• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.455-460
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of PTFE on corrosion behavior of Cr-P plating, low carbon steel substrates are electroplated in Cr(III) baths without and with PTFE. Trivalent chromium carbon plating was electroplated from trivalent chromium sulfate-based baths with different PTFE dispersion contents. The study focused on the microstructure, PTFE content, roughness, and corrosion resistance of the Cr-P-PTFE composite plating. Scanning electron microscopy and atomic force microscopy images showed a smoother plating and a decrease in the surface roughness of the electrodeposited. The results demonstrate that PTFE eliminates the cracks within plating by reducing internal stress. Therefore, the corrosion resistance of Cr-P-PTFE composite platings were better than that of Cr-P alloy platings.

• 한국분말재료학회지
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• 제26권6호
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• pp.471-476
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• 2019

Additively manufactured metallic components contain high surface roughness values, which lead to unsatisfactory high cycle fatigue resistance. In this study, high cycle fatigue properties of selective laser melted Ti-6Al-4V alloy are investigated and the effect of dry-electropolishing, which does not cause weight loss, on the fatigue resistance is also examined. To reduce the internal defect in the as-built Ti-6Al-4V, first, hot isostatic pressing (HIP) is conducted. Then, to improve the mechanical properties, solution treatment and aging are also implemented. Selective laser melting (SLM)-built Ti64 shows a primary α and secondary α+β lamellar structure. The sizes of secondary α and β are approximately 2 ㎛ and 100 nm, respectively. On the other hand, surface roughness Ra values of before and after dry-electropolishing are 6.21 ㎛ and 3.15 ㎛, respectively. This means that dry-electropolishing is effective in decreasing the surface roughness of selective laser melted Ti-6Al-4V alloy. The comparison of high cycle fatigue properties between before and after dry-electropolished samples shows that reduced surface roughness improves the fatigue limit from 150 MPa to 170 MPa. Correlations between surface roughness and high cycle fatigue properties are also discussed based on these findings.

• 한국재료학회지
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• 제25권6호
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• pp.269-273
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• 2015

The effect of adding Ca on the microstructural and mechanical properties of as-cast Mg-11Li-3Zn-1Sn(wt%) alloys were investigated. Mg-11Li-3Zn-1Sn-0.4Mn with different Ca additions (0.4, 0.8, 1.2 wt%) were cast under an $SF_6$ and $Co_2$ atmosphere at $720^{\circ}C$. The cast billets were homogenized at $400^{\circ}C$ for 12h and extruded at $200^{\circ}C$. The microstructural and mechanical properties were analyzed by OM, XRD, SEM, and tensile tests. The addition of Ca to the Mg-11Li-3Zn-1Sn-0.4Mn alloy resulted in the formation of $Ca_2Mg_6Zn_3$, MgSnCa intermetallic compound. By increasing Ca addition, the volume fraction and size of $Ca_2Mg_6Zn_3$ with needle shape were increased. This $Ca_2Mg_6Zn_3$ intermetallic compound was elongated to the extrusion direction and refined to fine particles due to severe deformation during hot extrusion. The elongation of the 0.8 wt% Ca containing alloy improved remarkably without reduction strength due to the formation of fine grain and $Ca_2Mg_6Zn_3$ intermetallic compounds by Ca addition. It is probable that fine and homogeneous $Ca_2Mg_6Zn_3$ intermetallic compounds played a significant role in the increase of mechanical properties.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.391-394
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• 2004

In this study, highly thermal stable Ni Germanosilicide has been utilized using NiPt alloy and novel NiPt/Co/TiN tri-layer. And, the Ni Germanosilicide Properties were characterized according to different Ge ratio (x) in $Si_{l-x}Ge_x$ for the next generation CMOS application. The sheet resistance of Ni Germanosilicide utilizing pure-Ni increased dramatically after the post-silicidation annealing at $600^{\circ}C$ for 30 min. Moreover, more degradation was found as the Ge fraction increases. However, using the proposed NiPt/Co/TiN tri-layer, low temperature silicidation and wide range of RTP process window were achieved as well as the improvement of the thermal stability according to different Ge fractions by the subsequent Co and TiN capping layer above NiPt on the $Si_{l-x}Ge_x$. Therefore, highly thermal immune Ni Germanosilicide up to $600^{\circ}C$ for 30 min is utilized using the NiPt/Co/TiN tri-layer promising for future SiGe based ULSI technology.

• 항공우주시스템공학회지
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• 제18권1호
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• pp.1-10
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• 2024

선행연구에서는 위성체의 고기동 시 전개형 태양전지판으로부터 발생하는 잔여진동을 저감시키기 위해 초탄성 형상기억합금 (Shape Memory Alloy, SMA)을 적용한 적층형 태양전지판 요크를 제안하였다. 요크에는 SMA 양면에 구속층을 적층시키기 위해 점탄성 테이프가 적용되며, 점탄성 테이프는 온도 의존성이 높아 온도에 따라 댐핑 특성 변화로 요크의 진동저감 성능에 직접적인 영향을 미친다. 이에 따라, 온도별 요크의 댐핑 성능을 확인하기 위해 다양한 온도조건에서 자유감쇠시험을 수행하여 댐핑 성능이 가장 극대화되는 온도 구간을 식별하였다. 본 논문에서는 상기 온도시험 결과를 토대로, 요크가 궤도 열환경에 노출되더라도 효과적인 댐핑 성능을 유지할 수 있도록 궤도 열해석을 통해 요크의 열적 거동 및 온도를 예측하였으며, 요크가 최적의 진동저감 성능을 낼 수 있도록 열 설계안 도출 방안에 관해 기술하였다.

• 한국주조공학회지
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• 제42권1호
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• pp.3-11
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• 2022

본 연구에서는 전산모사를 활용하여 오스테나이트계 내열강인 HR3C 합금의 수축 결함 파라미터를 확보하고, 건전부 85% 이상의 잉곳 몰드 설계 및 제작을 진행하였다. 잉곳 몰드 설계 단계에서 전산모사를 활용하여 최적의 잉곳 몰드를 설계 및 제작하였으며, 제작한 잉곳 몰드를 통해 시험조업을 수행하였다. 시험조업 후, 절단 및 비파괴 검사를 통해 결함 양상을 분석하여 수축 결함 파라미터와 잉곳 몰드 설계를 검증하였다. 검증 결과를 기반으로 HR3C 합금의 수축 결함 파라미터 (Niyama 인자, 급탕효율인자, 열간 균열 인자 등)를 확보하였으며, 확보한 파라미터를 통해 건전부 85% 이상의 잉곳 몰드 설계 방안을 확보하였다.

• 한국수소및신에너지학회논문집
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• 제9권4호
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• pp.169-176
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• 1998

Ni/MH 2차전지의 음극용 금속간화합물전극의 부식특성에 미치는 합금원소와 결합제의 영향을 조사하였다. 전극의 재료는 $(LM)Ni_{4.49}Co_{0.1}Mn_{0.205}Al_{0.205}$와 $(LM)Ni_{3.6}Co_{0.7}Mn_{0.3}Al_{0.4}$의 $AB_5$ type합금을 모재로 하였다. 여기에 Si sealant 또는 PTFE를 결합제로 첨가한 것과 원재료 분말에 구리를 20% 무전해도금한 것을 냉간 압착하여 전극을 제조하였다. 부식특성을 조사하기위해 탈공기된 6M의 KOH 용액에서 동전위법과 순환전위법을 이용하여 부식전류와 전류밀도를 측정하였다. 모재에 Co가 많이 함유되면 전극의 내식성을 향상시키고 Ni이 많이 함유되면 충전과 방전을 반복하는 동안에 전극의 안정성을 저하시켰다. 부식전류밀도는 Si sealant를 결합제로 사용한 전극의 경우가 PTFE를 사용한 전극의 경우보다 낮았고 Cu가 도금된 전극은 내식성에서 가장 우수하게 나타났다.

• Design & Manufacturing
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• 제17권4호
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• pp.63-71
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• 2023

In order to increase the extrusion production speed of aluminum, extrusion die cooling technology using liquid nitrogen has recently attracted a lot of attention. Increasing the extrusion speed increases the temperature of the bearing area of extrusion dies and the extrusion profile, which may cause defects on the surface of extruded profile. Extrusion die cooling technology is to directly inject liquid nitrogen through a cooling channel formed between the die and the backer inside the die-set. The liquid nitrogen removes heat from the die-set, and gaseous nitrogen at the exit of the channel, covers the extrusion profile of an inert atmosphere reducing the oxidation and the profile temperature. The aim of this study is to evaluate the cooling capacity by applying die cooling to extrusion of Al-Mn-based aluminum alloy flat tubes, and to investigate the effects of die cooling on the change in extrusion characteristics of flat tubes. Cooling capacity was confirmed by observing the temperature change of the extrusion profile depending on whether or not die cooling is applied. To observe changes in material characteristics due to die cooling, surface observation is conducted and microstructure and precipitate analysis are performed by FE-SEM on the surface and longitudinal cross section of the extruded flat tubes.

• 방사성폐기물학회지
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• 제17권1호
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• pp.15-28
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• 2019

고리 1호기는 원전해체 계획에 따라 영구정지 이후 가능한 한 빠른 시일 내에 원자로냉각재계통의 화학제염을 수행할 계획으로, 계통제염 기술 확보를 위해 한수원에서는 2014년부터 '원전 해체설계를 위한 냉각재계통 및 기기제염 상용기술개발' 연구과제를 통해 화학제염기술을 개발하고 있다. 본 연구를 위해 Lab. 규모 계통제염 공정장치를 제작하였으며, 계통제염 대상의 주요재료인 STS304, 316, 410, Alloy600, SA508을 사용하여 화학제염 공정실험을 수행하였다. 화학제염 공정실험의 목적은 산화-환원공정의 최적시간, 최적제염제 및 공정횟수를 도출하기 위함이다. 화학제염 공정실험은 과망간산-옥살산 기반의 단위공정 및 연속공정 실험, 과망간산+질산-옥살산 기반의 연속공정 실험으로 나누어 수행하였다. 그 결과 단위공정실험을 통해 최적공정 시간인 산화공정 5시간, 환원공정 4시간을 도출하였으며, 연속공정실험을 통해 최적제염제와 공정횟수를 도출하였다. 최적제염제는 산화제의 경우 $200mg{\cdot}L^{-1}$ 과망간산 + $200mg{\cdot}L^{-1}$ 질산이고, 환원제는 $2000mg{\cdot}L^{-1}$ 옥살산이며, 공정횟수는 STS304와 SA508의 경우 2 cycle, Alloy600의 경우 3 cycle 이상 수행하는 것이 적절할 것으로 평가되었다.