1 |
Y. Zoo, D. Adams, J. W. Mayer, and T. L. Alford, Thin Solid Films 513, 170 (2006).
DOI
ScienceOn
|
2 |
Youngman Kim and Sung-Ho Choo, Thin Solid Films 394, 284 (2001).
|
3 |
Jae Wook Shin and Eric Chason, Phys. Rev. Lett. 103, 056102 (2009).
DOI
ScienceOn
|
4 |
R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz, J. Mater. Res. 15, 2468 (2000).
DOI
ScienceOn
|
5 |
F. Spaepen, Acta Mater. 48, 31 (2000).
DOI
ScienceOn
|
6 |
C. V. Thompson and R. Carel, J. Mech. Phys. Solids 44(5-6), 657-673 (1996).
DOI
|
7 |
M. Cho, S. Hwang, S. Ryu, and Y. Kim, J. Kor. Inst. Met. & Mater. 47, 466 (2009).
|
8 |
M. M. de Lima, Jr., R. G. Lacerda, J. Vilcarromero, and F. C. Marques, J. Appl. Phys. 86, 4936 (1999).
DOI
|
9 |
A. Mezin, Sulf. Coat. Tech. 200, 5259 (2006).
DOI
ScienceOn
|
10 |
Naoki Ono, Kounosuke Kitamura, Ken Nakajima, and Yasushi Shimanuki, Jpn. J. Appl. Phys. 39, 368 (2000).
DOI
|
11 |
W. D. Callister, Jr., Materials Science and Engineering an Introduction, seventh ed., John Wiley & Sons (2007).
|
12 |
M. Ohring, Materials Science of Thin Films, second ed., Academic Press (2002).
|
13 |
G. D. Barrera, J. A. O'Bruno, T. H. K. Barron, and N. L. Allan, J. Phys.:Condens. Matter 17, R217-R252 (2005).
DOI
ScienceOn
|
14 |
S. H. Hong, K. S. Kim, Y.-M. Kim, J.-H. Hahn, C.-S. Lee, and J.-H. Park, Compos. Sci. Technol 65, 1401 (2005).
DOI
ScienceOn
|
15 |
X. Deng, M. Koopman, N. Chawla, and K. K. Chawla, Mater. Sci. Eng. A364, 240 (2004).
|