• Particle and aerosol research
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• v.9 no.4
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• pp.253-260
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• 2013

For a vertical atmospheric aerosol distribution measurement, a very compact and light particle sampling package is developed. This package includes a compact optical particle counter (Hy-OPC), a light and small condensation particle counter (Hy-CPC), sensors (GPS, wind velocity, temperature, humidity), and a communication and system control board. This package is attached to He balloon and the altitude is controlled by a winch. Using this system the vertical particle size distribution was measured. The test results showed that the ground base atmospheric particle measurement result may be a lot different from that high above the ground.

• Journal of Industrial Convergence
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• v.17 no.4
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• pp.9-14
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• 2019

This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

• Journal of the Korea Convergence Society
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• v.8 no.12
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• pp.23-29
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• 2017

This paper introduces the mold technology for the development of ultra-compact package of less than 1mm, and also analyze the error pattern of the results using this mold technology. The existing ultra-small mold structure was one-piece, which caused the surface of EDM to be rough and increase the error rate. This has been an obstacle to further reducing the size of the mold. On the other hand, the proposed mold technology tries to overcome the limitation of the one-piece type by using the prefabricated type method. This paper also classify defect patterns in the results of the proposed mold structure and analyze the occurrence probability of each pattern to use as a basic data to develop a detector.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.11
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• pp.1064-1073
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• 2013

In this paper, a compact 370 W high efficiency GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) power amplifier(PA) using internal harmonic manipulation circuits is presented for cellular and L-band. We employed a new circuit topology for simultaneous high efficiency matching at both fundamental and 2nd harmonic frequency. In order to minimize package size, new 41.8 mm GaN HEMT and two MOS(Metal Oxide Semiconductor) capacitors are internally matched and combined package size $10.16{\times}10.16{\times}1.5Tmm^3$ through package material changes and wire bonded in a new package to improve thermal resistance. When drain biased at 48 V, the developed GaN HEMT power amplifier has achieved over 80 % Drain Efficiency(DE) from 770~870 MHz and 75 % DE at 1,805~1,880 MHz with 370 W peak output power(Psat.). This is the state-of-the-art efficiency and output power of GaN HEMT power amplifier at cellular and L-band to the best of our knowledge.

• Particle and aerosol research
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• v.11 no.2
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• pp.57-61
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• 2015

Atmospheric nano-particles along the altitude is one of the main factors causing severe weather phenomena. It is a challenge to find the precise particle size distribution. One useful instrument includes a scanning mobility particle sizer (SMPS). This measures the size distribution of submicron aerosols. The SMPS consists of a condensation particle counter (CPC), differential mobility analyzer (DMA), high voltage power supplier (HVPS), and neutralizer. Due to the many components, it is difficult to install a commercial SMPS into a tethered balloon package system (Eun, 2011). In this study, we customized a SMPS for the tethered balloon package system called Hy-SMPS. It is portable, compact in structure, and evaluated by TSI SMPS using mono and poly-dispersed particles.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.1
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• pp.19-24
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• 2014

In this work, a compact patch antenna based on a low temperature cofired ceramic (LTCC) has been presented for V-band system-on-package (SoP) applications. In order to integrate it with transceiver block, a waveguide (W/G) to embedded microstrip line (eMSL) vertical transition was designed using slot-fed double stacked patch antennas for easy assembly and wide bandwidth. The $2{\times}2$ patch antenna integrating the transition was designed and fabricated in the 5-layer LTCC dielectrics. The whole size of the fabricated antenna including the $2{\times}2$ patches, transition and W/G was $20{\times}24{\times}5.39mm^3$. The fabricated antenna has achieved a 10 dB impedance bandwidth of 2.45 GHz from 61 to 63.45 GHz.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1929_1930
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• 2009

Fully embedded tunable bandpass filter (BPF) with inductive coupling circuits is newly designed and demonstrated for UHF TV tuner ranged from 500MHz to 900MHz receivers. Conventional RF tuning circuit with an electromagnetic coupled tunable filter has several problems such as large size, high volume, and high cost, since the electromagnetic coupled filter is comprised of several passive components and air core inductors to be assembled and controlled manually. To address these obstacles, compact tunable filter with inductive coupling circuit was embedded into low cost organic package substrate. The embedded filter was optimally designed to have high performance by using high Q spiral stacked inductors, high dielectric $BaTiO_3$ composite MIM capacitors, varactor diodes. It exhibited low insertion loss of approximately -2dB, high return loss of below -10dB, and large tuning range of 56.3%. It has an extremely compact size of $3.4{\times}4.4{\times}0.5mm^3$.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.563-568
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• 2007

In this paper, the proposed package antenna, which is meander line structure with short pin, is miniaturized to realize RF-SoP at 900 MHz RFID band. The RFID BGA(Ball Grid Array) chip is put in a cavity of LTCC Layers. The coupling and cross talk, which are happen between BGA chip and proposed package antenna, are reduced by faraday cage, which consists of ground and via fences, is realized to enhance the isolation between BGA chip and antenna. The proposed antenna structure is focused on the package level antenna realization at low frequency band. The novel proposed package antenna size is $13mm{\times}9mm{\times}3.51mm$. The measured resonance frequency is 0.893 GHz. The impedance bandwidth is 9 MHz. The maximum gain of radiation pattern is -2.36 dBi.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.