• Title/Summary/Keyword: Contact Thermal Resistance

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Effect of Rapid Thermal Annealing on the Ti doped In2O3 Films Grown by Linear Facing Target Sputtering

  • Seo, Ki-Won;Kim, Han-Ki
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.342.1-342.1
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    • 2014
  • The electrical, optical and structural properties of Ti doped $In_2O_3$ (TIO) ohmic contacts to p-type GaN were investigated using linear facing target sputtering (LFTS) system. Sheet resistance and resistivity of TIO films are decreased with increasing rapid thermal annealing (RTA) temperature. Although the $400^{\circ}C$ and $500^{\circ}C$ annealed samples showed rectifying behavior, the $600^{\circ}C$ and $700^{\circ}C$ annealed samples showed linear I-V characteristics indicative of the formation of an ohmic contact between TIO and p-GaN. The annealing of the contact at $700^{\circ}C$ resulted in the lowest specific contact resistivity of $9.5{\times}10^{-4}{\Omega}cm^2$. Based on XPS depth profiling and synchrotron X-ray scattering analysis, we suggested a possible mechanism to explain the annealing dependence of the properties of TIO layer on rapid thermal annealing temperature.

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A study on the thermal analysis of resistance sport welding Process using a FEM method (FEM 방법을 이용한 저항 점용접 공정의 열분석에 관한 연구)

  • Kim, Ill-Soo;Hou Zhigang;Wang Yuanxun;Li Chunzhi;Chen Chuanyao
    • Proceedings of the KWS Conference
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    • 2003.11a
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    • pp.172-174
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    • 2003
  • In this paper, a 2D axisymmetric model of thermoelectric Finite Element Method (FEM) is developed to analyze the transient thermal behavior of Resistance Spot Welding (RSW) process using commercial software, called ANSYS. The determination of the contact resistance at the faying surface is moderately simplified to reduce the calculating time, while the temperature dependent material properties, phase change and convectional boundary conditions are taken account fur the improvement of the calculated accuracy. The thermal history of the whole process (including cooling) and temperature distributions for any position in the weldment is obtained through the analysis.

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Characteristic of HVOF AISI316-WC Coating Layer on Stainless Steel Separator for PEMFC (고분자 전해질 연료전지용 스테인리스강 분리판의 HVOF AISI316-WC 코팅층 특성)

  • Nam, Dae-Geun;Kang, Nam-Hyun;Park, Yeong-Do;Kim, Young-Seok
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.10a
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    • pp.1-5
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    • 2008
  • Stainless steels have been widely considered as metallic separators, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the separators and electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

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Lifetime-Temperature Rise Model for the Evaluation of Degradation in Electric Connections/Contacts (전기적 접속/접촉부 열화 평가를 위한 수명 온도상승 모델)

  • Kim, Jeong-Tae;Kim, Nam-Jun
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.51 no.2
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    • pp.55-61
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    • 2002
  • In this paper, 'lifetime-temperature rise model' based on the 'lifetime-resistance model' is theoretically Proposed, in order to find out the evaluation method of degradation and the residual lifetime by use of infrared image camera for electric connections/contacts. Two assumptions have been builded up for the 'lifetime-temperature rise model': one is associated with the linear relationship between the temperature ism ΔK and contact resistance, and the other the functional relationship between the temperature of electric connections/contacts and the operating time presenting in the 'lifetime-resistance model'. To prove the proposed model, experiments have been performed for various electric connections/contacts. From the experimental results, measured values were quite similar to the calculated values, which proved the above-mentioned two assumptions. Therefore, by use of 'lifetime-temperature rise model', it is possible to estimate the trend of degradation and the residual lifetime for electric connections/contacts through the temperature measurements .

Graphene Doping Effect of Thin Film and Contact Mechanisms (박막의 그래핀 도핑 효과와 접합 특성)

  • Oh, Teressa
    • Korean Journal of Materials Research
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    • v.24 no.3
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    • pp.140-144
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    • 2014
  • The contact mechanism of devices is usually researched at electrode contacts. However, the contact between a dielectric and channel at the MOS structure is more important. The graphene was used as a channel material, and the thin film transistor with MOS structure was prepared to observe the contact mechanism. The graphene was obtained on Cu foil by the thermal decomposition method with $H_2$ and $CH_4$ mixed gases at an ambient annealing temperature of $1000^{\circ}C$ during the deposition for 30 min, and was then transferred onto a $SiO_2/Si$ substrate. The graphene was doped in a nitrogen acidic solution. The chemical properties of graphene were investigated to research the effect of nitric atoms doping. The sheet resistance of graphene decreased after nitrogen acidic doping, and the sheet resistance decreased with an increase in the doping times because of the increment of negative charge carriers. The nitric-atom-doped graphene showed the Ohmic contact at the curve of the drain current and drain voltage, in spite of the Schottky contact of grapnene without doping.

Characterization of a Thermal Interface Material with Heat Spreader (전자부품의 방열방향에 따른 접촉열전도 특성)

  • Kim, Jung-Kyun;Nakayama, Wataru;Lee, Sun-Kyu
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.91-98
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    • 2010
  • The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

The Performance Test on Me-DLC Films for Improving Wear Resistance of LM-Guide (LM 가이드의 내마모성 향상을 위한 Me-DLC 코팅박막의 성능평가)

  • Kang, Eun-Goo;Lee, Dong-Yoon;Kim, Seong-Young
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.4
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    • pp.409-416
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    • 2012
  • Recently, surface modification technology is of importance to improve the wear resistance and the corrosive resistance for high accurate mechanical parts such as LM guide, Ball Screw and Roller Bearing etc., Those has generally featured on rolling contact mechanism to improve not only the wear and the friction, but also the accuracy and the corrosion performances. For surface modifications of high accurate mechanical parts, normally thermal spray, PVD, CVD and E.P. processes have been used with many materials such as DLC, raydent, W, Ni, Ti etc. Diamondlike carbon (DLC) films possess a combination of attractive properties and have been largely employed to modify the tribological behaviors such as friction, wear, corrosion, fretting fatigue, biocompatibility, etc. However, for rolling contact mechanism mechanical parts DLC films are needed to study for commercial benefit. Rolling contact mechanism has features on effects of cyclic motions and stresses, and also not simply sliding motions. The papers focused on the performance test of wear and corrosive resistance according to Me-DLC film thickness. And also, its thickness effect of wear analysis was carried out through the simulation of the maximum shear stress under the rolling contact surface. As the results, Me-DLC films have more potential to improve the wear resistance for high precision mechanical parts than raydent films.

The Electrical Properties of GaN Individual Nanorod Devices by Wet-etching of the Nanorod Surface and Annealing Treatment (표면 습식 식각 및 열처리에 따른 GaN 단일 나노로드 소자의 전기적 특성변화)

  • Ji, Hyun-Jin;Choi, Jae-Wan;Kim, Gyu-Tae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.2
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    • pp.152-155
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    • 2011
  • Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn't have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.

Thermal Analysis on Twin-Roll Type Strip Continuous Casting Process Considering Contact Thermal Resistance between Molten Metal and Cooling Roll (쌍롤식 박판 연속주조공정에 있어서 용탕과 냉각롤의 접촉 열저항을 고려한 전열해석)

  • Kim, Y.D;Kim, C.G
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.1
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    • pp.189-205
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    • 1996
  • The twin-roll type strip continuous casting process(or direct rolling process) of steel materials is characterized by two rotating water cooled rolls receiving a steady supply of molten metal which solidifies onto the rolls. A solidification analysis of molten metal considering phase transformation and thermofluid is performed using finite diffefence method with curvilinear coordinate to reduce computing time and molten region analysis with arbitrary shape. An enthalpy-specific heat method is used to determine the temperatures inthe roll and the steel. The temperature distribution of cooling roll is calculated using two dimensional finite element method, because of complex roll shape due to cooling hole in rolls and improvemnt accuracy of calculation result. The energy equaiton of cooling roll is solved simultanuously with the conservation equaiton of molten metal in order to consider heat transfer through the cooling roll. The calculated roll temperature is compared to experimental results and the heat transfer coefficient between cooling roll surface and rolling material(steel) is also determined from comparison of measured roll temperature and calculated temperature.

ResNet-Based Simulations for a Heat-Transfer Model Involving an Imperfect Contact

  • Guangxing, Wang;Gwanghyun, Jo;Seong-Yoon, Shin
    • Journal of information and communication convergence engineering
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    • v.20 no.4
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    • pp.303-308
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    • 2022
  • Simulating the heat transfer in a composite material is an important topic in material science. Difficulties arise from the fact that adjacent materials cannot match perfectly, resulting in discontinuity in the temperature variables. Although there have been several numerical methods for solving the heat-transfer problem in imperfect contact conditions, the methods known so far are complicated to implement, and the computational times are non-negligible. In this study, we developed a ResNet-type deep neural network for simulating a heat transfer model in a composite material. To train the neural network, we generated datasets by numerically solving the heat-transfer equations with Kapitza thermal resistance conditions. Because datasets involve various configurations of composite materials, our neural networks are robust to the shapes of material-material interfaces. Our algorithm can predict the thermal behavior in real time once the networks are trained. The performance of the proposed neural networks is documented, where the root mean square error (RMSE) and mean absolute error (MAE) are below 2.47E-6, and 7.00E-4, respectively.