• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.13-22
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• 2015

LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.971-974
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• 2005

In this paper, we describe photonic sensor interface in SOPC(System on a programmable chip) platform. This platform uses device that has ARM922T processor and APEX FPGA area on a chip. We use two development kits. The one is embedded kit that using Intel's Xscale device, the another is SOPC kit that using Altera's Excalibur device. We implement some device logic that DMAC, ADCC, etc. and application.

• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.171-174
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• 2000

In stead of RF module which has been used conventionally in many remote measurement applications, a new type of remote measurement system based on PCS(Personal communication system) and one chip Microcontroller is proposed in this work. PCS has many advantages with respect to cost reliability, communication quality, and so on. The proposed system consists of three different modules: PCS module, micro-controller module, and sensor module. System configuration as well as illustrative experiments will be described in detail.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.747-748
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• 2006

In this paper, we describe photonic sensor interface and driver program based on SOPC(System on a programmable chip) platform. This platform uses device that has ARM922T processor and APEX FPGA area on a chip. As for driver program development, three different methods are tried such as simple firmware, real-time OS based program and embedded Linux based program, and results are compared for SoC implementation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.443-446
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• 1997

This paper presents green sheet Properties of multilayer chip filter for mobile communication. The role of solid loading content and lamination conditions in determining some of the green sheet properties are present. The optimun conditions were obtained solid loading 62:38, lamination temperature 7$0^{\circ}C$, lamination press 300~400 Kg/$\textrm{cm}^2$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.1 no.2
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• pp.193-197
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• 1997

In this paper, we propose a new PN chip clock generator which employs two synchronous counters to achieve precise phase control of chip clock. In a CDMA code acquisition and tracking system, the PN chip clock is required to operate highly reliable without any glitch even under harsh environment condition such as temperature and voltage fluctu-aliens. The digital implementation of the proposed PN chip clock generator imparts it with much desired reliability. Since the proposed chip clock generator can be easily controlled into one of the states: free running, phase advance, and delay state, it can be applied to data processing as well as code synchronization. We have done FPGA implementation of the proposed logic and have verified its satisfactory operation up to 50 MHz.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.61-71
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• 1999

The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

• Proceedings of the KIEE Conference
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• 2001.11c
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• pp.376-379
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• 2001

In this paper, I design the control chip that controls inner test sequence of Logic Tester to test chip. Logic tester has the thirteen inner instructions to control test sequence in test. And these instructions are saved in memory with test pattern data. Control chip generates address and control signal such as read, write signal of memory. Before testing, necessary data such as start address, end address, etc. are written to inner register of control chip. When test started, control chip receives the instruction in start address and executes, and generates address and control signals to access tester' inner memory. So whole test sequence is controlled by making the address and control signal in tester's inner memory. Control chip designs instruction's execution blocks, respectively. So if inner instruction is added from now on, a revision is easy. The control chip will be made using FPGA of Xilinx Co. in future.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.166-173
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• 2013

As the number of IPs and the communication volume among them have constantly increased, on-chip crossbar network is now the most widely-used on-chip communication backbone of contemporary SoCs. The on-chip crossbar network consists of multiple crossbars and the connections among the IPs and the crossbars. As the complexity of SoCs increases, it has also become more and more complex to determine the topology of the crossbar network. To tackle this problem, this paper proposes an on-chip crossbar network topology method for application-specific systems. The proposed method uses mixed integer linear programming to solve the topology synthesis problem, thus the global optimality is guaranteed. Unlike the previous MILP-based methods which represent the topology with adjacency matrixes of IPs and crossbar switches, the proposed method uses the communication edges among IPs as the basic element of the representation. The experimental results show that the proposed MILP formulation outperforms the previous one by improving the synthesis speed by 77.1 times on average, for 4 realistic benchmarks.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.907-910
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• 2003

We have developed Logic Design Training Kit for studying, actual training, designing of FPGA(Xillinx) or CPLD(ALTERA CPLD), the Digital Logic Device. This training kit has 12 matrix keys, RS232 port for serial communication and uses LED array. six FND(Dynamic), LCD as display part. That is standard specification for digital logic training kit. Special point of this kit is that we make two logic device trainig kit. This two logic device kit have more smaller and simple architecture because only uses one chip. That chip already includes a lot of functions that need for training kit, such as : complex logic circuit needed the two kind of logic devices, 16 way of system clock deviding function, serial communication interrupt....etc. We called that one chip is Center Bridge Chipset ; Xillinx FPGA Spartan2. User can select between using one device of FPGA or CPLD, or uses both them. Because of, Center Bridge Chipset has profitable architecture. it can work as Logic Device's networking with Master-Slave connection When using both logic devices.