• Journal of the Korea Institute of Information Security & Cryptology
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• v.13 no.4
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• pp.85-98
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• 2003

Computational power of IC chip is improved day after day producing IC chips holding co-processor continuously. Also a lot of wireless terminals which IC chip embedded in are produced in order to provide simple and various services in the wireless terminal market. However it is difficult to apply the key distribution protocol under wired communication environment to wireless communication environment. Because the computational power of co-processor embedded in IC chip under wireless communication environment is less than that under wired communication environment. In this paper, we propose the hey distribution protocol appropriate for wireless communication environment which diminishes the computational burden of server and client by using co-processor that performs cryptographic operations and makes up for the restrictive computational power of terminal. And our proposal is satisfied with the security requirements that are not provided in existing key distribution protocol.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.168-174
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• 2012

This paper describes a novel global on-chip interconnect scheme, in which a one UI-delayed symbol as well as the current symbol is sent for easing the sensing operation at receiver end. With this approach, the voltage swing on the channel for reliable sensing can be reduced, resulting in performance improvement in terms of power consumption, peak current, and delay spread due to PVT variations, as compared to the conventional repeater insertion schemes. Evaluation for on-chip interconnects having various lengths in a 130 nm CMOS process indicated that the proposed on-chip interconnect scheme achieved a power reduction of up to 71.3%. The peak current during data transmission and the delay spread due to PVT variations were also reduced by as much as 52.1% and 65.3%, respectively.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.1137-1140
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• 1999

In this thesis, we research about Communication System Construction and Test-Bed Realization Method and Software’s Design with written program into Embedded Micro Controller’s restricted memory region using a DSP Chip to deal with mainly high speed communication. Tools used for modern communication network control use TI or AMD general chip class, but nevertheless responsibility for the point at issue, Analog Device is architecture design model moderated for small communication system. In this thesis, we present extended model, and realize basic case.

• Journal of the Korea Society of Computer and Information
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• v.21 no.5
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• pp.65-71
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• 2016

Bluetooth technology(BT) is a standard for short distance wireless communication and widely used to connect and control various electronic and telecommunication devices without wires, where CSR8670 chip is generally adopted. These BT devices are required to comply with BT specification and the equipments for conformance test are also important. However, the existing BT testing methods have inconvenience in that they are mostly time-consuming procedure due to not only repetitive execution for each evaluation element but also error-prone nature of manual experiments. This paper proposes an automated BT communication test method using CSR8670 chip, which solves the problems related to manual testing methods. The proposed method can reduce the development period of BT products and guarantee the quality improvement owing to the exact system error detection capability.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.2 s.332
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• pp.65-72
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• 2005

We can integrate more IP blocks on a silicon die as the development of fabrication technologies and EDA tools. Consequently, we can design complicated SoC architecture including multi-processors. However, most of existing SoC buses have bottleneck in on-chip communication because of shared bus architectures, which result in the performance degradation of systems. In most cases, the performance of a multi-processor system is determined by efficient on-chip communication and the well-balanced distribution of computation rather than the performance of the processors. We propose an efficient SoC Network Architecture(SNA) using crossbar routers which provide a solution to ensure enough communication bandwidth. The SNA can significantly reduce the bottleneck of on-chip communication by providing multi-channels for multi-masters. According to the proposed architecture, we design a model system for the SNA. The proposed architecture has a better efficiency by $40\%$ than the AMBA AHB according to a simulation result.

• Proceedings of the IEEK Conference
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• 2002.07b
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• pp.782-785
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• 2002

Power amplifier of wireless communication tranceiver can be effectually controlled output power. And small size and low power dissipation are indispensable to portable system. In this paper, to reduce the size of portable tranceiver, inductor is integrated in a single chip. And to reduce power dissipation, a power amplifier that can be digitally controlled output power, is proposed and designed.

• ETRI Journal
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• v.27 no.5
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• pp.563-568
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• 2005

A motion-control chip contains major functions that are necessary to control the position of each motor, such as generating velocity command profiles, reading motor positions, producing control signals, driving several types of servo amplifiers, and interfacing host processors. Existing motion-control chips can only generate velocity profiles of fixed characteristics, typically linear and s-shape smooth symmetric curves. But velocity profiles of these two characteristics are not optimal for all tasks in industrial robots and automation systems. Velocity profiles of other characteristics are preferred for some tasks. This paper proposes a motion-control chip to generate velocity profiles of desired acceleration and deceleration characteristics. The proposed motion-control chip is implemented with a field-programmable gate array by using the Very High-Speed Integrated Circuit Hardware Description Language and Handel-C. Experiments using velocity profiles of four different characteristics will be performed.

• ETRI Journal
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• v.27 no.1
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• pp.81-88
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• 2005

In this paper, interface circuits that are suitable for point-to-point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi-gigabits per-second between two chips with a point-to-point interconnection, the input receiver uses an on-chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode-connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 ${\mu}m$ dual gate oxide CMOS technology.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2005.11a
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• pp.263-266
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• 2005

An UHF ($860{\sim}960MHz$) RFID tag antenna is optimized and designed using a genetic algorithm (GA). The tag antenna impedance should be matched to the conjugate of the impedance of the tag IC Chip. The chip impedance has real and capacitive imaginary parts due to the parasitic capacitance of the RFID chip. A GA linked with a commercially available antenna simulation program optimizes the UHF $860{\sim}960\;MHz$ tag antenna to match a commercially available RFID chip. This method shows that any RFID antenna can be designed for any commercial RFID chip with any impedance.

• Journal of electromagnetic engineering and science
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• v.2 no.1
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• pp.1-4
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• 2002

Performance improvement of the DS-CDMA system by the spectrum-overlap is important for better service quality or more system capacity. In this paper, an analysis thor capacity improvement is newly considered when the Lanczos chip waveform is used for the spectrum-overlapped DS-CDMA system. RC(relative capacity) is the ratio of the capacity of overlapping system to that of non-overlapping system, which is used for the expression of the capacity improvement. The optimal overlapping ratio is numerically found to make the maximum capacity improvement When the rectangular chip waveform is used far the overlapping system, maximum capacity improvement is increased by about 10% at the required BER=$10^{-3}$TEX> and the optimal overlapping ratio is 1.23. When the 95 % power bandwidth is considered for the Lanczos chip waveform, maximum capacity improvement is increased by 34.4% at overlapping ratio of 1.55 when the required BER is $10^{-3}$TEX>. The lower required BER far the better communication quality makes gradually smaller capacity improvement.