• Title/Summary/Keyword: Copper

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Recovery of Nickel and Copper from Scraped Nickel Condensers

  • Liang, Ruilu;Kikuchi, Eiji;Kawabe, Yoshishige;Sakamoto, Hiroshi;Fujita, Toyohisa
    • Proceedings of the IEEK Conference
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    • 2001.10a
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    • pp.188-192
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    • 2001
  • Magnetic separation and sulphidization-flotation for recovery of nickel and copper from two types of scraped condenser wastes, containing 8- l4% nickel and 2-4% copper, were studied. The effects of magnetic field intensities, classification, and grinding on the recovery of nickel and copper were investigated. According to the characteristics of nickel and copper in the scraps, classification-magnetic separation, different magnetic field intensities, and stages-grinding-cleaning of rough concentrate were investigated. The nickel concentrates containing 38-65% nickel with 84-97% recoveries and the copper concentrates containing 25-43% nickel with 35-60% recoveries were obtained by classification-magnetic separation. In addition, copper concentrates containing 26-45% copper with 76-88% recoveries were obtained by sulphidization-flotation from magnetic tailings and middling products.

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A Study on Improvement of Fastness on Cotton-dyed Fabric by Aftertreatment with Copper Sulfate/Thiourea (황산구리/치오요소 후처리에 희한 직접염료의 견뢰도 증진에 관한 연구(II))

  • Yoon, Jung Im;Kim, Kyung Hwan
    • Textile Coloration and Finishing
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    • v.5 no.4
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    • pp.1-9
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    • 1993
  • The Cotton fabric was dyed with various directd dyes, and then treated with copper sulfate or copper sulfate/thiourea. Munsell color system, dye exhaustion, tensile strength, light fastness, washing fastness and rubbing fastness were investigated for the treated fabrics. The results obtaind are as follows: 1. The color variation of the cotton-dyed fabric by aftertreatment with copper sulfate was shown redish, but original color with copper sulfate/thiourea. 2. Copper sulfate/thiourea was much more effective than copper sulfate only to increase the light fastness, washing fastness and rubbing fastness. 3. Dye exhaustion of the cotton-dyed fabric by aftertreatment with copper sulfate was decreased about 20% more than those of untreated. 4. Tensile stregth of cotton-dyed fabric by aftertreatment with copper sulfate/thiourea was decrease about 10% more than those of untreated.

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Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

  • Hwang, Jaeeun;Kim, Sinhee;Ayag, Kevin Ray;Kim, Hongdoo
    • Bulletin of the Korean Chemical Society
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    • v.35 no.1
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    • pp.147-150
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    • 2014
  • Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at $110^{\circ}C$ to $150^{\circ}C$ to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of $1.88{\mu}{\Omega}{\cdot}cm$ of copper film was obtained at $150^{\circ}C$ in gaseous formic acid condition. The long-term resistivity shows to increase from $1.88{\mu}{\Omega}{\cdot}cm$ to $2.61{\mu}{\Omega}{\cdot}cm$ after one month.

Study of defect characteristics by electrochemical plating thickness in copper CMP (Copper CMP에서 Electrochemical Plating 두께에 따른 Defect 특성 연구)

  • Kim, Tae-Gun;Kim, Nam-Hoon;Kim, Sang-Yong;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.125-126
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    • 2005
  • Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

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Galvanic Corrosion Behavior of Copper Canister

  • Minsoo Lee;Junhyuk Jang;Jin Seop Kim
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.22 no.1
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    • pp.55-66
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    • 2024
  • In this study, we investigated the suppression of the corrosion of cast iron in a copper-cast iron double-layered canister under local corrosion of the copper layer. The cold spray coating technique was used to insert metals with lower galvanic activity than that of copper, such as silver, nickel, and titanium, between the copper and cast iron layers. Electrochemically accelerated corrosion tests were performed on the galvanic specimens in KURT groundwater at a voltage of 1.0 V for a week. The results revealed that copper corrosion was evident in all galvanic specimens of Cu-Ag, Cu-Ni, and Cu-Ti. By contrast, the copper was barely corroded in the Cu-Fe specimens. Therefore, it was concluded that if an inactive galvanic metal is applied to the areas where local corrosion is concerned, such as welding parts, the disposal canister can overcome local or non-uniform corrosion of the copper canister for long periods.

MANUFACTURE OF LOW SULPHUR PIG IRON FROM COPPER SLAG

  • URTNASAN ERDENEBOLD;CHOI MOO SUNG;JEI-PIL WANG
    • Archives of Metallurgy and Materials
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    • v.65 no.1
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    • pp.349-355
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    • 2020
  • Copper slag differs by chemical composition and structure, depending on the type of processing. Copper slag typically contains about 1 wt.% copper and 40 wt.% iron depending upon the initial ore quality and type of furnace used. The aim is to produce a typical foundry pig iron with the chemical composition of C > 3.40 wt.%, Si 1.40 to 1.80 wt.%, Mn 0.30 to 0.90 wt.%, P < 0.03 wt.% and S < 0.03 wt.% from copper slag. But foundry pig iron manufactured from copper slag contains a high sulphur content. Therefore, this study examines how to conduct desulphurization. Desulphurization roasting and reduction smelting with desulphurization additives used to remove sulphur from the copper slag. The results showed that desulphurization effect of desulphurization roasting is poor but when combined with reduction smelting with CaO addition is possible to manufacture low sulphur pig iron from copper smelting slag.

Surface Modification of Silica Spheres for Copper Removal

  • Kim, Byoung-Ju;Park, Eun-Hye;Kang, Kwang-Sun
    • Journal of the Korean Chemical Society
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    • v.60 no.5
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    • pp.317-320
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    • 2016
  • Efficient copper removal from water was achieved by using surface modified silica spheres with 3-mercaptopropyltrimethoxysilane (MPTMS) using base catalyst. The surface modification of silica spheres was performed by hydrolysis and condensation reactions of the MPTMS. The characteristic infrared absorption peaks at 2929, 1454, and 1343 cm−1 represent the −CH2 stretching vibration, asymmetric deformation, and deformation, respectively. The absorption peaks at 2580 and 693 cm−1 corresponding the −SH stretching vibration and the C-S stretching vibration indicate the incorporation of MPTMS to the surface of silica spheres. Field emission scanning electron microscope (FESEM) image of the surface modified silica sphere (SMSS) shows nano-particles of MPTMS on the surface of silica spheres. High concentration of copper solution (1000 ppm) was used to test the copper removal efficiency and uptake capacity. The FESEM image of SMSS treated with the copper solution shows large number of copper lumps on the surface of SMSS. The copper concentration drastically decreased with increasing the amount of SMSS. The residual copper concentrations were analyzed using inductively coupled plasma mass spectrometer. The copper removal efficiency and uptake capacity with 1000 ppm of copper solution were 99.99 % and 125 mg/g, respectively.

Effect of Copper ion on Xanthine Oxidase Activity and Type Conversion (Xanthine oxidase 활성 및 형전환에 미치는 구리이온의 영향)

  • Huh, Keun;Lee, Sang-Il;Park, Jeen-Woo
    • YAKHAK HOEJI
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    • v.38 no.2
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    • pp.211-217
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    • 1994
  • Copper intoxication and disturbance of copper metabolism induced various oxygen-derived free radicals related damages. The effect of copper ion on xanthine oxidase activity and type conversion of the enzyme which is concerned to generation of reactive oxygen species, was investigated, It was observed that xanthine oxidase activity was increased by addition of copper ion in the reaction mixture in proportional to the concentration of the metal ion until $60\;{\mu}M$, while the enzyme activity was inhibited in higher concentration of copper treatment. On the other hand, xanthine dehydrogenase activity was inhibited by copper ion addition with concentration dependently. Preincubation of enzyme source with $30\;{\mu}M$ of copper ion, which concentration marked increased the xanthine oxidase activity, unchanged the enzyme activity and type conversion compare to control in vitro system. It was also observed that copper induced xanthine oxidase activity and the enzyme type conversion was protected by dithiothreitol and penicillamine. These results indicate that the increment of the type conversion of xanthine oxidase necessarilly need the presence of copper ion in enzyme assay system.

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Reactivity Evaluation on Copper Etching Using Organic Chelators (유기 킬레이터들을 이용한 구리 식각에 대한 반응성 평가)

  • Kim, Chul Hee;Lim, Eun Taek;Park, Chan Ho;Park, Sung Yong;Lee, Ji Soo;Chung, Chee Won;Kim, Dong Wook
    • Korean Journal of Materials Research
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    • v.31 no.10
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    • pp.569-575
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    • 2021
  • The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

Spatial Pattern of Copper Phosphate Precipitation Involves in Copper Accumulation and Resistance of Unsaturated Pseudomonas putida CZ1 Biofilm

  • Chen, Guangcun;Lin, Huirong;Chen, Xincai
    • Journal of Microbiology and Biotechnology
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    • v.26 no.12
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    • pp.2116-2126
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    • 2016
  • Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a $75{\mu}m$ thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling $Cu_3(PO_4)_2$ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were $Cu_3(PO_4)_2$-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% $Cu_3(PO_4)_2$, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.