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http://dx.doi.org/10.5515/KJKIEES.2013.24.11.1064

A Compact 370 W High Efficiency GaN HEMT Power Amplifier with Internal Harmonic Manipulation Circuits  

Choi, Myung-Seok (Power Amp 1 Team, RFHIC Corporation)
Yoon, Tae-San (Power Amp 1 Team, RFHIC Corporation)
Kang, Bu-Gi (Power Amp 1 Team, RFHIC Corporation)
Cho, Samuel (Power Amp 1 Team, RFHIC Corporation)
Publication Information
Abstract
In this paper, a compact 370 W high efficiency GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) power amplifier(PA) using internal harmonic manipulation circuits is presented for cellular and L-band. We employed a new circuit topology for simultaneous high efficiency matching at both fundamental and 2nd harmonic frequency. In order to minimize package size, new 41.8 mm GaN HEMT and two MOS(Metal Oxide Semiconductor) capacitors are internally matched and combined package size $10.16{\times}10.16{\times}1.5Tmm^3$ through package material changes and wire bonded in a new package to improve thermal resistance. When drain biased at 48 V, the developed GaN HEMT power amplifier has achieved over 80 % Drain Efficiency(DE) from 770~870 MHz and 75 % DE at 1,805~1,880 MHz with 370 W peak output power(Psat.). This is the state-of-the-art efficiency and output power of GaN HEMT power amplifier at cellular and L-band to the best of our knowledge.
Keywords
GaN HEMT; Compact Size Package; High Power; High Efficiency; Internal Harmonic Termination;
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