• Journal of Powder Materials
• /
• v.20 no.2
• /
• pp.120-124
• /
• 2013

This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.441-441
• /
• 2014

The characteristics of hybrid conductive films based on multilayer graphene and silver grid have been investigated for the high-performance and flexible organic solar cells. The hybrid conductive films have been prepared on glass and polyethylene terephthalate (PET) substrates using conventional photolithography process and transfer process of graphene. The optical and electrical properties of prepared conductive films show transmittance of 87% at 550nm and sheet resistance of $28{\Omega}/square$. The electromechanical properties were also investigated in detail to confirm the flexibility of the hybrid films. OSCs have been fabricated on the hybrid conductive films based on graphene and silver grid on glass substrate. The power conversion efficiency of 2.38%, a fill factor of 51%, an open circuit voltage of 0.58V and a short circuit current of $8.05mA/cm^2$ were obtained from the device on glass substrate. The PCE was enhanced 11% compared with OSCs on the MLG films without silver grid.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.4
• /
• pp.149-157
• /
• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Journal of Welding and Joining
• /
• v.30 no.3
• /
• pp.32-37
• /
• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.429-429
• /
• 2013

We present a systematic study of the electrical, optical and electromechanical properties of flexible graphene/metal grid hybrid transparent conductive electrodes using 4-point prove method, ultraviolet/visible spectrometer and inner/outer bending test system. The hybrid electrodes were synthesized by depositing a silver grid on a graphene surface. The sheet resistance of hybrid electrodes was as low as 30 Ω/square, while the transmittance was 90%. The electromechanical properties as a function of the change of bending radius were evaluated by measuring the change in resistance. The result will be presented in detail. We believe that these results will provide useful information for the flexible optoelectronic devices based on graphene transparent electrodes.

• Journal of Welding and Joining
• /
• v.31 no.5
• /
• pp.77-81
• /
• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• Journal of Powder Materials
• /
• v.18 no.5
• /
• pp.423-429
• /
• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• Korean Journal of Metals and Materials
• /
• v.48 no.1
• /
• pp.90-100
• /
• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2011.05a
• /
• pp.39-40
• /
• 2011

The purpose of this study is to select a conductive resistor as high energy efficiency through analysis of the heating properties by induction heating. The result of this study, the heating properties is capable of weaken cementitious joint in 10~30 seconds when using the conductive resistor with wire mesh or punching metal. Although the steel is higher temperature than SUS304, SUS304's heating properties are more uniform.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.241.2-241.2
• /
• 2014

We present highly transparent liquid crystal displays (LCDs) using hybrid films based on carbon nanomaterials, metal grid, and indium-tin-oxide (ITO) grid. Carbon based nanomaterials are used as transparent electrodes because of high transmittance. Despite of their high transmittance they have relatively high sheet resistance. To solve this problem, we applied grid and made hybrid conductive films based on carbon nanomaterials. Conventional photolithography processes were used to make a grid pattern of metal and ITO. To fabricate transparent conductive films, carbon nanotube (CNT) ink was spin coated on the grid pattern. The transparency of the conductive film was controlled by shape and size of the grid pattern and the thickness of CNT films. The optical transmittance of CNT-based hybrid films is 92.2% and sheet resistance is also reduced to $168{\Omega}/square$. These substrates were used for the fabrication of typical twisted nematic (TN) LCD cells. From the characteristics of LCD devices such as transmittance, operating voltage, voltage holding ratio our devices were comparable to those of pristine ITO substrates. The result shows that the hybrid conductive films based on carbon nanomaterials could be alternative of ITO for the highly transparent LCDs.