• Transactions of Materials Processing
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• v.27 no.3
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• pp.160-164
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• 2018

The success of warm forming of Mg alloy sheets is very dependent on its frictional behavior at elevated temperatures. The effects of contact pressure and sliding length on the frictional characteristics of AZ31B Mg alloy sheet were investigated at elevated temperature and at room temperature. The contact pressure range for the friction test was determined through FE analysis of the roof panel which is a candidate for Mg alloy application. According to the experimental results, the frictional behavior of the Mg alloy sheet is equally highly influenced by both sliding length and contact pressure at room temperature. At elevated temperatures, however, the sliding length has a more dominant influence on the frictional characteristics of the Mg alloy sheet than the contact pressure, if the contact pressure is lower than a certain level.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.138-143
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• 2005

Finite Element analysis is widely applied to elevated temperature forging processes and shows a lot of information of plastic deformation such as strain, stress, defects, damages and temperature distributions. In highly elevated temperature deformation processes, temperature of material and tool have significant influence on tool life, deformation conditions and productivities. To predict temperature related properties accurately, adequate coefficients of not only contact heat transfer between material and dies but also convection heat transfer due to coolants are required. In most F.E analysis, too higher value of contact heat transfer coefficient is usually applied to get acceptable temperature distribution of tool. For contact heat transfer coefficients between die and workpiece, accurate values were evaluated with different pressure and lubricants conditions. But convection heat transfer coefficients have not been investigated for forging lubricants. In this research, convection heat transfer coefficients for cooling by emulsion lubricants are suggested by experiment and Inverse method. To verify acquired convection and contact heat transfer coefficients, tool temperature was measured for the comparison between measured tool temperature and analysis results. To increase analysis accuracy, repeated analysis scheme was applied till temperature of the tool got to be in the steady-state conditions. Verification of heat transfer coefficients both contact and convection heat transfer coefficients was proven with good accordance between measurement and analysis.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2488-2493
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• 2007

A gap conductance is very important factor which can affect nuclear fuel temperature. Especially, in case of an annular fuel, a gap conductance effect can lead an unexpected heat split phenomena which is caused by a large difference of an inner and outer gap conductance. The gap conductance mechanism is very complicated behavior due to the its strong dependency on microscopic factors such as a contact surface roughness, local contact pressure and local temperature. In this paper, for the decision of test temperature and pressure range, a procedure and calculation results of in-reactor fuel temperature and pressure analysis are summarized which can be applied to test equipment design and determination of test matrix. Based upon analysis results, it is concluded that the minimum and maximum test temperature are $300^{\circ}C$ and $530^{\circ}C$ respectively, and the maximum pellet/cladding interfacial contact pressure should be observed up to 45MPa.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.3
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• pp.52-56
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• 2011

Active regeneration in CDPF requires $O_2$ which regenerates soot at high temperature. However, small amount of NO can interrupt $O_2$ regeneration in CDPF. To verify this phenomena, soot oxidation experiments using a flow reactor with a $Pr/CeO_2$ catalyst are carried out to simulate Catalyzed Diesel Particulate Filter (CDPF) phenomena. Catalytic soot oxidation with and without small amount of NO is conducted under tight contact condition. As the heating rate rises, the temperature gap of maximum reaction rate is increased between with and without 50ppm NO. To accelerate the $NO_2$ de-coupling effect, CTO process is performed to eliminate interfacial contact for that time. As CTO process is extended, temperature which indicates peak reaction rate increases. From this result, it is found that small amount of NO can affect tight contact soot oxidation by removal of interfacial contact between soot and catalyst.

• Journal of Mechanical Science and Technology
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• v.18 no.6
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• pp.1002-1009
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• 2004

Direct contact air conditioning systems, in which heat and mass are transferred directly between air and water droplets, have many advantages over conventional indirect contact systems. The purpose of this research is to investigate the cooling and heating performances of direct contact air conditioning system for various inlet parameters such as air velocity, air temperature, water flow rate and water temperature. The experimental apparatus comprises a wind tunnel, water spray system, scrubber, demister, heater, refrigerator, flow and temperature controller, and data acquisition system. The inlet and outlet conditions of air and water are measured when the air contacts directly with water droplets as a counter flow in the spray section of the wind tunnel, and the heat and mass transfer rates between air and water are calculated. The droplet size of the water sprays is also measured using a Malvern Particle Analyzer. In the cooling conditions, the outlet air temperature and humidity ratio decrease as the water flow rate increases and as the water temperature, air velocity and temperature decrease. On the contrary, the outlet air temperature and humidity ratio increase in the heating conditions as the water flow rate and temperature increase and as the air velocity decreases.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1013-1015
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• 1995

The electrical properties of Al/TiN/Ti contact according to post anneal ins conditions are investigated at submicron contacts. $N^+$ contact resistance increases with increasing alloy temperature while $P^+$ contact resistance slightly decreases. The contact tentage current increases wi th increasing alloy temperature for both $N^+$ and $P^+$ contacts. The contact resistance and leakage current of $N^+$ contact increases with increasing alloy tide. $P^+$ contact resistance decreases with increasing alloy time but $P^+$ contact tentage current increases. The contact resistance and contact leakage current increases with increasing alloy cycles for both $N^+$ and $P^+$ contacts.

• Progress in Superconductivity
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• v.14 no.2
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• pp.122-127
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• 2012

Current leads are one of the important components for carrying the current to the coil in the superconducting magnet system. Heat leakage through the current lead is the major factor of entire heat load in the cryogenic system because current leads carry the current from room temperature to near 4 K, connecting thermally each other. Therefore, minimization heat load through current lead can reduce the operating temperature of superconducting magnet. The semi-retractable current lead, composed of multi-contact connector and HTS element, is one of good options. Comprehension of Multi-contact connector's structure, contact resistance and heat generation is essential for estimating heat generation in current leads. Multi-contact connector has several louvers inside of socket and the shape, number, size of louvers are different with the size of connector. Therefore contact area, current path and contact resistance are also different. In this study, the contact resistance in multi-contact connector is measured using the electrical power as a function of connector's size and temperature. Also, the unique correlation of electrical contact resistance is derived and heat generation is estimated for superconducting magnet application.

• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.386-390
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• 2006

This paper describes the ohmic contact formation of polycrystalline 3C-SiC films deposited on thermally grown Si wafers. In this work, a TiW (titanium tungsten) film as a contact material was deposited by RF magnetron sputter and annealed with the vacuum process. The specific contact resistance (${\rho}_{c}$) of the TiW contact was measured by using the C-TLM (circular transmission line method). The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature as also analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscope). All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30 min., the lowest contact resistivity of $2.90{\times}10{\Omega}cm^{2}$ was obtained due to the improved interfacial adhesion. Therefore, the good ohmic contact of polycrystalline 3C-SiC films using the TiW film is very suitable for high-temperature MEMS applications.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.760-765
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• 2000

The study deals with the development of a computational procedure for evaluating the temperature rise in dry and lubricated multi-layered contacts of head/disk interface. A transient computational model with a transformed rectangular computational domain is utilized. A model and a computational method for micro-contact with sub-lubricated zone, including friction heat generation, have been presented. The model was applied, taking full account of the changes in contact area and contact load due to frictional heating. The computational distribution of temperature is obtained with the analytical findings for various composition and contact conditions. Especially, a rapid rise ($220^{\circ}C$ or above) in read head temperature lese to a saturation in the influence of a thermal spike on signal performance. This general class of problems can be treated provided that heat generation distribution and layer properties are known.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1338-1346
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• 2005

Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.