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M. H. Kim, H. R. Cha, C. S. Choi, H. S. Kim and D. Y. Lee, "The Influence of Gelatin Additives on the Mechanical Properties of Electrodeposited Cu Thin Films", Kor. J. Met. Mater., 48(10), 884 (2010).
DOI
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2 |
K. Kondo, N. Yamakawa, Z. Tanaka and K. Hayashi, "Copper damascene electrodeposition and additives", J. Electroanal. Chem., 559, 137 (2003).
DOI
ScienceOn
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3 |
W. P. Dow, C. C. Li, M. W. Lin, G. W. Su and C. C. Huang, "Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layerand Various Levelers", J. Electrochem. Soc., 156, 314 (2009).
DOI
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4 |
S.E. Lee and J.H. Lee, "Copper Via Filling Using Organic Additives and Wave Current Electrolating", J. Microelectron. Packag. Soc., 14(3), 37 (2007).
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5 |
W. P. Dow, C. C. Li, Y. C. Sub, S. P. Shena, C. C. Huang, C. Lee, B. Hsu and S. Hsu, "Microvia filling by copper electroplating using diazine black as a leveler", Electrochim. Acta, 54, 5894 (2009).
DOI
ScienceOn
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6 |
Y. Y. Lee, Y. J. Park, J. B. Lee and B. W. Cho, "Effects of Leveler on the Trench Filling during Damascene Copper Plating", J. Korean. Electrochem. Soc., 5(3), 153 (2002).
DOI
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7 |
S. H. Kim, S. H. Cho, N. E. Lee, H. M. Kim, Y. W. Nam and Y. H. Kim, "Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma", Surf. Coat. Tech., 193, 101 (2005).
DOI
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8 |
S. S. Byun and J. H. Lee, "The Effects of Copper Electroplating Bath on Fabrication of Fine Copper Lines on Polyimide Film Using Semi-additive Method", J. Microelectron. Packag. Soc., 13(2), 9 (2006).
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9 |
M. H. Kim, H. R. Cha, C. S. Choi, H. S. Kim and D. Y. Lee, "Effects of Gelatin Additives on the Microstructures and Corrosion Properties of Electrodeposited Cu Thin Films", Kor. J. Met. Mater., 48(8), 757 (2010).
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