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http://dx.doi.org/10.3740/MRSK.2014.24.10.515

Effect of Nano Grain Growth on Coefficient of Thermal Expansion in Electroplated Fe-Ni Invar Alloy  

Yim, Tai Hong (Heat-treatment and Surface Engineering R&D Group, Korea Institute of Industrial CTEhnology(KICTEH))
Choe, Byung Hak (Dept of Metal and Materials Engineering, Gangneung-Wonju National University)
Jeong, Hyo Tae (Dept of Metal and Materials Engineering, Gangneung-Wonju National University)
Publication Information
Korean Journal of Materials Research / v.24, no.10, 2014 , pp. 515-519 More about this Journal
Abstract
The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.
Keywords
Fe-Ni Invar alloy; electroplate and annealing; grain size; coefficient of thermal expansion; TEM analysis;
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