• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.367-373
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• 2014

In this study, the reducing agent hydrazine and precipitator NaOH were used with $NiCl_2$ as a starting material in order to compound Ni-based material with spherical nano characteristics; resulting material was used as an anode for SOFC. Synthetic temperature, pH, and solvent amounts were experimentally optimized and the synthesis conditions were confirmed. Also, a 0 ~ 0.15 mole ratio of metal(Co, Fe) was alloyed in order to increase the catalyst activation performance of Ni and finally, spherical nano $Ni_{(1-x)}-M_{(x=0{\sim}0.15)}$(M = Co, Fe) alloy materials were compounded. In order to evaluate the catalyst activation for hydrocarbon fuel, fuel gas(10%/$CH_4$+10%/Air) was added and the responding gas was analyzed with GC(Gas Chromatography). Catalyst activation improvement was confirmed from the 3% hydrogen selectivity and 2.4% methane conversion rate in $Ni_{0.95}-Co_{0.05}$ alloy; those values were 4.4% and 19%, respectively, in $Ni_{0.95}-Fe_{0.05}$ alloy.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.1
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• pp.1-19
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• 2003

The surface of metals should be as smooth as possible for optimum comfort, oral hygiene, low plaque retention, and resistance to corrosion. In this study five specimens of each precious metal(type III gold alloy, ceramic gold alloy, and Ag-Pd alloy) were divided into five groups according to finishing and polishing procedures : group 1(sandblaster), group 2(group 1+stone), group 3(group 2+brown rubber), group 4(group 3+green rubber), and group 5(group 4+rouge). Six specimens of each non-precious metal(Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy) were divided into six groups: group 1(sandblaster), group 2(group 1+hard stone), group 3(group 2+electrolytic polisher), group 4(group 3+brown hard rubber point), group 5(group 4+green hard rubber point), and group 6(group 5+rouge). Considering factors affecting the rate of abrasion, the same dentist applied each finishing and polishing procedure. In addition, the surface roughness of enamel, resin, and porcelain was evaluated. The effect of finishing and polishing procedures on surface roughness of precious and non-precious metals, enamel, resin, and porcelain was evaluated by means of Atomic Force Microscope(AutoProbe CP. Park Scientific Instruments, U.S.A.) that can image the three dimensional surface profile and measure average surface roughness values of each sample at the same time. The obtained results were as follows : 1. According to finishing and polishing procedures, the surface roughness of type III gold alloy, ceramic gold alloy, and Ag-Pd alloy was decreased in the order of group 1, 2, 3, 4, and 5 (P<0.01). 2. According to finishing and polishing procedures. the surface roughness of Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy was decreased in the order of group 1, 2, 3, 4, 5, and 6 (p<0.01). 3. There was not statistically significant difference in the surface roughness among three metals of precious metals in group 1 but was significant difference in group 2, 3, 4, and 5 (P<0.05). 4. There was not statistically significant difference in the surface roughness among three metals of non-precious metals in all groups. 5. When the surface roughness of the smoothest surface of each metal, enamel. porcelain, and resin was compared, porcelain was the smoothest and the surface roughness was decreased in the order of Ni-Cr alloy. Co-Cr alloy. Co-Cr-Ti alloy, resin. Ag-Pd alloy, ceramic gold alloy type III gold alloy, and enamel (P<0.01). The results of this study indicate that the finishing and polishing procedures should be carried out in a logical, systematic sequence of steps and the harder non-precious metals may be less resistance to abrasion than are the softer precious metals.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.4
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• pp.392-397
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• 2007

We developed a microfluidic platform able to control the trap and release of magnetic beads used for separation of a specific biomolecules. The magnetic beads can be trapped and released conditionally by controlling the difference between the Stokes force induced by the fluid flow and magnetic force resulting from a permanent magnet. The permanent magnet of CoNiP alloy is electroplated. It is characterized to have the 1369 Oe of coercivity, 1762 Gauss of remanence, and 0.603MGOe of (BH)max. Through the experimental and numerical investigation, the magnetic beads are trapped under the flow velocity of 17 ${\mu}m/s$ and are released perfectly above the velocity of 174 ${\mu}m/s$.

• Journal of the Korean Magnetics Society
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• v.17 no.5
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• pp.194-197
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• 2007

Understanding the spin polarization (P) has been an ongoing research challenge. The $Co_{1-x}Mn_x$ (x=0.27, 1) and $Co_{1-x}Fe_x$ (x=0, 0.5, 1) films were prepared using UHV-MBE system. For these films, the magnetic properties and spin polarization were investigated using SQUID and Meservey-Tedrow technique, respectively. Although measured P is uncorrelated to the bulk magnetic moment (M) in Co-Fe and Ni-Fe alloy films, it correlates with M in some alloys such as Co-Mn and Ni-Cu. The results can be understood by the tunneling currents made up of the hybridized sp-d electrons near the Fermi-energy level. Our work shows the feasibility to tailor new materials with large P values.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.3
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• pp.177-182
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• 2005

The steady state cyclic mechanism, and the behaviour of Nicoseal(Fe-29Ni-17Co) have been examined under the condition of square wave stress cyclic tension creep test at the temperature, stress and frequency range of $430{\sim}470^{\circ}C$($0.41{\sim}0.43T_m$), 353~383 MPa, and 3 cpm, respectively. Also, the relationship between cyclic creep and static creep have been examined. The stress exponents(n) for the static creep deformation of this alloy were 11.6, 10.0, 8.4 and 7.9 at the temperature of 430, 445, 460 and $470^{\circ}C$, respectively. The apparent activation energies (Q) for the static creep deformation were 54.2, 51.8, 49.7 and 46.8 kcal/mole for the stress of 353, 363, 373 and 383 MPa, From the above results, it could be considered that the cyclic creep accelaration phenomena was obtained and that the cyclic deformation for Nicoseal seemed to be controlled by dislocation climb over the range of experimental conditions. Nicoseal alloy under the cyclic creep conditions was obtained as P=(T+460)(logt+17). The failure plane observed by SEM showed up transgranular fracture at all range.

• Clean Technology
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• v.20 no.2
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• pp.136-140
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• 2014

The quaternary alloy (Co/Ni/P/Mn) coatings were prepared using electroless plating on the polypropylene. Compositions of the quaternary alloys (Co/Ni/P/Mn) were controlled by the amount of agents. The composition by EDS, morphology with SEM, film thickness, and surface electrical resistance of the samples were measured. Higher phosphorous content samples give larger electric resistance, thus a relationship is admitted between P content and electric resistance. The corrosivity of the coatings were evaluated by electrochemical methods in the 3.5 wt% NaCl and 5.0 wt% $H_2SO_4$ solutions, respectively. It was concluded that phosphorous addition enhances resistivity in the corrosion.

• Journal of dental hygiene science
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• v.4 no.3
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• pp.103-109
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• 2004

The present study prepared 72 test samples - 24 made of amalgam alloy, 24 of Verabond (Ni-Cr alloy) for crown and 24 of Talladium $^{TM}alloy$ for denture - according to the manufacturers' manuals and general method in consideration of the width of the mesial-distal dental crown of the lower $1^{st}$ molar and MOD cavity in clinics, put them in a 200 ml beaker containing 80 ml of artificial saliva, and measured their galvanic corrosion at distances of 0 mm, 7 mm and 40 mm after 7 days. Isolated metals in the electrolyte such as Cu, Ag, Ni, Cr, Sn, Zn and Hg were quantitatively analyzed with Inductively Coupled Plasma - Atomic Emission Spectrometer (ICP-AES, JY-50P, VG Elemental Co. France), and from the results were drawn conclusions as follows. First, Cu, Sn, Ag, Hg and Zn were highly advantageous when amalgam contacted gold alloy compared to Ni-Cr alloy for crown and Talladium alloy for denture. In addition, although gold alloy was finest in terms of oral tissue and biocompatibility, it was most disadvantageous when it was with amalgam. Second, when amalgam contacted gold alloy, heavy metals such as Ni and Cr were not isolated at all because gold alloy did not contain such elements but Sn was isolated as much as $227.1{\pm}18.0035{\mu}g/cm^2$ although it was not included in the composition either. Hg was also isolated. These elements are assumed to have been isolated from amalgam itself. Third, when amalgam alloy was apart from gold alloy 0 mm, 7 mm and 40 mm, Cu and Ag showed significance but Hg did not. This suggests that gold alloy must not be used together with amalgam, and must not be used between dissimilar prostheses regardless of distance. Fourth, when amalgam alloy contacted Ni-Cr alloy for crown, Ag was not isolated from the amalgam, but Zn, Ni, Sn, Hg and Cu were isolated in order of quantity. Significance was observed according to distance - 0 mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Ni-Cr alloy for crown, the isolation Hg was less than that when amalgam alloy contacted Ni-Cr alloy for crown. Fifth, when amalgam alloy contacted Talladium alloy for denture, significance was observed at distances of 0mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Talladium alloy for denture, the isolation Hg was less than that when amalgam alloy contacted Talladium alloy for denture. Sixth, according to the result of ICPES test on Cu, Sn, Ag, Hg, Zn, Ni and Cr of amalgam alloy, gold ally, Verabond and Talladium alloy when these alloys contacted artificial saliva, significance was observed in Cu and Hg. Seventh, when amalgam alloy contracted two non-precious metals Ni-Cr alloy for crown and Talladium alloy for denture in artificial saliva, significance was observed in the isolated by-products of Hg, Ni and Cr according to distance.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.769-774
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• 2004

15 nm-Co/15 nm-Ni/P-Si(100)[Type I] and 15 nm-Ni/15 nm-Co/P-Si(100)(Type II) bilayer structures were annealed using a rapid thermal annealer for 40sec at $700/sim1100^{\circ}C$. The annealed bilayer structures developed into composite NiCo silicides and resulting changes in sheet resistance, composition and microstructure were investigated using Auger electron spectroscopy and transmission electron microscopy. Prepared NiCoSix films were further treated in a sequential annealing set up from $900\sim1100^{\circ}C$ with 30 minutes. The sheet resistances of NiCoSix from Type I maintained less than $7\;{\Omega}/sq$. even at the temperature of $1100{\circ}C$, while those of Type II showed about $5\;{\Omega}/sq$. with the thinner and more uniform thickness. With the additive post annealing, the sheet resistance for all the composite silicides remained small up to $900^{\circ}C$. The proposed NiCoSix films were superior over the conventional single-phased silicides and may be easily incorporated into the sub-0.1 ${\mu}m$ process.

• Transactions on Electrical and Electronic Materials
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• v.9 no.2
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• Journal of the Korean institute of surface engineering
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• v.55 no.5
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.