Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2003.04a
- /
- Pages.1315-1320
- /
- 2003
Evaluation of Temperature-dependency of CTE of Materials for MEMS Using ESPI
ESPI를 이용한 MEMS용 소재의 열팽창 계수 온도 의존성 평가
Abstract
The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of