• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1346-1348
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• 2001

Generally, Invar alloy shows very low thermal expansion characteristics, lower than $2{\times}10^{-6}$/K approximately. To apply Fe-Ni-Co-C Invar alloy as a core material for large ampacity transmission line we studied the effects of magnetic properties on coefficient of thermal expansion. The coefficient of thermal expansion(CTE) suddenly decreases with addition of a little carbon(0.08%), increases with the increasing carbon and has a constant value at the composition over than 1.0%C. The trend of Curie temperature change with carbon is similar with that of CTE. Therefore, the CTE has a linear relationship with Curie temperature. However, the CTE linearly decreases with the ratio of saturation magnetization and Curie temperature(${\sigma}_s/T_c$).

• 한국재료학회지
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• 제24권10호
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• pp.515-519
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• 2014

The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.

• 대한금속재료학회지
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• 제48권12호
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• pp.1064-1069
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• 2010

Thin films have been used in a large variety of technological applications such as solar cells, optical memories, photolithographic masks, protective coatings, and electronic contacts. If thin films experience frequent temperature changes, thermal stresses are generated due to the difference in the coefficient of thermal expansion between the film and substrate. Thermal stresses may lead to damage or deformation in thin film used in electronic devices and micro-machined structures. Thus, knowledge of the thermomechanical properties of thin films, such as the coefficient of thermal expansion, is an important issue in determining the stability and reliability of the thin film devices. In this study, thermal cycling of Cu and Ag thin films with various microstructures was employed to assess the coefficient of thermal expansion of the films. The result revealed that the coefficient of thermal expansion (CTE) of the Cu and Ag thin films increased with an increasing grain size. However, the effect of film thickness on the CTE did not show a remarkable difference.

• 열처리공학회지
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• 제34권5호
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• pp.226-232
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• 2021

The relationship between precipitation and coefficient of thermal expansion of Al-6%Si-0.4%Mg-0.9%Cu-(Ti) alloy (in wt.%) after various heat treatments were studied by the thermodynamic analyzer (TMA) and differential scanning calorimetry (DSC). Solution heat treatment of the alloy was carried out at 535℃ for 6 h followed by water quenching, and the samples were artificially aged in the air at 180℃ and 220℃ for 5 h. The coefficient of thermal expansion (CTE) curve showed some residual strain and decreased with increasing aging temperature. The CTE curves changed sharply in the temperature range of 200℃ to 400℃, and the corresponding peak shifted for the aged samples due to the change in the precipitation behavior of the secondary phase. These transformation peaks in the aged sample are related to the volume of the precipitation of the Si phase as determined by DSC analysis. The change in CTE is mainly caused by the precipitation of the Si phase in the Al-Si alloy, and the size of the change occurs simultaneously with the size of the precipitate.

• 한국초전도ㆍ저온공학회논문지
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• 제14권4호
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• pp.24-27
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• 2012

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current ($I_c$) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ${\sim}15.3{\times}10^{-6}/K$. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.192-197
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• 2004

The anisotropy in coefficient of thermal expansion (CTE) between the in-plane and out-of-plane of 3-dimensional thick composite structures induces residual stresses and the large void content due to insufficient compaction of fabric composites, which results in low interlaminar strengths. In order to reduce the through thickness CTE and the void content, in this work, carbon fabric phenolic laminates were compacted by pressure generated by autoclave and a compressive jig, from which the through-thickness CTEs and the void contents were measured. From the measurement, it was found that the through-thickness CTE and the void content had different characteristics from ordinary composites due to gas produced during the cure reaction of phenolic resin.

• 대한치과기공학회지
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• 제31권4호
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• pp.25-30
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• 2009

Zirconia($ZrO_2$) has attracted much attention in science and technology because of its high refractive index, high melting temperature, hardness, low thermal conductivity and corrosion barrier properties. And it is widely used as the dental restoration material because of its esthetic appearance. In this research, we analyzed the particle size and composition of the imported dental porcelain for zirconia. And the glass frit was produced. To decrease the glass transition temperature and softening temperature of the glass frit, $Li_2O$ was added into it and the effect of $Li_2O$ on the firing temperature was researched. Then the glass which contains leucite crystal with a high coefficient of thermal expansion(CTE) was manufactured and it was mixed with the glass frit to control the CTE. The phase composition were analyzed using the X-ray diffraction. The morphologies of the samples were observed by the scanning electron microscope. The 4wt% $Li_2O$-added glass frit has the optimal glass transition temperature and softening temperature. And 6 wt% leucite crystal was mixed with the glass frit to control the CTE. From the experimental results of crystallization, the crystal phase was found only leucite crystal.

• 폴리머
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• 제37권6호
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• pp.711-716
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• 2013

폴리(에틸렌 나프탈레이트)(PEN)의 사슬 배향과 이완이 PEN 유연기판의 치수안정성 및 광학 특성에 미치는 영향에 대하여 살펴보았다. 사슬이 배향된 PEN 기판은 사용온도 증가 시 PEN 분자 유동성을 감소시켜 $100^{\circ}C$ 이하에서 PEN의 열팽창계수(CTE)를 $20ppm/^{\circ}C$까지 감소시키나, 유리전이온도 근처에서 연신된 사슬의 이완에 의하여 열수축이 발생됨을 알 수 있었다. 유리전이온도 근처에서의 열처리는 이러한 열수축을 최소화시킬 수 있으나 사슬이완에 따른 PEN 분자의 경직성 또한 감소되어 열팽창계수가 연신 전 PEN의 고유 CTE의 65% 정도인 $70ppm/^{\circ}C$까지 다시 증가함을 확인하였다. 열처리 과정에서 연신된 필름에 응력을 가하지 않는 경우, 열수축 시작 온도 증가와 함께 열수축을 최소화할 수 있으며 연신에 의해 얻어진 낮은 CTE 또한 유지할 수 있었다. 배향에 의한 광 투과도 감소는 없는 반면 열처리는 미약한 결정화를 발현시켜 5% 정도의 광 투과도가 감소됨을 알 수 있었다.

• 폴리머
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• 제34권4호
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• pp.352-356
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• 2010

2개의 종횡비에 의해 특징지어진 3차원 타원체를 사용하여 PP복합체의 충전제 형태와 함량이 열팽창률에 미 치는 영향에 대해 Lee와 Paul에 의해 제안된 이론적인 값과 실험적인 결과값이 비교분석되었다. 충전제의 형태는 구형에 황산바륨을, 섬유형에는 유리섬유를, 판상형에는 운모를 사용하였다. 실험의 결과로서 구형을 갖는 황산바륨 은 종횡비가 1의 값을 갖고 이론과 같이 열팽창률이 감소하였다. 유리섬유의 경우 함량증가에 따라 종횡비는 42, 37, 25, 20으로 감소하였으며 종단방향에선 열팽창률이 감소하였지만 수직방향에서는 증가하였다. 운모의 경우 그 함량증가에 따라 모두 종단방향과 횡단방향에서 감소하고 수직방향에서 증가하였다. 종횡비의 값은 각각, $\rho_\alpha$=13.5, $\rho_\beta$=1.8이었다.