.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.322-325
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• 2007

This paper suggests a non-contact sensor for measuring bending vibration of a non-metallic cylinder in two orthogonal directions simultaneously. Recent research shows that a solenoid can pick up bending vibrations of a nonmetallic cylinder based on the reversed Lorentz force mechanism if an electrical conductive patch is attached to the cylinder. In this work, pairs of specially designed patches are used to make two independent paths for the current induced by bending vibrations, which enables the measurement of bending vibrations along two orthogonal directions simultaneously. The working performance of the developed sensor was verified by using two accelerometers.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.151-151
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• 2003

최근 휴대폰용 LCD, 컴퓨터용 TFT LCD, 가정용 PDP 등 평판 디스플레이 산업의 발달에 힘입어 평판 디스플레이 장치의 구동 칩 실장 부품인 TCP(tape carrier package), COF(chip on film) 제조 산업 또한 발전하고 있다. 이들 TCP, COF는 디스플레이 장치의 경박화에 따라 보다 가는 선폭의 회로가 요구되어지는데 이를 위해 회로를 구성하는 기본소재로 얇은 두께의 동박이 사용된다. 회로기판용 동박으로는 압연동박과 전해동박이 함께 사용되어 왔으나 박막의 제조가 어려운 압연동박의 단점과 면에 수직한 주상정 조직이 발달해 있어 일반 압연 동박에 비해 접착력이 뛰어나며 전류밀도 또는 티타늄 음극 드럼 회전 속도를 조절하여 두게 조절이 용이한 전해동박의 장점으로 인해 현재 압연동박의 전해동박으로의 대체가 증가하고 있다. 전해동박의 제조공정은 크게 제박 공정과 후처리 공정으로 나눌 수 있다. 전해동박은 먼저 드럼형태의 티타늄 음극과 불용성 납 양극으로 이루어진 제박기에 고 전류를 가하여 황산구리 용액 중 구리를 티타늄 음극에 석출시킴으로서 구리 원박을 제조한 후 접착력 향상을 위한 노듈 형성, 방식, 방청, 내열성 향상 등을 위한 여러 개의 단위 셀 조합으로 이루어진 후처리 공정을 거쳐 제조된다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.23-23
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• 2003

PCB 회로기판용 전해동박은 드럼형태의 음극 표면에 연속적으로 전기 도금한 후 벗겨내어 권취하는 원박 제조공정과 접착성, 내열성, 내화학성, 방청성을 부여하기 위한 후처리 공정으로 나눈다. 이 후처리 공정 중 동박과 수지와의 접착성을 부여하기 위해 일반적으로 전기도금을 통해 조화(Nodule)처리를 실시하는데, 최근 LCD, PDP 등의 평판 디스플레이 장치의 구동칩이 실장되는 TCP용 동박의 경우 2$\mu\textrm{m}$이하의 낮은 조도(Rz)와 함께 높은 접착강도(Peel Strength)가 요구되고 있다. 그러나, Reel to Reel 형태의 연속도금공정으로 진행되는 조화처리에 있어 일반 비이커 실험결과는 실제 양산공정과의 재현성에 있어서 상당한 제한성이 노출된 바 있다. 이에 본 연구에서는 Reel to Reel 형태의 연속도금공정을 모사 할 수 있는 실험장치를 설계, 제작하여 동박표면의 노듈형성에 있어 주요인자를 정량적으로 분석하였다.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.4
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• pp.381-385
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• 2008

This paper suggests a non-contact sensor for measuring bending vibration of a non-metallic cylinder in two orthogonal directions simultaneously. Recent research shows that a solenoid can pick up bending vibrations of a nonmetallic cylinder based on the reversed Lorentz force mechanism if an electrically conductive patch is attached to the cylinder. In this work, pairs of specially designed patches are used to make two independent paths for the current induced by bending vibrations, which enables the measurement of bending vibrations along two orthogonal directions simultaneously. The working performance of the developed sensor was verified by using two accelerometers.

• Journal of Korean Elementary Science Education
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• v.17 no.1
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• pp.105-112
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• 1998

It is well known that making electric motors is very difficult in chapter 2, "Electric Current and Magnetic Field", natural science textbook 6-1 in primary school. In the present paper, we propose a new and successful method for making them. The most important point is that iron cores are not used in making electromagnets. This resolves the problem that both poles of electromagnet can be attracted by any pole of permanent magnet because of iron core in the electromagnet. The thick enamel wire is used as arms of armature so that they can support the electromagnet stably and we can reliably strip off the skin of the enamel wires, completely for one end and half for the other end of the enamel wires coming from the electromagnet. In addition, we suggest the ring-type support made of aluminum foil and the M-shaped support made of thick enamel wire that can substitute for the M-shaped copper wire support for armature. armature.

• 보존과학연구
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• s.14
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• pp.45-76
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• 1993

Au-Cu alloyed coating layer were found by Hg-amalgam process and it seemed to be used Cu-amalgam process similar to Au-amalgam. Coated layer is dense and unique, Thickness of layer was 1.5 to $18.0\mum$ which had 95.3 to 99.8% purity of gold Matrix metal mostly cosists of forged copper alloy which had high purity and ferrite ($\alpha$) strusture. It showed excellent refining technical level at that time. Aowever, the nail, ferrous matrix used for strength needed, composed of silver foil packed and gold layer for adherence between ferrous matrix and gold layer

• Journal of Power Electronics
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• v.13 no.3
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• pp.458-468
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• 2013

Large capacity reactive power compensation and harmonic control in the low-voltage grid of an enterprise, are important technical means to improve power quality and reduce power loss. In this paper, the principle of an efficient power quality controller is analyzed. Then, key application technologies of the HPQC which would influence the performances of the HPQC are studied. Based on an analysis of the harmonic shunt problem, a frequency dividing control strategy of the HPQC continuous subsystem is proposed. A parameter design method of the HPQC discrete subsystem and its installation method are also proposed to ensure the system compensation effect. HPQC systems have been designed for a copper foil plant. The effectiveness of this paper has been verified by the simulation and application results.