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http://dx.doi.org/10.3795/KSME-A.2012.36.12.1529

Tensile Tests for Copper Thin Foils by Using DIC Method  

Kim, Chung Youb (Division of Mechanical and Automotive Engineering, Chonnam Nat'l Univ.)
Song, Ji Ho (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology)
Park, Kyung Jo (Division of Mechanical and Automotive Engineering, Chonnam Nat'l Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.36, no.12, 2012 , pp. 1529-1534 More about this Journal
Abstract
In this study, tensile tests for 12-${\mu}m$-thick copper thin foils were performed by using the DIC method. The DIC method provided precise stress-strain curves for thin film materials, and a commercial inkjet printer can be simply and effectively used for printing speckle patterns on the specimen of Cu thin films whose surface contrast is too low to apply the DIC method. The mechanical properties of Cu thin foils obtained in this study are as follows: elastic modulus E = 89.2 GPa, 0.2% offset yield stress $S_{0.2%}$= 232.8 MPa, tensile strength $S_u$= 319.2 MPa, elongation at fracture ${\varepsilon}_f$=16.8 %, and Poisson's ratio ${\nu}$= 0.34.
Keywords
Mechanical Properties; Copper Thin Foil; Tensile Test; Digital Image Correlation;
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Times Cited By KSCI : 1  (Citation Analysis)
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