• Title/Summary/Keyword: Compound Angle

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Volatile Organic Compound Specific Detection by Electrochemical Signals Using a Cell-Based Sensor

  • Chung, Sang-Gwi;Kim, Jo-Chun;Park, Chong-Ho;Ahn, Woong-Shick;Kim, Yong-Wan;Choi, Jeong-Woo
    • Journal of Microbiology and Biotechnology
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    • v.18 no.1
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    • pp.145-152
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    • 2008
  • A cell-based in vitro exposure system was developed to determine whether oxidative stress plays a role in the cytotoxic effects of volatile organic compounds (VOCs) such as benzene, toluene, xylene, and chlorobenzene, using human epithelial HeLa cells. Thin films based on cysteine-terminated synthetic oligopeptides were fabricated for immobilization of the HeLa cells on a gold (Au) substrate. In addition, an immobilized cell-based sensor was applied to the electrochemical detection of the VOCs. Layer formation and immobilization of the cells were investigated with surface plasmon resonance (SPR), cyclic voltammetry (CV), and electrochemical impedance spectroscopy (EIS). The adhered living cells were exposed to VOCs; this caused a change in the SPR angle and the VOC-specific electrochemical signal. In addition, VOC toxicity was found to correlate with the degree of nitric oxide (NO) generation and EIS. The primary reason for the marked increase in impedance was the change of aqueous electrolyte composition as a result of cell responses. The p53 and NF-${\kappa}B $ downregulation were closely related to the magnitude of growth inhibition associated with increasing concentrations of each VOC. Therefore, the proposed cell immobilization method, using a self-assembly technique and VOC-specific electrochemical signals, can be applied to construct a cell microarray for onsite VOC monitoring.

Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module (자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구)

  • Bang, Junghwan;Yu, Dong-Yurl;Ko, Yong-Ho;Kim, Jeonghan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.54-58
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    • 2013
  • Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

Diffraction Efficiency Improvement of PVA/AA/SeO2 Photopolymer with Various Film Thickness and Eosin Y Contents (PVA/AA/SeO2 광고분자 필름의 두께 및 Eosin Y 함량 변화에 따른 회절효율 향상에 관한 연구)

  • Her, Ki-Young;Jang, Hwan-Ho;Kim, Dae-Heum
    • Korean Journal of Optics and Photonics
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    • v.20 no.4
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    • pp.230-235
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    • 2009
  • Photopolymer is evaluated as better material than the others used for hologram storage, due to many advantages, such as high diffraction efficiency, easy processing, and self-developing. In this study, chalcogenide inorganic compound ($SeO_2$) which has optical activity, was added to polyvinyl alcohol/acrylamide photopolymer films. In order to optimize diffraction efficiency of these photopolymer films, we prepared the photopolymer films with various film thicknesses and Eosin Y content. Diffraction efficiency of the photopolymer films were measured using a 532 nm laser at $40^{\circ}$ incident angle. As a result, the phtopolymer film with Eosin Y content of 0.0045 g and thickness of $297{\mu}m$ showed the highest diffraction efficiency (78.70%).

Studies on the Surface Changes and Adhesion of EVA Foam by Plasma Treatment (플라즈마 처리에 의한 EVA Foam의 표면변화 및 접착특성에 관한 연구)

  • Choi, Myung Jin;Kim, Dong Ho;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.9 no.1
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    • pp.9-15
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    • 2008
  • EVA foam was treated by oxygen plasma under a various treatment time for surface modification. The effect of plasma treatment on surface properties of EVA foam was investigated in terms of FT-IR ATR, XPS, contact angle, and SEM analysis and the adhesion characteristic of the EVA foam was studied in peel strength. As a results, EVA foam treated by plasma led to an elimination of organic compound, an increase of oxygen content, and an increase of surface roughness, resulting in improving the adhesion properties of the EVA foam. As the plasma treatment time increased, the hydrophilicity and physical change of surface of the EVA foam were increased and showed maximum value at 180 s and 420 s, respectively. The maximum adhesion strength appeared at plasma treatment time of 420 s and therefore, in this study the physical change was thought to be a major factor for improving the adhesion of the EVA foam.

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Hydrated Form of 4-N,N-Dimethylamino-4'-N'-Methyl-Stilbazolium Tosylate, $C_{16}H_{19}N_2(C_7H_7SO_3{\cdot}H_2O)$ (4-N,N-Dimethylamino-4'-N'- Mothy1-stilbazolium tosylate의 수화물)

  • Hong Hyung-Ki;Yoon Choon Sup;Suh Il-Hwan;Lee Jin-Ho;Choi Sung-San;Oh Mi-Ran;Marder Seth R.
    • Korean Journal of Crystallography
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    • v.8 no.1
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    • pp.1-5
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    • 1997
  • The crystal structure of the title compound consists of discrete 4-N,N-dimethylamino-4'-N'-methyl-stilbazolium, $C_{16}H_{19}N_2$, and tosylate, $C_7H_7SO_3$, dimer. The 4-N,N-dimethylamino-4'-N'-methyl-stilbazolium molecule has a trans conformation at the central C=C double bond: the dihedral angle between the phenyl and the pyridyl rings is $5.7(2)^{\circ}$ and the whole molecule is planar within $0.138(8){\AA}$. Tosylate molecules display hydrogen-bonded dimers with the O-H...O distances of 2.855(9) and $2.899(8){\AA}$, respectively. The shortest intermolecular contact is the distance $3.10(1){\AA}$ between O(3) and C(16).

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Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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Microstructure Evolution of Ti-6Al-4Fe-0.25Si through Aging Heat Treatment (시효처리에 따른 Ti-6Al-4Fe-0.25Si 합금의 미세조직 변화)

  • Song, Yong Hwan;Kang, Joo-Hee;Park, Chan Hee;Kim, Seong-Woong;Hyun, Yong-Taek;Kang, Nam Hyun;Yeom, Jong-Taek
    • Korean Journal of Metals and Materials
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    • v.50 no.7
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    • pp.477-485
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    • 2012
  • The effect of aging heat treatment on microstructure evolution of the Ti-6Al-4Fe-0.25Si alloy with an initial microstructure of an elongated alpha was investigated. Aging treatments of the samples were carried out at $550^{\circ}C$ for up to 100 hours. The microstructure of the 5 hours heat-treated sample consisted of alpha grains, beta matrix and some TiFe intermetallic compounds that were precipitated from the beta matrix. Increasing the aging time to 10 hours, most of the beta matrix was decomposed to very fine alpha grains (${\sim}0.5{\mu}m$) and TiFe, and thus the volume fraction of the beta matrix was significantly decreased. EBSD analysis revealed that newly formed tertiary-alpha-grains in the vicinity of TiFe had high angle boundaries with respect to the primary and secondary alpha grains. As a result of these phase transformations during aging, the fraction of the alpha/alpha grain boundary was increased while that of the alpha/beta phase boundary was decreased.

Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

  • Kim, Jeonga;Park, Cheolho;Cho, Kyung-Mox;Hong, Wonsik;Bang, Jung-Hwan;Ko, Yong-Ho;Kang, Namhyun
    • Electronic Materials Letters
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    • v.14 no.6
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    • pp.678-688
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    • 2018
  • The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

Specific Binding of Streptavidin onto the Nonbiofouling Titanium/Titanium Oxide Surface through Surface-Initiated, Atom Transfer Radical Polymerization and Bioconjugation of Biotin

  • Kang, Sung-Min;Lee, Bong-Soo;Kim, Wan-Joong;Choi, In-Sung S.;Kil, Mun-Jae;Jung, Hyuk-Jun;Oh, Eu-Gene
    • Macromolecular Research
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    • v.17 no.3
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    • pp.174-180
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    • 2009
  • Chemical modification of titanium/titanium oxide (Ti/$TiO_2$) substrates has recently gained a great deal of attention because of the applications of Ti/$TiO_2$-based materials to biomedical areas. The reported modification methods generally involve passive coating of Ti/$TiO_2$ substrates with protein-resistant materials, and poly(ethylene glycol) (PEG) has proven advantageous for bestowing a nonbiofouling property on the surface of Ti/$TiO_2$. However, the wider applications of Ti/$TiO_2$ based materials to biomedical areas will require the introduction of biologically active moieties onto Ti/$TiO_2$, in addition to nonbiofouling property. In this work, we therefore utilized surface-initiated polymerization to coat the Ti/$TiO_2$ substrates with polymers presenting the nonbiofouling PEG moiety and subsequently conjugated biologically active compounds to the PEG-presenting, polymeric films. Specifically, a Ti/$TiO_2$ surface was chemically modified to present an initiator for atom transfer radical polymerization, and poly(ethylene glycol) methacrylate (pEGMA) was polymerized from the surface. After activation of hydroxyl groups of poly(pEGMA) (pPEGMA) with N,N'-disuccinimidyl carbonate, biotin, a model compound, was conjugated to the pPEGMA films. The reactions were confirmed by infrared spectroscopy, X-ray photoelectron spectroscopy, contact angle goniometry, and ellipsometry. The biospecific binding of target proteins was also utilized to generate micropatterns of proteins on the Ti/$TiO_2$ surface.

Syntheses, X-ray Structures and Second Harmonic Generation Efficiencies of MAP (Methyl (2,4-dinitrophenyl)-aminopropanoate) Analogues

  • Lee Joo-Hee;Kim Kimoon;Kim Jong-Hyun;Kim Jong-Jean
    • Bulletin of the Korean Chemical Society
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    • v.13 no.3
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    • pp.268-274
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    • 1992
  • An attempt to improve the second harmonic generation (SHG) efficiency of MAP (methyl (2,4-dinitrophenyl)aminopropanoate) by modifying the substituents on the amino group of MAP is described. Several MAP analogues have been prepared using optically active amino acids alanine, phenylalanine and serine, and their SHG efficiencies measured. None of the MAP analogues exhibited SHG efficiencies as high as that of MAP. X-ray crystal structures of three MAP analogues have been determined. In the crystal structures of two of them, which were the derivatives of phenylalanine, two crystallographically-independent molecules existing in the asymmetric unit are aligned almost antiparallel. These structures are consistent with the very low SHG efficiencies of these compounds. On the other hand, the crystal structure of a serine derivative reveals substantial alignment of the dinitroaniline chromophore along the polar axis. However, the angle of 86.2° between the molecular charge tranfer axis and the polar axis of the crystal is still far away from the optimum value of 54.74° for the phase-matchable SHG. The structure is consistent with the SHG efficiency of this compound which is much higher than those of the phenylalanine derivatives but still lower than that of MAP. This study demonstrates the importance of the orientation of molecules in the crystal lattice in determining secod-order nonlinear optical properties of crystalline materials.