• Journal of Microbiology and Biotechnology
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• 제18권1호
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• pp.145-152
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• 2008

A cell-based in vitro exposure system was developed to determine whether oxidative stress plays a role in the cytotoxic effects of volatile organic compounds (VOCs) such as benzene, toluene, xylene, and chlorobenzene, using human epithelial HeLa cells. Thin films based on cysteine-terminated synthetic oligopeptides were fabricated for immobilization of the HeLa cells on a gold (Au) substrate. In addition, an immobilized cell-based sensor was applied to the electrochemical detection of the VOCs. Layer formation and immobilization of the cells were investigated with surface plasmon resonance (SPR), cyclic voltammetry (CV), and electrochemical impedance spectroscopy (EIS). The adhered living cells were exposed to VOCs; this caused a change in the SPR angle and the VOC-specific electrochemical signal. In addition, VOC toxicity was found to correlate with the degree of nitric oxide (NO) generation and EIS. The primary reason for the marked increase in impedance was the change of aqueous electrolyte composition as a result of cell responses. The p53 and NF-${\kappa}B $ downregulation were closely related to the magnitude of growth inhibition associated with increasing concentrations of each VOC. Therefore, the proposed cell immobilization method, using a self-assembly technique and VOC-specific electrochemical signals, can be applied to construct a cell microarray for onsite VOC monitoring.

• Journal of Welding and Joining
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• 제31권5호
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• 한국광학회지
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• 제20권4호
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• pp.230-235
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• 2009

광고분자 필름은 홀로그램을 저장하기 위한 기술로서, 광굴절 결정보다 고감도, 간단한 실시간 처리, 저렴한 가격 등의 장점으로 홀로그래픽 저장기술 응용에 보다 손쉽게 적용할 수 있다. 본 연구에서는 기존의 PVA/AA계 광고분자 필름에 광학적 활성을 가지는 $SeO_2$를 첨가한 광고분자 필름을 제조하였다. 홀로그램을 저장하기 위한 기록매질로서 최적의 회절효율을 가지는 광고분자 필름을 만들기 위하여, 광감각제인 Eosin Y의 농도와 광고분자 필름의 두께를 달리하여 실험하였다. 광고분자 필름의 회절효율은 532 nm 레이저로, $40^{\circ}$의 입사각에서 측정하였다. 실험 결과, Eosin Y의 농도가 0.0045 g이고, 필름 두께가 $297{\mu}m$일 때, 78.70%로 가장 높은 회절효율 값을 나타내었다.

• 접착 및 계면
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• 제9권1호
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• pp.9-15
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• 2008

산소 플라즈마를 이용하여 처리시간을 다르게 하면서 EVA foam 표면의 개질을 시도하였다. EVA foam 표면 특성에 대한 플라즈마 처리 효과는 FT-IR ATR, XPS, 접촉각 측정기, SEM을 통해 연구하였으며 EVA foam의 접착특성은 박리접착강도를 측정하여 확인하였다. 플라즈마를 이용한 표면처리 결과, 유기화합물의 제거, 산소함유량의 증가, 표면의 물리적 변화 효과를 얻을 수 있었으며 EVA foam의 접착특성이 향상되었다. 플라즈마 처리 시간이 길어질수록 친수성과 EVA foam 표면의 물리적 변화가 증가하였고 각각 180초와 420초 처리에서 최대치를 나타내었다. 접착력은 420초 처리에서 최고를 나타내었으며 결과적으로 EVA foam표면의 물리적 변화가 접착력에 가장 큰 영향을 미치는 것으로 나타났다.

• 한국결정학회지
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• 제8권1호
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• pp.1-5
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• 1997

표제화합물의 결정구조는 4-N,N-dimethylamino-4'-N'-methyl-stilbazolium, $C_{16}H_{19}N_2$와 tosylate, $C_7H_7SO_3$의 불연속한 이분자체로 구성되어 있다. 4-N,N-dimethylamino-4'-N'-methyl-stilbazolium 분자는 중간에 있는 C=C double bond에서 trans conformation을 가지고 있으며 phenyl 및 pyridyl ring들간의 이면각은 $5.7(2)^{\circ}$을 이루어 전분자는 $0.138(8){\AA}$ 내에서 평면을 이루고 있다. Tosylate 분자들은 거리가 각각 2.855(9) and $2.899(8){\AA}$인 O-H...O 수소결합으로 연결된 이분자체를 나타내고 있다. 이 두 분자간의 가장 가까운 거리는 O(3)와 C(16) 원자간의 $3.10(1){\AA}$이다.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 대한금속재료학회지
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• 제50권7호
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• pp.477-485
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• 2012

The effect of aging heat treatment on microstructure evolution of the Ti-6Al-4Fe-0.25Si alloy with an initial microstructure of an elongated alpha was investigated. Aging treatments of the samples were carried out at $550^{\circ}C$ for up to 100 hours. The microstructure of the 5 hours heat-treated sample consisted of alpha grains, beta matrix and some TiFe intermetallic compounds that were precipitated from the beta matrix. Increasing the aging time to 10 hours, most of the beta matrix was decomposed to very fine alpha grains (${\sim}0.5{\mu}m$) and TiFe, and thus the volume fraction of the beta matrix was significantly decreased. EBSD analysis revealed that newly formed tertiary-alpha-grains in the vicinity of TiFe had high angle boundaries with respect to the primary and secondary alpha grains. As a result of these phase transformations during aging, the fraction of the alpha/alpha grain boundary was increased while that of the alpha/beta phase boundary was decreased.

• Electronic Materials Letters
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• 제14권6호
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• Macromolecular Research
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• 제17권3호
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• pp.174-180
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• 2009

Chemical modification of titanium/titanium oxide (Ti/$TiO_2$) substrates has recently gained a great deal of attention because of the applications of Ti/$TiO_2$-based materials to biomedical areas. The reported modification methods generally involve passive coating of Ti/$TiO_2$ substrates with protein-resistant materials, and poly(ethylene glycol) (PEG) has proven advantageous for bestowing a nonbiofouling property on the surface of Ti/$TiO_2$. However, the wider applications of Ti/$TiO_2$ based materials to biomedical areas will require the introduction of biologically active moieties onto Ti/$TiO_2$, in addition to nonbiofouling property. In this work, we therefore utilized surface-initiated polymerization to coat the Ti/$TiO_2$ substrates with polymers presenting the nonbiofouling PEG moiety and subsequently conjugated biologically active compounds to the PEG-presenting, polymeric films. Specifically, a Ti/$TiO_2$ surface was chemically modified to present an initiator for atom transfer radical polymerization, and poly(ethylene glycol) methacrylate (pEGMA) was polymerized from the surface. After activation of hydroxyl groups of poly(pEGMA) (pPEGMA) with N,N'-disuccinimidyl carbonate, biotin, a model compound, was conjugated to the pPEGMA films. The reactions were confirmed by infrared spectroscopy, X-ray photoelectron spectroscopy, contact angle goniometry, and ellipsometry. The biospecific binding of target proteins was also utilized to generate micropatterns of proteins on the Ti/$TiO_2$ surface.

• Bulletin of the Korean Chemical Society
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• 제13권3호
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• pp.268-274
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• 1992

An attempt to improve the second harmonic generation (SHG) efficiency of MAP (methyl (2,4-dinitrophenyl)aminopropanoate) by modifying the substituents on the amino group of MAP is described. Several MAP analogues have been prepared using optically active amino acids alanine, phenylalanine and serine, and their SHG efficiencies measured. None of the MAP analogues exhibited SHG efficiencies as high as that of MAP. X-ray crystal structures of three MAP analogues have been determined. In the crystal structures of two of them, which were the derivatives of phenylalanine, two crystallographically-independent molecules existing in the asymmetric unit are aligned almost antiparallel. These structures are consistent with the very low SHG efficiencies of these compounds. On the other hand, the crystal structure of a serine derivative reveals substantial alignment of the dinitroaniline chromophore along the polar axis. However, the angle of 86.2° between the molecular charge tranfer axis and the polar axis of the crystal is still far away from the optimum value of 54.74° for the phase-matchable SHG. The structure is consistent with the SHG efficiency of this compound which is much higher than those of the phenylalanine derivatives but still lower than that of MAP. This study demonstrates the importance of the orientation of molecules in the crystal lattice in determining secod-order nonlinear optical properties of crystalline materials.